发明授权
- 专利标题： Substrate processing apparatus
- 专利标题（中）： 基板加工装置
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申请号： US12149829申请日： 2008-05-08
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公开(公告)号： US07862680B2公开(公告)日： 2011-01-04
- 发明人: Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
- 申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP2001-234836 20010802
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/304 ; B08B3/02
摘要：
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 along the peripheral part of the wafer W relatively. The fluid suppliers 61, 62, 63 are arranged in a direction extending from the circumference of the wafer W to its inside. With the arrangement, the apparatus is capable of stable processing of the wafer W in spite of rotating the wafer W at a low speed. Further, it is possible to improve a throughput of the apparatus in resist processing.
公开/授权文献
- US20080210278A1 Substrate processing apparatus 公开/授权日：2008-09-04
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