公开(公告)号：US20120306075A1

公开(公告)日：2012-12-06

申请号：US13440817

申请日：2012-04-05

Applicant: TAE-HUN KIM ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

Inventor： TAE-HUN KIM ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

IPC: H01L23/498

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.

Abstract translation: 半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和 第二信号传送介质。 至少一个连接焊球的封装位于第一端子和第二端子之间。 第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。

公开(公告)号：US20140084442A1

公开(公告)日：2014-03-27

申请号：US14019638

申请日：2013-09-06

Applicant: Jung-Do Lee ,  Tae-Woo Kang ,  Dong-Han Kim ,  Yang-Hoon Ahn ,  Jang-Woo Lee ,  Dae-Young Choi

Inventor： Jung-Do Lee ,  Tae-Woo Kang ,  Dong-Han Kim ,  Yang-Hoon Ahn ,  Jang-Woo Lee ,  Dae-Young Choi

IPC: H01L23/34

CPC classification number: H01L29/34 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/105 ,  H01L29/1033 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/10271 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package includes a first package board, a first semiconductor chip arranged on the first package board, a heat transfer layer arranged on the first semiconductor chip, a heat spreader arranged on the heat transfer layer, and a housing having a molding part arranged on the first package board and directly surrounding side surfaces of the first semiconductor chip and a guide wall arranged on the molding part, with the guide wall spaced apart from the heat spreader and surrounding side surfaces of the heat spreader.

Abstract translation: 一种半导体封装，包括第一封装板，布置在第一封装板上的第一半导体芯片，布置在第一半导体芯片上的传热层，布置在传热层上的散热器，以及具有布置在 所述第一封装板和所述第一半导体芯片的直接环绕的侧表面和布置在所述模制部件上的引导壁，所述引导壁与所述散热器间隔开并且所述散热器的周围侧表面。

公开(公告)号：US08653640B2

公开(公告)日：2014-02-18

申请号：US13440817

申请日：2012-04-05

Applicant: Tae-hun Kim ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

Inventor： Tae-hun Kim ,  Dae-young Choi ,  Yang-hoon Ahn ,  Sun-hye Lee

IPC: H01L23/488

CPC classification number: H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.

Abstract translation: 半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和 第二信号传送介质。 至少一个连接焊球的封装位于第一端子和第二端子之间。 第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。