公开(公告)号：US20060145171A1

公开(公告)日：2006-07-06

申请号：US11371873

申请日：2006-03-08

申请人： Koichi Nitta ,  Takafumi Nakamura ,  Kuniaki Konno ,  Yasuhiko Akaike ,  Yoshiki Endo ,  Katsufumi Kondo

发明人： Koichi Nitta ,  Takafumi Nakamura ,  Kuniaki Konno ,  Yasuhiko Akaike ,  Yoshiki Endo ,  Katsufumi Kondo

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L33/22 ,  H01L33/38 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/00014 ,  H01L2924/00

摘要： For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface. The third side surfaces incline to diverge toward the top surface, and the second side surfaces incline to diverge more toward the top surface to extract part of the light from the light emitting layer externally. The first side surfaces are formed by cleavage along cleavable planes.

公开(公告)号：USD521952S1

公开(公告)日：2006-05-30

申请号：US29206163

申请日：2004-05-27

申请人： Tatsuya Yamada ,  Kazuhiko Kurahashi ,  Toshihisa Inoue ,  Taizo Tomioka ,  Kazuo Shimokawa ,  Yoshiki Endo ,  Masahiro Urase ,  Osamu Usuda

设计人： Tatsuya Yamada ,  Kazuhiko Kurahashi ,  Toshihisa Inoue ,  Taizo Tomioka ,  Kazuo Shimokawa ,  Yoshiki Endo ,  Masahiro Urase ,  Osamu Usuda

公开(公告)号：US06548890B2

公开(公告)日：2003-04-15

申请号：US10051001

申请日：2002-01-22

申请人： Eitaro Miyake ,  Yoshiki Endo ,  Ichiro Omura ,  Tomokazu Domon

发明人： Eitaro Miyake ,  Yoshiki Endo ,  Ichiro Omura ,  Tomokazu Domon

IPC分类号： H01L2348

CPC分类号： H01L23/051 ,  H01L24/90 ,  H01L25/072 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00

摘要： A press-contact type semiconductor device comprises: a plurality of semiconductor elements each of which has a first main electrode and a control electrode and a second main electrode; a second common main power source plate having the semiconductor elements positioned on a front surface thereof and electrically connected to the second main electrodes; a first common main power source plate arranged on the front surfaces of the semiconductor elements and electrically connected to the first main electrodes; a common control signal/main current plate arranged between semiconductor elements and including at least control signal wiring layers and main current wiring layers; conductive connectors for electrically connecting at least the main current wiring layers and the first common maim power source plate; and conductive elastic members for electrically connecting the main current wiring layers or the first common main power source plate to the conductive connectors by elasticity.

摘要翻译： 压触式半导体器件包括：多个半导体元件，每个半导体元件具有第一主电极和控制电极以及第二主电极; 第二公共主电源板，其半导体元件位于其前表面上并电连接到第二主电极; 第一公共主电源板，布置在半导体元件的前表面上并电连接到第一主电极; 布置在半导体元件之间并且至少包括控制信号布线层和主电流布线层的公共控制信号/主电流板; 导电连接器，用于至少电连接主电流布线层和第一公共电源电源板; 以及用于通过弹性将主电流布线层或第一公共主电源板电连接到导电连接器的导电弹性构件。

公开(公告)号：US20060055432A1

公开(公告)日：2006-03-16

申请号：US11214730

申请日：2005-08-31

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H03D13/00

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

公开(公告)号：USD508682S1

公开(公告)日：2005-08-23

申请号：US29206162

申请日：2004-05-27

申请人： Tatsuya Yamada ,  Kazuhiko Kurahashi ,  Toshihisa Inoue ,  Taizo Tomioka ,  Kazuo Shimokawa ,  Yoshiki Endo ,  Masahiro Urase ,  Osamu Usuda

设计人： Tatsuya Yamada ,  Kazuhiko Kurahashi ,  Toshihisa Inoue ,  Taizo Tomioka ,  Kazuo Shimokawa ,  Yoshiki Endo ,  Masahiro Urase ,  Osamu Usuda

