公开(公告)号：US20240219130A1

公开(公告)日：2024-07-04

申请号：US18532517

申请日：2023-12-07

申请人： DONGWOO HST CO., LTD. ,  Winner vacuum Solution Co., Ltd.

发明人： Soo Jin CHUNG ,  Won Ki CHUNG ,  Jun Yong PARK ,  Young Min SHIN ,  Hyeon Seung LEE

IPC分类号： F28F25/06 ,  F28F5/00

CPC分类号： F28F25/06 ,  F28F5/00 ,  F28F2025/005

摘要： The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber to which a plurality of objects is charged through one open side thereof; an individual cooling unit configured to be provided in the chamber, to individually cover the object, and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction. With this configuration, it is possible to obtain a required cooling capacity by cooling individually or as a whole a heated metal object.