-
公开(公告)号：US20060159913A1
公开(公告)日：2006-07-20
申请号：US11316086
申请日：2005-12-21
申请人： Tomoyuki Kugo , Tohru Kitano , Norihiko Inaba
发明人： Tomoyuki Kugo , Tohru Kitano , Norihiko Inaba
IPC分类号： B32B15/04
CPC分类号： C09J7/35 , C09J2201/36 , Y10T428/2817
摘要： The object of the present invention is to provide a heat-sensitive adhesive material having improved delivery properties and a superior adhesive strength. The objective heat-sensitive adhesive material in which an adhesive layer comprising mainly an adhesive is coated over a support and a heat-sensitive adhesive layer having developed adhesion by heating and maintaining the developed adhesive strength is coated over the adhesive layer, has Clark stiffness set by JIS P-8143 of 30 m3/100 to 180 cm3/100 in a longitudinal direction and a coefficient of static friction between a heat-sensitive layer and a polyethylene terephthalate (PET) film of 0.90 or less.
摘要翻译： 本发明的目的是提供具有改进的输送性能和优异的粘合强度的热敏粘合剂材料。 将其中主要包含粘合剂的粘合剂层涂覆在支撑体上的目标热敏粘合剂材料和通过加热显影粘合力并保持显影粘合强度的热敏粘合剂层被涂覆在粘合剂层上，具有克拉克刚度 通过JIS P-8143在纵向上为30m 3/100至180cm 3/100，并且热敏层和聚乙烯之间的静摩擦系数 对苯二甲酸酯（PET）膜为0.90以下。
-
公开(公告)号：US07056552B2
公开(公告)日：2006-06-06
申请号：US10229450
申请日：2002-08-28
申请人： Tomoyuki Kugo , Toshiaki Ikeda
发明人： Tomoyuki Kugo , Toshiaki Ikeda
CPC分类号： C09J11/08 , C09J7/35 , C09J2203/334 , C09J2433/00 , Y10T428/31855
摘要： A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1
摘要翻译： 热敏粘合剂材料包括基材，含有热塑性树脂的热敏粘合剂层和形成在基材上的固体增塑剂，以及能够将固体增塑剂的固化点压在至少一种 热敏粘合剂层和与热敏粘合剂层相邻的层。 热熔性物质满足以下条件（A）：E 1
-
公开(公告)号：US20060068191A1
公开(公告)日：2006-03-30
申请号：US11225226
申请日：2005-09-13
申请人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
发明人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
CPC分类号： C09J7/22 , B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/36 , B41M2205/38 , C09J7/35 , Y10T428/249924 , Y10T428/249971 , Y10T428/249987 , Y10T428/28 , Y10T428/2813
摘要： In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.
摘要翻译： 为了提供相对于诸如纸板或聚烯烃膜的粗糙被粘物表现出高压敏粘合强度的热敏粘合剂材料和随时间降低的粘合强度，以较低的能量热活化并表现出优异的抗粘连性，热性 公开了含有载体，底层和热敏粘合剂层的感光性粘合剂材料，其中底层包含热塑性树脂和中空填料，热塑性树脂的玻璃化转变温度为-70 ℃以上且低于0℃
-
4.发明授权Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material 有权热敏粘合剂材料，附着物，用于热活化热敏粘合剂材料的方法和装置公开(公告)号：US08702896B2
公开(公告)日：2014-04-22
申请号：US12288176
申请日：2008-10-16
申请人： Mitsunobu Morita , Tomoyuki Kugo , Hiroshi Goto , Norihiko Inaba
发明人： Mitsunobu Morita , Tomoyuki Kugo , Hiroshi Goto , Norihiko Inaba
CPC分类号： C09J11/06 , C08K5/0016 , C08K5/3475 , C09J7/35 , C09J2205/102 , Y10S428/913 , Y10T428/269 , Y10T428/28 , Y10T428/2817 , Y10T428/2852 , Y10T428/2891 , Y10T428/2896
摘要： A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
摘要翻译： 热敏粘合剂材料包含基材和含有热塑性树脂和固体增塑剂的热敏粘合剂层，并且该热敏粘合剂材料被构造成被加热并施加到被粘物上，其中， 粘合剂粘合剂表现出对被粘物的粘合强度随着涂布热粘合剂材料到被粘物之后的时间而增加。
-
公开(公告)号：US20110311809A1
公开(公告)日：2011-12-22
申请号：US13161617
申请日：2011-06-16
IPC分类号： B32B7/12
CPC分类号： C09J133/08 , C08K5/0016 , C08K5/3475 , C08K5/50 , C08K5/5317 , C09J7/35 , C09J133/10 , C09J2203/334 , C09J2205/102 , C09J2433/00 , Y10T428/2813
摘要： A heat-sensitive adhesive material according to the present invention includes a support, and a heat-sensitive adhesive layer on the support, the heat-sensitive adhesive layer comprises a water-dispersible heat-sensitive adhesive containing at least a thermoplastic resin, a solid plasticizer and a tackifier, wherein the thermoplastic resin is obtained by emulsion polymerization using a reactive surfactant and has a glass transition temperature (Tg) of lower than −20° C.
