摘要:
A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrode and the diaphragm.
摘要:
An optical connector socket includes: a body having an insertion section in which a socket-side optical element is arranged and into which an optical connector plug is inserted; a cover, covered on the body, having an opening communicated with the insertion section; a shutter, openably/closably attached to the cover, for closing the opening; and a herical spring for elastically urging the shutter in a constant-closing direction. The opening is larger than an outside dimension of the optical connector plug inserted into the cover and smaller than that of the shutter. Therefore, there is no light leakage and dust intrusion, the socket can be attached to a device or a wall so as to direct an opening toward a front face without a cap, and an inspection in a state where the socket is assembled in an electronic device can be performed without attaching/detaching the cap to/from the socket.
摘要:
A manufacturing method for a buried insulating layer-type semiconductor silicon carbide substrate comprises the step of placing an SOI substrate 100, which has a surface silicon layer 130 of a predetermined thickness and a buried insulator 120, in a heating furnace 200 and of increasing the temperature of the atmosphere within heating furnace 200 while supplying a mixed gas (G1+G2) of a hydrogen gas G1 and of a hydrocarbon gas G2 into heating furnace 200, thereby, of metamorphosing surface silicon layer 130 of SOI substrate 100 into a single crystal silicon carbide thin film 140.
摘要翻译:掩埋绝缘层型半导体碳化硅衬底的制造方法包括将具有预定厚度的表面硅层130和掩埋绝缘体120的SOI衬底100放置在加热炉200中的步骤, 同时向加热炉200供给氢气G 1和烃气G 2的混合气体(G 1 + G 2),从而将SOI衬底100的变形表面硅层130 成为单晶碳化硅薄膜140。
摘要:
A heat plate for fixation comprising: a metallic base plate; and a heating resistor arranged on a reverse face of the metallic base plate, the heating resistor being formed by laminating, at least, an electric insulating layer and heating resistor layer in this order on the metallic base plate, wherein the heat plate is capable of raising the temperature of the metallic base plate to a fixing temperature when the heating resistor layer is energized and heated. A semicircular heating member for fixation comprises the heat plate which is curved so that the metallic base plate has a convex surface, a belt type fixing device is provided with the semicircular heating member, and an electrophotographic image forming apparatus is provided with the belt type fixing device comprising the semicircular heating member.
摘要:
The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).
摘要:
A heat plate for fixation comprising: a metallic base plate; and a heating resistor arranged on a reverse face of the metallic base plate, the heating resistor being formed by laminating, at least, an electric insulating layer and heating resistor layer in this order on the metallic base plate, wherein the heat plate is capable of raising the temperature of the metallic base plate to a fixing temperature when the heating resistor layer is energized and heated. A semicircular heating member for fixation comprises the heat plate which is curved so that the metallic base plate has a convex surface, a belt type fixing device is provided with the semicircular heating member, and an electrophotographic image forming apparatus is provided with the belt type fixing device comprising the semicircular heating member.
摘要:
To enable soldering with high efficiency, high temperature and short time or reflow soldering without using baking or moisture-proof packaging. An optical device which is placed at a side of distal end of plug inserted into a body is mounted on a surface of printed wiring board, and connected via the printed wiring board to a main substrate to which an optical connector is mounted. The printed wiring board is formed of the same material as a transparent resin package of the optical device. The printed wiring board is inserted into the body from the upper surface side opposite to the surface to which the optical connector is mounted, and fixed thereto. Alternatively, the printed wiring board is inserted into the body from the rear surface side opposite to the side at which the plug is inserted, and fixed thereto.
摘要:
The invention relates to an optical connector which is used in the field of the optical communication. As a counter optical connector 100 for the optical connector, a plug of the square or round type is used. In the optical connector, a cover 30 is attached in an openable and closable manner to the body 10 having a fitting hole portion 17 into which the counter optical connector 100 is to be inserted. The fitting hole portion 17 is formed by an internal space which is surrounded by a cylindrical wall 15 disposed in the body 10. The cover 30 has a covering wall portion 31 which is fittable to and detachable from an outside of the body 10. The optical connector performs functions that, even when the counter optical connector 100 is wrenched during an inserting or extracting operation, the wrenching force is not transmitted to the cover, and that the external appearance can be changed only by changing the design of the cover.
摘要:
Explosion of rechargeable battery can be prevented in a relatively simple structure, at low cost, and without allowing spouting of electrolyte. A rechargeable battery 100D1 using a pressure-crush type protective device comprises a housing H including an internal electrode plate 120 spirally wound about a positive electrode and a negative electrode through a separator, a jacket 110 for accommodating this internal electrode plate 120, and a sealing body 140 for closing the opening of this jacket 110, a positive electrode (or negative electrode) output electrode 130 connected electrically to the internal electrode plate 120, a spacer 200 disposed beneath the sealing body 140 for insulating between the sealing body 140 and internal electrode plate 120, a pressure-crush type protective device A1 disposed in said spacer 200 as a pressure-sensitive element for detecting the internal pressure in the housing H, and an output terminal 400 connected electrically to one terminal of this pressure-crush type protective device A1 (one end of a conductor layer 210A1) for picking up the detection result of the internal pressure detected by the pressure-crush type protective device A1 electrically to outside, in which other terminal of the pressure-crush type protective device A1 (other end of the conductor 210A1) is connected electrically to the positive electrode (or negative electrode) output electrode 130.