公开(公告)号：US09175583B2

公开(公告)日：2015-11-03

申请号：US13979889

申请日：2011-01-20

申请人： Toshio Imamura ,  Yoshiaki Miyazato ,  Yuu Yokoyama ,  Masaki Numakura ,  Yoshiki Endo

发明人： Toshio Imamura ,  Yoshiaki Miyazato ,  Yuu Yokoyama ,  Masaki Numakura ,  Yoshiki Endo

IPC分类号： F01L1/34 ,  F01L1/344 ,  F02D13/02 ,  F02N11/08 ,  F02N19/00 ,  F02M69/00

CPC分类号： F01L1/3442 ,  F01L1/34 ,  F02D13/02 ,  F02M69/00 ,  F02N11/0848 ,  F02N19/004 ,  Y02T10/18

摘要： When a start-up failure occurs wherein an internal combustion engine equipped with a variable valve device does not transition to complete combustion before a first prescribed period α elapses from the start of cranking in conjunction with fuel injection, a control unit for the internal combustion engine executes a start-up failure process addressing a state wherein the valve timing is different from a specific timing.

摘要翻译： 当发生启动故障时，其中配备有可变阀装置的内燃机在从燃料喷射开始起动开始经过第一规定期间α之前没有转变为完全燃烧，用于内燃机的控制单元 执行启动失败处理，其处理气门正时与特定定时不同的状态。

公开(公告)号：US08554455B2

公开(公告)日：2013-10-08

申请号：US13262871

申请日：2010-08-25

申请人： Yoshiaki Miyazato ,  Toshio Imamura ,  Yuu Yokoyama ,  Satoshi Yoshi ,  Yoshiki Endo ,  Yuu Ueda ,  Hiroyuki Ishii

发明人： Yoshiaki Miyazato ,  Toshio Imamura ,  Yuu Yokoyama ,  Satoshi Yoshi ,  Yoshiki Endo ,  Yuu Ueda ,  Hiroyuki Ishii

IPC分类号： F01L1/344 ,  F02D13/02

CPC分类号： F01L1/344 ,  F01L1/3442 ,  F01L2001/34463 ,  F01L2800/03 ,  F01L2800/11 ,  F01L2800/12 ,  F02D41/22 ,  F02N11/0825 ,  F02N2200/023 ,  F02N2200/0802 ,  F02N2200/101 ,  Y02T10/48

摘要： An IIS system that performs control related to intermittent stopping of engine operation by idling stop control is applied to an internal combustion engine including a VVT mechanism that makes the valve timing of an engine valve variable and has an intermediate lock mechanism that mechanically locks the valve timing at an intermediate lock position between a most retarded position and a most advanced position. The IIS system is configured to inhibit the engine operation from being intermittently stopped at the occurrence of a failure of the VVT mechanism to avoid the internal combustion engine from being prevented from being restarted after the intermittent stop depending on the occurrence of the failure of the VVT mechanism.

摘要翻译： 通过怠速停止控制来进行与间歇停止发动机运转有关的控制的IIS系统被应用到内燃机，该内燃机包括使发动机气门的气门正时可变的VVT机构，并具有机械地锁定气门正时的中间锁定机构 在最延迟位置和最高位置之间的中间锁定位置。 IIS系统被配置为在VVT机构发生故障的情况下禁止发动机操作被间歇地停止，以避免根据VVT的故障的发生而在间歇停止后防止内燃机被重新启动 机制。

公开(公告)号：US20130152887A1

公开(公告)日：2013-06-20

申请号：US13262871

申请日：2010-08-25

申请人： Yoshiaki Miyazato ,  Toshio Imamura ,  Yuu Yokoyama ,  Satoshi Yoshi ,  Yoshiki Endo ,  Yuu Ueda ,  Hiroyuki Ishii

发明人： Yoshiaki Miyazato ,  Toshio Imamura ,  Yuu Yokoyama ,  Satoshi Yoshi ,  Yoshiki Endo ,  Yuu Ueda ,  Hiroyuki Ishii

