METHOD AND APPARATUS FOR 3-DIMENSIONAL VISION AND INSPECTION OF BALL AND LIKE PROTRUSIONS OF ELECTRONIC COMPONENTS
    1.
    发明申请
    METHOD AND APPARATUS FOR 3-DIMENSIONAL VISION AND INSPECTION OF BALL AND LIKE PROTRUSIONS OF ELECTRONIC COMPONENTS 有权
    三维视觉方法与装置及电子元器件类似电影的检测

    公开(公告)号:US20100328435A1

    公开(公告)日:2010-12-30

    申请号:US12305835

    申请日:2007-03-29

    Abstract: A method for 3-dimensional vision inspection of objects, such as microelectronic components, which have protrusions as features to be inspected, such as input/output contact balls, is disclosed. The method comprising the steps of determining interior and exterior parameters of a pair of cameras, forming a rectified coordinate system from the parameters of both cameras determined above with a relative pose of second image capturing means with respect to the first image capturing means. A pair of images of the object having a plurality of co-planar protrusions on one surface are captured by the cameras system wherein image coordinates of the images are transformed into coordinates of the rectified coordinate system. Conjugate points of each protrusion are then determined for the measurement of its co-planarity and height. Various configurations of the apparatus for capturing the images and processing the image data are also disclosed.

    Abstract translation: 公开了一种用于三维视觉检查的方法,例如具有作为检查特征的突起的诸如微电子部件的物体,例如输入/输出接触球。 该方法包括以下步骤:确定一对照相机的内部和外部参数,从上面确定的两个相机的参数相对于第一图像捕获装置以第二图像捕获装置的相对姿态形成整流坐标系。 在一个表面上具有多个共面突起的物体的一对图像被照相机系统捕获,其中图像的图像坐标被变换为整流坐标系的坐标。 然后确定每个突起的共轭点以测量其共平面度和高度。 还公开了用于捕获图像和处理图像数据的装置的各种配置。

    System for 2-D and 3-D vision inspection
    3.
    发明授权
    System for 2-D and 3-D vision inspection 有权
    2-D和3-D视力检查系统

    公开(公告)号:US07573569B2

    公开(公告)日:2009-08-11

    申请号:US11573344

    申请日:2005-09-01

    CPC classification number: G01N21/95684 H05K13/08

    Abstract: There is disclosed an inspection system that combines 2-D inspection and 3-D inspection of the components of an electronic device into one compact module. The inspection system of the present invention comprises a 2-D image acquisition assembly for inspecting 2-D criteria of the components, a 3-D image acquisition assembly for inspecting 3-D criteria of the components, and a computer for control and data analyzing. The 3-D image acquisition assembly comprises a 3-D image sensor and a 3-D light source. The 3-D light source is preferably a laser capable of generating a planar sheet of light that is substantially perpendicular to the inspection plane of the electronic device. The 2-D image acquisition assembly comprises a 2-D sensor and a 2-D light source positioned above the holder. The 2D and 3D image acquisition assemblies are arranged so that the 2D inspection and 3D inspection can be done while the electronic device is being held in one location.

    Abstract translation: 公开了将电子设备的部件的二维检查和三维检查结合成一个紧凑模块的检查系统。 本发明的检查系统包括用于检查部件的2-D标准的2-D图像获取组件,用于检查部件的3-D标准的3-D图像获取组件和用于控制和数据分析的计算机 。 3-D图像采集组件包括3-D图像传感器和3-D光源。 3-D光源优选是能够产生基本上垂直于电子设备的检查平面的平面光片的激光器。 2-D图像采集组件包括位于支架上方的2-D传感器和2-D光源。 2D和3D图像采集组件被布置成使得可以在将电子设备保持在一个位置的同时进行2D检查和3D检查。

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