METHOD FOR REMOVING MICRO-BUBBLES AND/OR PARTICLES FROM LIQUID, LIQUID SUPPLY APPARATUS AND IMMERSION EXPOSURE APPARATUS
    1.
    发明申请
    METHOD FOR REMOVING MICRO-BUBBLES AND/OR PARTICLES FROM LIQUID, LIQUID SUPPLY APPARATUS AND IMMERSION EXPOSURE APPARATUS 有权
    从液体,液体供给装置和浸入式曝光装置中除去微泡和/或颗粒的方法

    公开(公告)号:US20110186751A1

    公开(公告)日:2011-08-04

    申请号:US13087400

    申请日:2011-04-15

    IPC分类号: G21K5/00

    CPC分类号: C02F1/20 C02F1/30

    摘要: A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.

    摘要翻译: 描述了能够去除微气泡和颗粒的液体供应装置,包括管道,激光提供器和至少一个微气泡/颗粒出口。 激光提供者提供穿过管道的激光器,其中以这样的方式提供激光器,使得形成微气泡/颗粒阻挡/排斥屏障,跨越管阻塞或排斥微泡,颗粒或两者中的液体中的微泡 管。 微气泡/颗粒出口设置在管道之间的管道和管道的液体入口之间,邻近于用于排放微气泡,颗粒或两者的屏障。

    SHUTTLE WAFER AND METHOD OF FABRICATING THE SAME
    2.
    发明申请
    SHUTTLE WAFER AND METHOD OF FABRICATING THE SAME 审中-公开
    切割机及其制造方法

    公开(公告)号:US20090321870A1

    公开(公告)日:2009-12-31

    申请号:US12147990

    申请日:2008-06-27

    IPC分类号: H01L21/70 H01L27/00

    摘要: A method of fabricating a shuttle wafer is provided. First, a wafer including a number of shots is provided. Each of the shots includes a number of dies. A material layer is then formed on the wafer. After that, a shuttle mask having a number of IC designs is provided. A first IC design corresponds to a first die of each of the shots. A portion of the IC designs on the shuttle mask is covered for exposing the first IC design. Thereafter, the first IC designs of the shuttle mask are transferred onto the material layer, so as to form at least an effective IC pattern on the first die of each of the shots and to form an ineffective IC pattern on each of the other dies of each of the shots.

    摘要翻译: 提供了制造穿梭晶片的方法。 首先,提供包括多个镜头的晶片。 每个镜头都包括一些模具。 然后在晶片上形成材料层。 之后,提供具有多个IC设计的穿梭掩模。 第一IC设计对应于每个镜头的第一个模具。 遮阳罩上的IC设计的一部分被覆盖以暴露第一IC设计。 此后,将穿梭掩模的第一IC设计转移到材料层上,以便在每个镜头的第一管芯上形成至少一个有效的IC图案,并在每个其他管芯上形成无效的IC图案 每个镜头。

    Method for removing photoresist
    3.
    发明授权
    Method for removing photoresist 有权
    去除光刻胶的方法

    公开(公告)号:US07335600B2

    公开(公告)日:2008-02-26

    申请号:US11014395

    申请日:2004-12-15

    IPC分类号: H01L21/312

    CPC分类号: H01L21/02071 H01L21/02063

    摘要: A method for removing photoresist is described. A substrate having a photoresist to be removed thereon is provided, and then an ashing process is performed to remove most of the photoresist. The substrate is then subjected to a surface treatment that provides sufficient energy for the extra electrons caused by the ashing process to escape from the substrate, and the remaining photoresist and polymer are stripped with stripping solvents after the surface treatment.

    摘要翻译: 描述了去除光致抗蚀剂的方法。 提供具有要去除其上的光致抗蚀剂的基板,然后进行灰化处理以去除大部分光致抗蚀剂。 然后对基板进行表面处理,为由灰化过程引起的额外电子提供足够的能量以从基板逸出,并且在表面处理之后用剥离溶剂剥离剩余的光致抗蚀剂和聚合物。

    Endpoint detection system
    5.
    发明授权
    Endpoint detection system 失效
    端点检测系统

    公开(公告)号:US5985092A

    公开(公告)日:1999-11-16

    申请号:US864223

    申请日:1997-05-28

    IPC分类号: H01J37/32 C23F1/02 C23C16/00

    摘要: A metal etching system has an etching chamber defined by quartz walls. Coils provided around the quartz walls of the etching chamber are used to apply a high frequency electrical field to at least a portion of the etching chamber. Containment walls are provided around the coils. An endpoint detection system is provided for the etching system which includes an optical fiber which extends through the containment wall and the coils, with an end of the optical fiber disposed in fixed relationship to the quartz walls of the etching chamber. A fixture mounts the optical fiber in the containment wall. An air-tight seal, such as an O-ring compressed around the optical fiber and compressed against the containment wall, is provided to limit air flow along the optical fiber to the surface of the etching chamber walls. The O-ring or similar air-tight seal prevents air from flowing from outside of the containment wall to the surface of the etching chamber wall which would otherwise locally cool the etching chamber walls and cause material to deposit onto the chamber walls.

