摘要:
The method of manufacturing a semiconductor device according to the present invention includes: a groove forming step of forming a groove in an insulating layer made of an insulating material containing Si and O; an alloy film applying step of covering the side surface and the bottom surface of the groove with an alloy film made of an alloy material containing Cu and Mn by sputtering; a thinning step of reducing the thickness of a portion of the alloy film covering the bottom surface of the groove; a wire forming step of forming a Cu wire made of a metallic material mainly composed of Cu in the groove after the thinning step; and a barrier film forming step of forming a barrier film made of MnSiO between the Cu wire and the insulating layer by heat treatment.
摘要:
An exemplary embodiment of an aluminum type plated steel sheet which excels in discoloration resistance, and weldability, which does not decorate after re-heating and which can prevent increasing of strength, and a heat shrink band using the same are provided. For example, the heat shrink band can be made of an aluminum type plated steel sheet consisting of a steel sheet being composed of, e.g., not more than about 0.005 mass % of C; not more than about 0.005 mass % of N; not less than about 0.1 mass % and not more than about 0.5 mass % of Si; not more than about 0.1 mass % of P; not more than about 0.02 mass % of S; not less than about 1.05 mass % and not more than 2.0 mass % of Mn; not more than 1.0 mass % of sol Al; a residual amount of Fe and inevitable impurities, and an aluminum type plated layer mainly consisting of Al being deposited thereon. Such exemplary sheet can be prevented from a discoloration upon, e.g., being re-heated at a temperature of not less than about 500° C. to not more than about 700° C.
摘要:
The invention relates to a high strength hot-dip galvanized and galvannealed steel sheets with excellent drawability for press forming and excellent plating adhesion that is useful as a member for automobiles, construction, electric devices and the like, and to a process for its manufacture. According to an embodiment of the invention, the steel sheet contains in terms of weight percent, C: 0.05-0.2%, Si: 0.2-2.0%, Mn: 0.2-2.5%, Al: 0.01-1.5%, Ni: 0.2-5.0%, P:
摘要翻译:本发明涉及一种可用作汽车,建筑,电气装置等的部件,以及其制造方法的冲压成形拉伸性优异,电镀附着性优异的高强度热浸镀锌和合金化热浸镀锌钢板。 根据本发明的一个实施方案,钢板以重量百分数C:0.05-0.2%,Si:0.2-2.0%,Mn:0.2-2.5%,Al:0.01-1.5%,Ni:0.2- 5.0%,P:<0.03%,S:<0.02%,Si与Al的关系为0.4(%)≤Si+ 0.8Al(%)≤2.0%,余量由Fe和不可避免的杂质 ,残留奥氏体的体积百分比为2-20%,钢板表面层的0.5μm的Ni与Si,Al的关系为Ni(%)≤= Si + 1的钢板表面 / 3Al(%),具有包含Al:≤1%的Zn镀层,其余为Zn和不可避免的杂质。
摘要:
An exemplary embodiment of an aluminum type plated steel sheet which excels in discoloration resistance, and weldability, which does not decorate after re-heating and which can prevent increasing of strength, and a heat shrink band using the same are provided. For example, the heat shrink band can be made of an aluminum type plated steel sheet consisting of a steel sheet being composed of, e.g., not more than about 0.005 mass % of C; not more than about 0.005 mass % of N; not less than about 0.1 mass % and not more than about 0.5 mass % of Si; not more than about 0.1 mass % of P; not more than about 0.02 mass % of S; not less than about 1.05 mass % and not more than 2.0 mass % of Mn; not more than 1.0 mass % of sol Al; a residual amount of Fe and inevitable impurities, and an aluminum type plated layer mainly consisting of Al being deposited thereon. Such exemplary sheet can be prevented from a discoloration upon, e.g., being re-heated at a temperature of not less than about 500° C. to not more than about 700° C.
摘要:
The present invention stably provides a high-strength hot-dip galvanized steel sheet having a high tensile strength and no non-plated portions and being excellent in workability and surface properties even when the employed equipment has only a reduction annealing furnace and a steel sheet containing relatively large amounts of Si, Mn and Al that are regarded as likely to cause non-plated portions is used as the substrate. The present invention: secures good plating performance even when the steel sheet contains Si, Mn and Al by adding Ni to a steel sheet, thus forming oxides at some portions in the steel sheet surface layer, and resultantly suppressing the surface incrassation of Si, Mn and Al at the portions where oxides are not formed; enhances the effect of Ni and accelerates the formation of oxides by further adding Mo, Cu and Sn; and moreover, in the case of a TRIP steel sheet, secures austenite by determining the ranges of Si and Al strictly, avoiding the deterioration of plating performance caused by the addition of Ni, and further adding Mo in a balanced manner.In addition, the present invention, in a TRIP steel sheet, improves press formability by regulating a retained austenite ratio and accelerates the formation of oxides by regulating a hydrogen concentration and a dew point in annealing before plating.
