发明授权
- 专利标题： Substrate processing apparatus
- 专利标题（中）： 基板加工装置
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申请号： US10195453申请日： 2002-07-16
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公开(公告)号： US07171973B2公开(公告)日： 2007-02-06
- 发明人: Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
- 申请人： Takehiko Orii , Tatsuya Nishida , Osamu Kuroda
- 申请人地址： JP Tokyo-To
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo-To
- 代理机构： Smith, Gambrell & Russell, LLP
- 优先权： JP2001-215479 20010716; JP2001-215505 20010716
- 主分类号： B08B3/02
- IPC分类号： B08B3/02
摘要：
The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.
公开/授权文献
- US20030010671A1 Substrate processing apparatus 公开/授权日：2003-01-16
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