公开(公告)号：US20240218477A1

公开(公告)日：2024-07-04

申请号：US18525833

申请日：2023-11-30

申请人： DONGWOO HST CO., LTD. ,  Winner Vacuum Solution Co., Ltd.

发明人： Soo Jin Chung ,  Won Ki Chung ,  Jun Yong Park ,  Young Min Shin ,  Hyeon Seung Lee

IPC分类号： C21D9/00 ,  F27D9/00

CPC分类号： C21D9/0062 ,  F27D9/00 ,  F27D2009/0075 ,  F27D2009/0081

摘要： The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber within which a plurality of objects is disposed; an individual cooling unit configured to individually cover the object and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction.