Substrate processing apparatus
    4.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US07171973B2

    公开(公告)日:2007-02-06

    申请号:US10195453

    申请日:2002-07-16

    IPC分类号: B08B3/02

    摘要: The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

    摘要翻译: 衬底处理设备具有包围衬底支撑构件以限定处理空间的封闭结构。 外壳结构具有由快门关闭的开口。 供给处理流体(如化学液体)的处理流体供应单元容纳在壳体中。 容纳在壳体中的处理流体供应单元通过外壳结构的打开而进入处理空间,以将处理流体供给到由基板支撑构件支撑的基板上。

    Substrate processing apparatus
    9.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US07862680B2

    公开(公告)日:2011-01-04

    申请号:US12149829

    申请日:2008-05-08

    CPC分类号: H01L21/6708 B08B3/02

    摘要: A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.

    摘要翻译: 提供了一种基板处理装置。 该装置包括用于供应不同加工流体的多个流体供应器61,61,63。 在处理晶片W时,基板处理装置沿着晶片W的周边部分相对移动流体供给部61,62,63。 流体供应部61,62,63沿着从晶片W的圆周向内延伸的方向配置。 通过这种布置,尽管晶片W以低速旋转,该装置能够稳定地处理晶片W. 此外,可以提高抗蚀剂处理中的装置的生产量。