Abstract:
A method and apparatus for removing surface impurities from a surface of a material, particularly silicon wafers, includes identifying the location of at least one impurity particle on a surface of the material and applying a liquid to the surface in the vicinity of the at least one impurity particle. The liquid is explosively evaporated to remove the surface particle as part of the evaporation of the liquid. The apparatus can include a source of humidified gas for the liquid and a laser apparatus to provide the heat for liquid evaporation.
Abstract:
A process for measuring overlay misregistration during semiconductor wafer fabrication including the use of an interferometric microscope in combination with a camera, a wafer transport stage, and data processing electronics to form an inspection system which can utilize either broadband or narrowband light, and large or small numerical aperture (NA) to develop a series of interference images taken at different Z (vertical) planes relative to the surface under investigation or P (pathlength) positions relative to interferometer arm difference. The data in these planes is then used to calculate the magnitude and phase of the mutual coherence between the object wave and the reference wave for each pixel in the image planes, and synthetic images are formed, the brightness of which is proportional to either the complex magnitude (the Magnitude Contrast Image or MCI) or the phase of the mutual coherence as the optical pathlength (the Phase Contrast Image or PCI) is varied. The difference between synthetic images relating to target attribute position and bullet attribute position are then used as a means of detecting misregistration between the processing layer including the bullet attribute and the processing layer including the target attribute.
Abstract:
A method, a system and a computer readable medium are provided. The method may include obtaining or receiving first area information representative of a first area of a first layer of an inspected object; wherein the inspected object further comprises a second layer that comprises a second area; wherein the second layer is buried under the first layer; directing electrons of a primary electron beam to interact with the first area; directing electrons of the primary electron beam to interact with the second area; generating detection signals responsive to electrons that were scattered or reflected from at least one of the first and second areas; and determining at least one spatial relationship between at least one feature of the first area and at least one feature of the second area based on the detection signals and on the first area information.
Abstract:
A method for removing a particle from a substrate includes forming a layer of a fluid on a surface of an optical element and positioning the optical element in proximity to a location of the particle on the substrate. A pulse of electromagnetic radiation is directed to impinge on the surface of the optical element so as to induce explosive evaporation of the fluid thereon, whereby a pressure wave is emitted toward the location of the particle.
Abstract:
A wafer processing station includes an air gap chuck and a light emitter/collector assembly configured to gather light when scattered or reflected by contaminants on the wafer. The light emitter/collector assembly is driven by an actuator so that it passes across a backside surface of a wafer when supported within the chuck during wafer inspection. The wafer processing station may also include a cleaning module configured to clean the backside surface of the wafer when contaminants are discovered during wafer inspection. A computer system may be coupled to receive one or more signals from the light emitter/collector assembly that are indicative of contaminants on the backside surface of the wafer and to provide one or more control signals to the cleaning module in accordance therewith. The cleaning module may be used independently of the light emitter/collector assembly and vice-versa.
Abstract:
A method and apparatus for automatically focusing a high resolution microscope, wherein during setup the operator designates areas within each field of view where a measurement will be taken, and for each area of interest translates the microscope along its optical axis (Z-axis) while measuring the image intensities at discrete subareas within the area of interest. These image intensities are then evaluated, and those having the greatest signal-to-noise ratio and occurring at a common point along the Z-axis will be selected, and the corresponding subareas identified. During subsequent inspections of the area of interest, only light reflected from the identified subareas will be used to focus the microscope. The invention has application in both conventional microscopy and interferometry.
Abstract:
A method, a system and a computer readable medium are provided. The method may include obtaining or receiving first area information representative of a first area of a first layer of an inspected object; wherein the inspected object further comprises a second layer that comprises a second area; wherein the second layer is buried under the first layer; directing electrons of a primary electron beam to interact with the first area; directing electrons of the primary electron beam to interact with the second area; generating detection signals responsive to electrons that were scattered or reflected from at least one of the first and second areas; and determining at least one spatial relationship between at least one feature of the first area and at least one feature of the second area based on the detection signals and on the first area information.
Abstract:
Apparatus and a method for removing particles from the surface of a substrate include determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed via an optical cleaning arm at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.
Abstract:
Particles are removed from the surface of a substrate. Respective position coordinates of the particles on the surface are determined. A beam of electromagnetic energy is directed at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.
Abstract:
An optomechanical system for illuminating and imaging selected portions of a three dimensional object having specularly reflective surfaces, including a two dimensional image sensor for receiving light reflected from the selected portions and producing an analog output signal representing a two dimensional image of the selected portions over a predetermined time period, a video digitizer for receiving and converting the analog output signal to a digital signal, and an image computer for receiving the digital signal output by the video digitizer, comparing the information obtained from the output digital signal to the stored specifications of a master of the imaged portion of the object, indicating whether the imaged object meets the specifications of the master, controlling the movement of the imaged object, and controlling the operation of the system.