摘要:
The method of manufacturing a semiconductor device according to the present invention includes: a groove forming step of forming a groove in an insulating layer made of an insulating material containing Si and O; an alloy film applying step of covering the side surface and the bottom surface of the groove with an alloy film made of an alloy material containing Cu and Mn by sputtering; a thinning step of reducing the thickness of a portion of the alloy film covering the bottom surface of the groove; a wire forming step of forming a Cu wire made of a metallic material mainly composed of Cu in the groove after the thinning step; and a barrier film forming step of forming a barrier film made of MnSiO between the Cu wire and the insulating layer by heat treatment.
摘要:
A molten zinc plated steel sheet superior in plating bondability and provided with both strength and shapeability is provided and a method of producing this molten zinc plating steel sheet by a continuous zinc plating production system which enables production at a low cost without modification of the system or addition of steps is provided, said molten zinc plated steel sheet characterized by comprising, by wt %, a steel sheet including C: 0.05 to 0.40%, Si: 0.2 to 3.0%, and Mn: 0.1 to 2.5%, the balance comprised of Fe and unavoidable impurities, having on its surface a Zn plating layer containing Al: 0.01 to 1% and the balance of Zn and unavoidable impurities and containing inside the steel sheet within 2 μm from the interface of said plating layer and steel sheet oxide particles of at least one type of oxide selected from an Al oxide, Si oxide, Mn oxide, or complex oxide comprised of at least two of Al, Si, and Mn.
摘要:
The present invention stably provides a high-strength hot-dip galvanized steel sheet having a high tensile strength and no non-plated portions and being excellent in workability and surface properties even when the employed equipment has only a reduction annealing furnace and a steel sheet containing relatively large amounts of Si, Mn and Al that are regarded as likely to cause non-plated portions is used as the substrate. The present invention: secures good plating performance even when the steel sheet contains Si, Mn and Al by adding Ni to a steel sheet, thus forming oxides at some portions in the steel sheet surface layer, and resultantly suppressing the surface incrassation of Si, Mn and Al at the portions where oxides are not formed; enhances the effect of Ni and accelerates the formation of oxides by further adding Mo, Cu and Sn; and moreover, in the case of a TRIP steel sheet, secures austenite by determining the ranges of Si and Al strictly, avoiding the deterioration of plating performance caused by the addition of Ni, and further adding Mo in a balanced manner. In addition, the present invention, in a TRIP steel sheet, improves press formability by regulating a retained austenite ratio and accelerates the formation of oxides by regulating a hydrogen concentration and a dew point in annealing before plating.
摘要:
The present invention stably provides a high-strength hot-dip galvanized steel sheet having a high tensile strength and no non-plated portions and being excellent in workability and surface properties even when the employed equipment has only a reduction annealing furnace and a steel sheet containing relatively large amounts of Si, Mn and Al that are regarded as likely to cause non-plated portions is used as the substrate. The present invention: secures good plating performance even when the steel sheet contains Si, Mn and Al by adding Ni to a steel sheet, thus forming oxides at some portions in the steel sheet surface layer, and resultantly suppressing the surface incrassation of Si, Mn and Al at the portions where oxides are not formed; enhances the effect of Ni and accelerates the formation of oxides by further adding Mo, Cu and Sn; and moreover, in the case of a TRIP steel sheet, secures austenite by determining the ranges of Si and Al strictly, avoiding the deterioration of plating performance caused by the addition of Ni, and further adding Mo in a balanced manner. In addition, the present invention, in a TRIP steel sheet, improves press formability by regulating a retained austenite ratio and accelerates the formation of oxides by regulating a hydrogen concentration and a dew point in annealing before plating.
摘要:
The present invention provides an alloyed molten zinc plated steel sheet having an area of the Fe and Zn alloy phase in the unformed parts in the plating layer of less than 10% of the area of the steel sheet as a whole and superior in strength and shapeability and a method of producing this alloyed molten zinc plating steel sheet by a continuous zinc plating production system which enables production at a low cost without modification of the system or addition of steps, said alloyed molten zinc plated steel sheet characterized by comprising a steel sheet including C: 0.05 to 0.40%, Si: 0.2 to 3.0%, and Mn: 0.1 to 2.5%, the balance comprised of Fe and unavoidable impurities, having on its surface a Zn alloy plating layer comprised of Fe in a concentration of 7 to 15 wt %, Al in a concentration of 0.01 to 1 wt %, and the balance of Zn and unavoidable impurities, said plating layer containing oxide particles of at least one type of oxide selected from an Al oxide, Si oxide, Mn oxide, and complex oxides of the same alone or in combination.