摘要翻译： 根据本发明的热敏粘合剂材料包括载体和载体上的热敏粘合剂层，热敏粘合剂层包含至少含有热塑性树脂的水分散性热敏粘合剂，固体 增塑剂和增粘剂，其中热塑性树脂通过使用反应性表面活性剂的乳液聚合获得，并且具有低于-20℃的玻璃化转变温度（Tg）
-
6.发明申请Heat-sensitive adhesive material, adhered article, process and apparatus for thermally activating the heat-sensitive adhesive material 有权热敏粘合剂材料，附着物，用于热活化热敏粘合剂材料的方法和装置公开(公告)号：US20090050268A1
公开(公告)日：2009-02-26
申请号：US12288176
申请日：2008-10-16
申请人： Mitsunobu Morita , Tomoyuki Kugo , Hiroshi Goto , Norihiko Inaba
发明人： Mitsunobu Morita , Tomoyuki Kugo , Hiroshi Goto , Norihiko Inaba
IPC分类号： B32B37/06
CPC分类号： C09J11/06 , C08K5/0016 , C08K5/3475 , C09J7/35 , C09J2205/102 , Y10S428/913 , Y10T428/269 , Y10T428/28 , Y10T428/2817 , Y10T428/2852 , Y10T428/2891 , Y10T428/2896
摘要： A heat-sensitive adhesive material contains a substrate and a heat-sensitive adhesive layer that contains a thermoplastic resin and a solid plasticizer, and the heat-sensitive adhesive material is so configured as to be heated and applied to an adherend, wherein the heat-sensitive adhesive material exhibits such an adhesive strength to the adherend as to increase with time from immediately after applying the heat-sensitive adhesive material to the adherend.
摘要翻译： 热敏粘合剂材料包含基材和含有热塑性树脂和固体增塑剂的热敏粘合剂层，并且该热敏粘合剂材料被构造成被加热并施加到被粘物上，其中， 粘合剂粘合剂表现出对被粘物的粘合强度随着涂布热粘合剂材料到被粘物之后的时间而增加。
-
公开(公告)号：US07021214B2
公开(公告)日：2006-04-04
申请号：US10763850
申请日：2004-01-23
申请人： Tomoyuki Kugo , Hiroshi Goto , Toshiaki Ikeda , Norihiko Inaba
发明人： Tomoyuki Kugo , Hiroshi Goto , Toshiaki Ikeda , Norihiko Inaba
CPC分类号： B65C9/1803 , B65C9/25 , B65C9/44
摘要： A method for issuing a label, including feeding a first label sheet including a support and a thermosensitive adhesive layer located overlying one side of the support, wherein the first label sheet has a timing mark on the thermosensitive adhesive layer; detecting the timing mark; and cutting or semi-cutting the first label sheet to produce a second label sheet, wherein the timing mark is present at a position other than corners of the second label sheet, and wherein a ratio of an area of the timing mark to an area of the second label sheet is from 0.5 to 35%.