IPC分类号： F01L1/344

CPC分类号： F01L1/344 ,  F01L1/3442 ,  F01L2001/34463 ,  F01L2800/03 ,  F01L2800/11 ,  F01L2800/12 ,  F02D41/22 ,  F02N11/0825 ,  F02N2200/023 ,  F02N2200/0802 ,  F02N2200/101 ,  Y02T10/48

摘要： An IIS system that performs control related to intermittent stopping of engine operation by idling stop control is applied to an internal combustion engine including a VVT mechanism that makes the valve timing of an engine valve variable and has an intermediate lock mechanism that mechanically locks the valve timing at an intermediate lock position between a most retarded position and a most advanced position. The IIS system is configured to inhibit the engine operation from being intermittently stopped at the occurrence of a failure of the VVT mechanism to avoid the internal combustion engine from being prevented from being restarted after the intermittent stop depending on the occurrence of the failure of the VVT mechanism.

摘要翻译： 通过怠速停止控制来进行与间歇停止发动机运转有关的控制的IIS系统被应用到内燃机，该内燃机包括使发动机气门的气门正时可变的VVT机构，并具有机械地锁定气门正时的中间锁定机构 在最延迟位置和最高位置之间的中间锁定位置。 IIS系统被配置为在VVT机构发生故障的情况下禁止发动机操作被间歇地停止，以避免根据VVT的故障的发生而在间歇停止后防止内燃机被重新启动 机制。

公开(公告)号：US07633153B2

公开(公告)日：2009-12-15

申请号：US11778516

申请日：2007-07-16

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H01L23/10

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

摘要翻译： 半导体模块包括安装板。 多个电源开关器件芯片通过倒装芯片接合安装在安装板上。 芯片具有上表面和下表面，并且被配置为面向安装板的上表面。 通过倒装芯片接合将驱动IC芯片安装在安装板上。 驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。 多个散热构件分别位于多个功率开关器件芯片的下表面上。 提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

公开(公告)号：US07038245B2

公开(公告)日：2006-05-02

申请号：US10388376

申请日：2003-03-13

申请人： Koichi Nitta ,  Takafumi Nakamura ,  Kuniaki Konno ,  Yasuhiko Akaike ,  Yoshiki Endo ,  Katsufumi Kondo

发明人： Koichi Nitta ,  Takafumi Nakamura ,  Kuniaki Konno ,  Yasuhiko Akaike ,  Yoshiki Endo ,  Katsufumi Kondo

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L33/20 ,  H01L33/22 ,  H01L33/38 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/00014 ,  H01L2924/00

摘要： For the purpose of enhancing the light extracting efficiency, improving the production yield and elongating the lifetime of a semiconductor light emitting element or a semiconductor light emitting device using the element, a semiconductor light emitting element comprises: a light emitting layer that emits light; and a substrate transparent to the light emitted from the light emitting layer. The substrate defines a top surface supporting the light emitting layer thereon; a bottom surface opposed to the top surface and side surfaces connecting the top surface and the bottom surface. Each of the side surfaces is composed of first side surface extending from the top surface toward the bottom surface, second side surface extending from the first side surface toward the bottom surface, and third side surface extending from the second side surface toward the bottom surface. The third side surfaces incline to diverge toward the top surface, and the second side surfaces incline to diverge more toward the top surface to extract part of the light from the light emitting layer externally. The first side surfaces are formed by cleavage along cleavable planes.

摘要翻译： 为了提高光提取效率，提高使用该元素的半导体发光元件或半导体发光元件的制造成品率和延长寿命，半导体发光元件包括：发光的发光层; 以及对从发光层发射的光透明的衬底。 衬底限定了在其上支撑发光层的顶表面; 与上表面相对的底表面和连接顶表面和底表面的侧表面。 每个侧表面由从顶表面向底表面延伸的第一侧表面，从第一侧表面向底表面延伸的第二侧表面和从第二侧表面向底表面延伸的第三侧表面组成。 第三侧表面向顶表面倾斜，并且第二侧表面倾斜向顶表面倾斜，以从外部从发光层提取部分光。 第一侧表面通过沿着可切割平面的切割而形成。