公开(公告)号：US5830583A

公开(公告)日：1998-11-03

申请号：US792795

申请日：1997-02-03

申请人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

发明人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

IPC分类号： C25D1/04

CPC分类号： C25D1/04 ,  Y10S428/935 ,  Y10T428/12431

摘要： This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

摘要翻译： 本发明涉及具有基本上无定向晶粒结构的基本上均匀的无晶粒状的铜线。 本发明还涉及一种制造铜线的方法，包括：切割铜箔以形成铜线的至少一根线，所述铜箔是具有基本上无定向晶粒结构的可退火的电沉积铜箔，其基本上无柱状，所述 箔的特征在于在177℃退火15分钟后的疲劳延展性至少约25％; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。 本发明还涉及一种制造铜线的方法，包括：使阳极和阴极之间的电解质水溶液流动，并在阳极和阴极上施加有效量的电压以将铜箔沉积在阴极上，所述电解质溶液的特征在于 通过高达约5ppm的氯离子浓度和高达约0.2ppm的有机添加剂浓度; 切割所述箔以形成至少一根丝线; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。

公开(公告)号：US6132887A

公开(公告)日：2000-10-17

申请号：US647706

申请日：1996-05-24

申请人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson

发明人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson

IPC分类号： C22F1/08 ,  C22F1/00 ,  C25D1/00 ,  C25D1/04 ,  C25D3/38 ,  C25D5/10 ,  C25D5/50 ,  C25D7/06 ,  H05K1/00 ,  H05K1/09 ,  H05K3/38

CPC分类号： C25D1/04 ,  C25D5/10 ,  H05K1/09 ,  H05K3/384 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T428/12 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12903

摘要： This invention relates to an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes. In one embodiment, the foil is annealed, said foil being characterized by a fatigue ductility of at least about 65%. The invention also relates to a process for making an electrodeposited copper foil using an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm.

摘要翻译： 本发明涉及一种具有大体上均匀的无取向晶粒结构的可退火的电沉积铜箔，其基本上是无柱状的，所述箔的特征在于在177℃退火15分钟后的疲劳延展性为至少约25％。 在一个实施例中，箔被退火，所述箔的特征在于至少约65％的疲劳延展性。 本发明还涉及一种使用电解质溶液制造电沉积铜箔的方法，其特征在于氯离子的临界浓度高达约5ppm，有机添加剂高达约0.2ppm。

公开(公告)号：US6123788A

公开(公告)日：2000-09-26

申请号：US647707

申请日：1996-05-24

申请人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

发明人： Sidney J. Clouser ,  Rudolf Wiechmann ,  Bernd Schneider ,  Ulrike Bohmler ,  R. Duane Apperson ,  Robert J. Fedor ,  Sharon K. Young ,  Roger N. Wright ,  Stephen J. Kohut ,  Susan S. Enos

IPC分类号： C22F1/08 ,  C25D1/04 ,  C25D3/38 ,  C25D5/10 ,  H05K1/00

CPC分类号： C25D1/04 ,  C25D5/10 ,  H05K1/0393 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105

摘要： This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177.degree. C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.

摘要翻译： 本发明涉及具有基本上无定向晶粒结构的基本上均匀的无晶粒状的铜线。 本发明还涉及一种制造铜线的方法，包括：切割铜箔以形成铜线的至少一根线，所述铜箔是具有基本上无定向晶粒结构的可退火的电沉积铜箔，其基本上无柱状，所述 箔的特征在于在177℃退火15分钟后的疲劳延展性至少约25％; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。 本发明还涉及一种制造铜线的方法，包括：使阳极和阴极之间的电解质水溶液流动，并在阳极和阴极上施加有效量的电压以将铜箔沉积在阴极上，所述电解质溶液的特征在于 通过高达约5ppm的氯离子浓度和高达约0.2ppm的有机添加剂浓度; 切割所述箔以形成至少一根丝线; 并且对所述线材进行成形以使所述股线具有期望的横截面形状和尺寸。