摘要:
A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.
摘要:
A method of fabricating a shuttle wafer is provided. First, a wafer including a number of shots is provided. Each of the shots includes a number of dies. A material layer is then formed on the wafer. After that, a shuttle mask having a number of IC designs is provided. A first IC design corresponds to a first die of each of the shots. A portion of the IC designs on the shuttle mask is covered for exposing the first IC design. Thereafter, the first IC designs of the shuttle mask are transferred onto the material layer, so as to form at least an effective IC pattern on the first die of each of the shots and to form an ineffective IC pattern on each of the other dies of each of the shots.
摘要:
A method for removing photoresist is described. A substrate having a photoresist to be removed thereon is provided, and then an ashing process is performed to remove most of the photoresist. The substrate is then subjected to a surface treatment that provides sufficient energy for the extra electrons caused by the ashing process to escape from the substrate, and the remaining photoresist and polymer are stripped with stripping solvents after the surface treatment.
摘要:
An apparatus for fault detection and classification (FDC) specification management including a storage device and a process module. The storage device stores a specification management record and a chart profile record. The specification management record stores statistical algorithm settings of a parameter and the chart profile record stores chart frame and alarm condition information. The process module, which resides in a memory, receives a manipulation message corresponding to the specification management record, and accordingly manipulates the chart profile record.
摘要:
A metal etching system has an etching chamber defined by quartz walls. Coils provided around the quartz walls of the etching chamber are used to apply a high frequency electrical field to at least a portion of the etching chamber. Containment walls are provided around the coils. An endpoint detection system is provided for the etching system which includes an optical fiber which extends through the containment wall and the coils, with an end of the optical fiber disposed in fixed relationship to the quartz walls of the etching chamber. A fixture mounts the optical fiber in the containment wall. An air-tight seal, such as an O-ring compressed around the optical fiber and compressed against the containment wall, is provided to limit air flow along the optical fiber to the surface of the etching chamber walls. The O-ring or similar air-tight seal prevents air from flowing from outside of the containment wall to the surface of the etching chamber wall which would otherwise locally cool the etching chamber walls and cause material to deposit onto the chamber walls.
摘要:
A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.
摘要:
A plasma etching process is described. A substrate having a low-k material layer and a metal hard mask layer sequentially formed thereon is provided, wherein the metal hard mask layer exposes a portion of the low-k material layer. The low-k material layer is then etched with plasma of a gas mixture of helium (He) and at least one fluorinated hydrocarbon by using the metal hard mask layer as a mask.
摘要:
A method for removing photoresist is described. A substrate having a photoresist to be removed thereon is provided, and then an ashing process is performed to remove most of the photoresist. The substrate is irradiated with UV light, and the remaining photoresist and polymer are stripped with stripping solvents after UV irradiation.
摘要:
A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.
摘要:
A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.