Invention Grant
- Patent Title: Semiconductor module
- Patent Title (中): 半导体模块
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Application No.: US11778516Application Date: 2007-07-16
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Publication No.: US07633153B2Publication Date: 2009-12-15
- Inventor: Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
- Applicant: Kazuo Shimokawa , Takashi Koyanagawa , Masako Ooishi , Tatsuya Yamada , Osamu Usuda , Yoshiki Endo , Taiki Miura , Masaki Toyoshima , Ichiro Omura , Akio Nakagawa , Kenichi Matsushita , Yusuke Kawaguchi , Haruki Arai , Hiroshi Takei , Tomohiro Kawano , Noriaki Yoshikawa , Morio Takahashi , Yasuhito Saito , Masahiro Urase
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-253276 20040831
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
Public/Granted literature
- US20070257708A1 SEMICONDUCTOR MODULE Public/Granted day:2007-11-08
Information query
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