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公开(公告)号：US09275930B2
公开(公告)日：2016-03-01
申请号：US13242202
申请日：2011-09-23
申请人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
发明人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
IPC分类号： H05K7/00 , H01L23/433 , H01L21/56 , H01L23/31 , H01L23/495 , H01L25/07 , H01L23/00
CPC分类号： H02M7/537 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L23/4334 , H01L23/49531 , H01L23/49541 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/072 , H01L25/18 , H01L25/50 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/20753 , H05K1/0203 , H05K1/181 , Y10T29/4916 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00012
摘要： In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
摘要翻译： 在本发明的混合集成电路装置中，引线固定在电路板的上表面上。 引线包括岛部分，斜坡部分和引线部分。 晶体管和二极管安装在岛部的上表面上。 设置在晶体管和二极管的上表面上的电极通过细金属线连接到接合部分。 引线的接合部分设置在比岛部更高的位置。 因此，与接合部连接的细金属线彼此分离。
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公开(公告)号：US20120074552A1
公开(公告)日：2012-03-29
申请号：US13240870
申请日：2011-09-22
申请人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
发明人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/49531 , H01L21/565 , H01L23/4334 , H01L23/49541 , H01L23/49551 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L25/162 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48096 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2224/48095 , H01L2224/85399 , H01L2224/05599
摘要： In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.
摘要翻译： 在混合集成电路装置中，以重叠的方式配置其上固定安装引线的岛部的电路板和安装有控制元件等的控制基板。 电路板和控制板与封装树脂一体封装。 设置在电路板的上表面上的晶体管和安装在控制板的上表面上的控制元件也被封装树脂覆盖。 因此，提供了其中逆变器电路和控制电路与树脂一体封装的模块。
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公开(公告)号：US20120075816A1
公开(公告)日：2012-03-29
申请号：US13242202
申请日：2011-09-23
申请人： Shigeki MASHIMO , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
发明人： Shigeki MASHIMO , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
CPC分类号： H02M7/537 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/293 , H01L23/3121 , H01L23/4334 , H01L23/49531 , H01L23/49541 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/85 , H01L25/072 , H01L25/18 , H01L25/50 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/20753 , H05K1/0203 , H05K1/181 , Y10T29/4916 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00012
摘要： In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
摘要翻译： 在本发明的混合集成电路装置中，引线固定在电路板的上表面上。 引线包括岛部分，斜坡部分和引线部分。 晶体管和二极管安装在岛部的上表面上。 设置在晶体管和二极管的上表面上的电极通过细金属线连接到接合部分。 引线的接合部分设置在比岛部更高的位置。 因此，与接合部连接的细金属线彼此分离。
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4.发明授权公开(公告)号：US08450837B2
公开(公告)日：2013-05-28
申请号：US13240870
申请日：2011-09-22
申请人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
发明人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
IPC分类号： H01L23/495 , H01L23/60
CPC分类号： H01L23/49531 , H01L21/565 , H01L23/4334 , H01L23/49541 , H01L23/49551 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L25/162 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48096 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00 , H01L2924/00012 , H01L2224/48095 , H01L2224/85399 , H01L2224/05599
摘要： In a hybrid integrated circuit device, a circuit board on which an island portion of a lead is fixedly attached and a control board on which a control element and the like are mounted are disposed in an overlapping manner. The circuit board and the control board are integrally encapsulated with an encapsulating resin. A transistor disposed on an upper surface of the circuit board and a control element mounted on an upper surface of the control board are also covered by the encapsulating resin. Thus, a module in which an inverter circuit and a control circuit are integrally encapsulated with resin is provided.
摘要翻译： 在混合集成电路装置中，以重叠的方式配置其上固定安装引线的岛部的电路板和安装有控制元件等的控制基板。 电路板和控制板与封装树脂一体封装。 设置在电路板的上表面上的晶体管和安装在控制板的上表面上的控制元件也被封装树脂覆盖。 因此，提供了其中逆变器电路和控制电路与树脂一体封装的模块。
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