    摘要翻译: 金属蚀刻系统具有由石英壁限定的蚀刻室。 设置在蚀刻室的石英壁周围的线圈用于将高频电场施加到蚀刻室的至少一部分。 围绕线圈设置围墙。 提供了一种用于蚀刻系统的端点检测系统,该系统包括延伸穿过容纳壁和线圈的光纤,光纤端部以与蚀刻室的石英壁固定的关系设置。 灯具将光纤安装在安全壳中。 提供气密密封件,例如围绕光纤压缩并压靠在容纳壁上的O形环,以将沿着光纤的气流限制到蚀刻室壁的表面。 O形圈或类似的气密密封件防止空气从容纳壁的外部流到蚀刻室壁的表面,否则将局部地冷却蚀刻室壁并使材料沉积到室壁上。

    Method for removing micro-bubbles and/or particles from liquid, liquid supply apparatus and immersion exposure apparatus
    6.
    发明授权
    Method for removing micro-bubbles and/or particles from liquid, liquid supply apparatus and immersion exposure apparatus 有权
    从液体,液体供给装置和浸渍曝光装置中除去微气泡和/或颗粒的方法

    公开(公告)号:US07978303B2

    公开(公告)日:2011-07-12

    申请号:US11691685

    申请日:2007-03-27

    IPC分类号: C02F1/30

    CPC分类号: C02F1/20 C02F1/30

    摘要: A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.

    摘要翻译: 描述了能够去除微气泡和颗粒的液体供应装置,包括管道,激光提供器和至少一个微气泡/颗粒出口。 激光提供者提供穿过管道的激光器,其中以这样的方式提供激光器,使得形成微气泡/颗粒阻挡/排斥屏障,跨越管阻塞或排斥微泡,颗粒或两者中的液体中的微泡 管。 微气泡/颗粒出口设置在管道之间的管道和管道的液体入口之间,邻近于用于排放微气泡,颗粒或两者的屏障。

    Plasma etching process
    7.
    发明申请
    Plasma etching process 审中-公开
    等离子体蚀刻工艺

    公开(公告)号:US20060134921A1

    公开(公告)日:2006-06-22

    申请号:US11295680

    申请日:2005-12-05

    摘要: A plasma etching process is described. A substrate having a low-k material layer and a metal hard mask layer sequentially formed thereon is provided, wherein the metal hard mask layer exposes a portion of the low-k material layer. The low-k material layer is then etched with plasma of a gas mixture of helium (He) and at least one fluorinated hydrocarbon by using the metal hard mask layer as a mask.

    摘要翻译: 描述等离子体蚀刻工艺。 提供了在其上顺序地形成有低k材料层和金属硬掩模层的基板,其中金属硬掩模层暴露低k材料层的一部分。 然后通过使用金属硬掩模层作为掩模,用等离子体氦(He)和至少一种氟化烃的气体混合物的等离子体蚀刻低k材料层。

    Method for removing photoresist
    8.
    发明授权
    Method for removing photoresist 有权
    去除光刻胶的方法

    公开(公告)号:US06846748B2

    公开(公告)日:2005-01-25

    申请号:US10428508

    申请日:2003-05-01

    CPC分类号: H01L21/02071

    摘要: A method for removing photoresist is described. A substrate having a photoresist to be removed thereon is provided, and then an ashing process is performed to remove most of the photoresist. The substrate is irradiated with UV light, and the remaining photoresist and polymer are stripped with stripping solvents after UV irradiation.

    摘要翻译: 描述了去除光致抗蚀剂的方法。 提供具有要去除其上的光致抗蚀剂的基板,然后进行灰化处理以去除大部分光致抗蚀剂。 用UV光照射基板,并且在UV照射之后用剥离溶剂剥离剩余的光致抗蚀剂和聚合物。

    Method for removing micro-bubbles and/or particles from liquid, liquid supply apparatus and immersion exposure apparatus
    9.
    发明授权
    Method for removing micro-bubbles and/or particles from liquid, liquid supply apparatus and immersion exposure apparatus 有权
    从液体,液体供给装置和浸渍曝光装置中除去微气泡和/或颗粒的方法

    公开(公告)号:US08262915B2

    公开(公告)日:2012-09-11

    申请号:US13087400

    申请日:2011-04-15

    IPC分类号: C02F1/30 G21K5/00

    CPC分类号: C02F1/20 C02F1/30

    摘要: A liquid supply apparatus capable of removing micro-bubbles and particles is described, including a pipe, a laser provider and at least one micro-bubble/particle outlet. The laser provider provides a laser crossing the pipe, wherein the laser is provided in a manner such that a micro-bubble/particle blocking/repelling barrier is formed crossing the pipe blocking or repelling micro-bubbles, particles or both in the liquid in the pipe. The micro-bubble/particle outlet is disposed on the pipe between the barrier and the liquid inlet of the pipe, adjacent to the barrier for discharging micro-bubbles, particles or both.

    摘要翻译: 描述了能够去除微气泡和颗粒的液体供应装置,包括管道,激光提供器和至少一个微气泡/颗粒出口。 激光提供者提供穿过管道的激光器,其中以这样的方式提供激光器,使得形成微气泡/颗粒阻挡/排斥屏障,跨越管阻塞或排斥微泡,颗粒或两者中的液体中的微泡 管。 微气泡/颗粒出口设置在管道之间的管道和管道的液体入口之间,邻近于用于排放微气泡,颗粒或两者的屏障。