摘要翻译： 一种用于发行标签的方法，包括进给包括支撑体的第一标签片和位于所述支撑体的一侧上方的热敏粘合剂层，其中所述第一标签片在所述热敏粘合剂层上具有定时标记; 检测定时标记; 以及切割或半切割所述第一标签片以产生第二标签片，其中所述定时标记存在于除所述第二标签片的角以外的位置处，并且其中所述定时标记的面积与 第二标签片为0.5〜35％。
-
公开(公告)号：US07811661B2
公开(公告)日：2010-10-12
申请号：US11225226
申请日：2005-09-13
申请人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
发明人： Hiroshi Goto , Tomoyuki Kugo , Mitsunobu Morita , Norihiko Inaba , Tohru Kitano , Takehito Yamaguchi
CPC分类号： C09J7/22 , B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/36 , B41M2205/38 , C09J7/35 , Y10T428/249924 , Y10T428/249971 , Y10T428/249987 , Y10T428/28 , Y10T428/2813
摘要： In order to provide heat-sensitive adhesive materials that represent high pressure-sensitive adhesive strength with respect to rough adherends such as cardboards or polyolefin wraps and lower decrease of adhesive strength with time, are thermally activated with lower energy and exhibit excellent blocking resistance, heat-sensitive adhesive materials are disclosed that contain a support, an underlayer, and a heat-sensitive adhesive layer, in this order, wherein the underlayer comprises a thermoplastic resin and a hollow filler, and the glass transition temperature of the thermoplastic resin is −70° C. or higher and below 0° C.
摘要翻译： 为了提供相对于诸如纸板或聚烯烃膜的粗糙被粘物表现出高压敏粘合强度的热敏粘合剂材料和随时间降低的粘合强度，以较低的能量热活化并表现出优异的抗粘连性，热性 公开了含有载体，底层和热敏粘合剂层的感光性粘合剂材料，其中底层包含热塑性树脂和中空填料，热塑性树脂的玻璃化转变温度为-70 ℃以上且低于0℃
-
9.发明授权Heat-sensitive adhesive material, method of preparing same and method of using same 失效热敏粘合剂材料，其制备方法及其使用方法公开(公告)号：US06828017B2
公开(公告)日：2004-12-07
申请号：US09962495
申请日：2001-09-25
申请人： Tomoyuki Kugo , Toshiaki Ikeda
发明人： Tomoyuki Kugo , Toshiaki Ikeda
IPC分类号： B32B1504
CPC分类号： C09J11/00 , C09J7/35 , C09J11/04 , C09J11/06 , C09J11/08 , Y10S428/913 , Y10T428/1275 , Y10T428/1334 , Y10T428/1393 , Y10T428/269 , Y10T428/28 , Y10T428/2813 , Y10T428/2826 , Y10T428/2852 , Y10T428/2878 , Y10T428/2891
摘要： A heat-sensitive adhesive material including a substrate and a heat-sensitive adhesive layer provided thereon. The adhesive layer has one of the following properties (a) and (b): (a) the heat-sensitive adhesive layer, when thermally activated, exhibits an adhesive strength in the range of 1800-3500 gf/40 mm at 0-10° C.; (b) the heat-sensitive adhesive layer, when thermally activated, exhibits a scratch resistance in the range of 150-500 gf at 0° C.
摘要翻译： 一种热敏粘合剂材料，其包括基材和设置在其上的热敏粘合剂层。 粘合剂层具有以下特性（a）和（b）：（a）当热激活时，热敏粘合剂层在0-10℃下表现出在1800-3500gf / 40mm范围内的粘合强度 ℃;（b）当热激活时，热敏粘合剂层在0℃下表现出在150-500gf范围内的耐擦伤性。
-
公开(公告)号：US20060141146A1
公开(公告)日：2006-06-29
申请号：US11359741
申请日：2006-02-21
申请人： Tomoyuki Kugo , Toshiaki Ikeda
发明人： Tomoyuki Kugo , Toshiaki Ikeda
IPC分类号： B05D5/10
CPC分类号： B41M5/42 , B41M5/423 , B41M5/44 , B41M2205/04 , B41M2205/36 , C09J7/21 , C09J7/35 , C09J2201/622 , C09J2400/283
摘要： A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1
摘要翻译： 热敏粘合剂材料包括基材，含有热塑性树脂的热敏粘合剂层和形成在基材上的固体增塑剂，以及能够将固体增塑剂的固化点压在至少一种 热敏粘合剂层和与热敏粘合剂层相邻的层。 热熔性物质满足以下条件（A）：E1
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.017 秒)
