-
公开(公告)号：US20240219130A1
公开(公告)日：2024-07-04
申请号：US18532517
申请日：2023-12-07
发明人： Soo Jin CHUNG , Won Ki CHUNG , Jun Yong PARK , Young Min SHIN , Hyeon Seung LEE
CPC分类号： F28F25/06 , F28F5/00 , F28F2025/005
摘要： The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber to which a plurality of objects is charged through one open side thereof; an individual cooling unit configured to be provided in the chamber, to individually cover the object, and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction. With this configuration, it is possible to obtain a required cooling capacity by cooling individually or as a whole a heated metal object.
-
公开(公告)号：US20240218477A1
公开(公告)日：2024-07-04
申请号：US18525833
申请日：2023-11-30
发明人： Soo Jin Chung , Won Ki Chung , Jun Yong Park , Young Min Shin , Hyeon Seung Lee
CPC分类号： C21D9/0062 , F27D9/00 , F27D2009/0075 , F27D2009/0081
摘要： The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber within which a plurality of objects is disposed; an individual cooling unit configured to individually cover the object and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction.
-
搜索结果
2 条记录 (耗时 0.011 秒)
