Abstract:
A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).
Abstract:
Provided is a polyamic acid resin composition for formation of a bank, which provides excellent film characteristics and adhesion to a substrate, which can undergo patterning with use of a positive type photoresist, and which can be transformed into a polyimide after the patterning to yield a polyimide resin with upper part of film having a low surface energy. It is achieved by a polyamic acid resin composition comprising a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group with a carbon number of at least 2, and containing the polyamic acid [b] in an amount of from 0.1 to 30 wt % to the total amount of the polyamic acid [a] and the polyamic acid [b].
Abstract:
The present invention provides a positive photosensitive resin composition which can be developed with a tetramethylammonium hydroxide aqueous solution with a usual concentration, has high sensitivity and excellent resolution, and is excellent in heat resistance, planarization properties, transparency, low water absorption or the like. Further, the present invention provides a method for arbitrarily forming a pattern having a semicircular or trapezoidal section by using the composition. The positive photosensitive resin composition of the present invention comprises an alkali-soluble resin, a 1,2-quinone diazide compound, a crosslinking compound having at least two epoxy groups and a surfactant, and the alkali-soluble resin is a copolymer comprising a carboxylic group-containing acrylic monomer, a hydroxyl group-containing acrylic monomer and an N-substituted maleimide as essential components. By changing the postbake conditions, the composition can arbitrarily form a pattern having a semicircular or trapezoidal section.
Abstract:
A positive photosensitive polyimide resin composition comprising: (a) a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one solvent solubilizing functional group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g, (b) a photosensitive orthoquinonediazide compound, and (c) from 0.1 to 50 wt %, based on the total weight of all polymers of the composition, of a component (c1) or (c2), wherein: component (c1) is a solvent-soluble polyimide comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one functional group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g, and component (c2) is a polyamic acid comprised of from 1 to 100 mol % of a bivalent organic group derived from a diamine, that has at least one functional group selected from the group consisting of a long chain alkyl group having at least 6 carbon atoms and a fluorinated alkyl group, the polyimide having a reduced viscosity ranging from 0.05 to 5.0 dl/g.
Abstract:
A liquid crystal alignment agent comprising a polymer having a specific unit structure, and a method for alignment of liquid crystal molecules by light irradiation without any rubbing treatment, provides liquid crystal alignment films with higher heat sensitivity, heat stability and light resistance.
Abstract:
A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented. Namely, the present invention presents a positive type photosensitive polyimide resin composition characterized by comprising 100 parts by weight of a solvent-soluble polyimide having repeating units represented by the formula (1) and from 1 to 50 parts by weight of a polyimide precursor having repeating units represented by the formula (2), and by further containing an o-quinonediazide compound in an amount of from 1 to 100 parts by weight per 100 parts by weight of the total amount of the repeating units represented by the formula (1) and the repeating units represented by the formula (2): (wherein R1 and R3 are bivalent organic groups, from 1 to 90 mol % of R1 is a bivalent organic group having one or plural groups of at least one type selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and from 10 to 99 mol % is a bivalent organic group having no phenolic hydroxyl, carboxylic, thiophenol or sulfonic group, and R2 and R4 are tetravalent organic groups constituting a tetracarboxylic acid or its derivative).
Abstract:
The present invention relates to a treating agent for liquid crystal alignment, which is an agent for liquid crystal alignment to be used for a method in which polarized ultraviolet rays or electron rays are irradiated on a polymer thin film formed on a substrate in a predetermined direction relative to the substrate plane, and said substrate is used for aligning liquid crystal without rubbing treatment, wherein said agent for liquid crystal alignment contains a polymer compound having photochemically reactive groups in the polymer main chain and a glass transition temperature of at least 200° C.
Abstract:
The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which provides a dimensionally stable patterns after curing, and of which the final cured film has a low water absorption and excellent alkaline resistance. A positive photosensitive polyimide resin composition characterized by comprising an organic solvent-soluble polyimide having repeating units represented by the formula (1): (wherein m is an integer of from 3 to 10,000, R1 is a tetravalent organic group, R2 is a bivalent organic group, provided that from 5 to 100 mol % of R2 is a bivalent organic group having fluorine), a polyamic acid and a compound capable of generating an acid by irradiation with light.
Abstract:
Decane compound or decene compound shown in the formula [1] below wherein A1 and A2 are independently hydrogen or (meth)acryloyl group or 2-vinyloxyethyl group; and the dotted line is single bond or double bond with the proviso that A1 and A2 are not hydrogen at the same time; and curable resin composition containing said compound therein. The compound are suitable as the photo-monomer for resist raw materials because of high clarity at short wavelength ultraviolet light, dry etching resistance, adhesive property for the substrate and high solubility in alkaline developing solution in addition to high sensitivity and greater resolution; as the monomer for optic raw materials and disk overcoat materials because of high clarity, low birefringence and low water absorption rate; and as the monomer for the coating raw materials such as EB curable coating raw materials because of high reactivity, high wear characteristics and water resistance.
Abstract:
The present invention relates to a treating agent for liquid crystal alignment, which comprises a polyamic acid compound having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C. at a concentration of 0.5 g/dl) and containing repeating units represented by the general formula [I]: (wherein R1 is a tetravalent organic group constituting a tetracarboxylic acid which has an alicyclic structure having from 2 to 5 rings condensed and wherein all the carbonyl groups are directly bonded to the alicyclic structure and said carbonyl groups are not bonded to adjacent carbon atoms in the alicyclic structure, and R2 is a bivalent organic group constituting a diamine), or a polyimide resin obtained by imidizing said polyamic acid compound, and a liquid crystal alignment film and a liquid crystal device employing it.