发明申请
- 专利标题: Heat-sensitive adhesive material
- 专利标题(中): 热敏粘合剂材料
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申请号: US11316086申请日: 2005-12-21
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公开(公告)号: US20060159913A1公开(公告)日: 2006-07-20
- 发明人: Tomoyuki Kugo , Tohru Kitano , Norihiko Inaba
- 申请人: Tomoyuki Kugo , Tohru Kitano , Norihiko Inaba
- 优先权: JP2004-370445 20041222
- 主分类号: B32B15/04
- IPC分类号: B32B15/04
摘要:
The object of the present invention is to provide a heat-sensitive adhesive material having improved delivery properties and a superior adhesive strength. The objective heat-sensitive adhesive material in which an adhesive layer comprising mainly an adhesive is coated over a support and a heat-sensitive adhesive layer having developed adhesion by heating and maintaining the developed adhesive strength is coated over the adhesive layer, has Clark stiffness set by JIS P-8143 of 30 m3/100 to 180 cm3/100 in a longitudinal direction and a coefficient of static friction between a heat-sensitive layer and a polyethylene terephthalate (PET) film of 0.90 or less.
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