公开(公告)号：US07666332B2

公开(公告)日：2010-02-23

申请号：US11947976

申请日：2007-11-30

申请人： Jun Sasai ,  Syuji Matsumoto ,  Takeshi Shimazaki ,  Naoki Sugimoto

发明人： Jun Sasai ,  Syuji Matsumoto ,  Takeshi Shimazaki ,  Naoki Sugimoto

IPC分类号： B29D11/00 ,  C03B11/00 ,  C03B11/12

CPC分类号： C03B11/005 ,  C03B32/00 ,  C03B2215/12 ,  C03B2215/24 ,  C03C3/15 ,  C03C3/253

摘要： To provide a production process capable of making the transmittance of an optical glass element obtainable by press-molding a TeO2-containing glass high.A process for producing an optical glass element, which comprises press-molding a TeO2-containing glass, wherein the press-molding is carried out in an atmosphere in which the nitrogen partial pressure is at most 102 Pa. The above process for producing an optical glass element, wherein the face of a mold for the press-molding to be in contact with the glass is made of carbon. The above process for producing an optical glass element, wherein the molded glass obtained by the press-molding is held in an oxygen-containing atmosphere at a temperature within a range of at least a temperature lower by 50° C. than the glass transition point of the TeO2-containing glass and at most the softening point of the glass.

摘要翻译： 为了提供能够使通过将含TeO 2的玻璃的高压成型得到的光学玻璃元件的透射率的制造方法。 一种光学玻璃元件的制造方法，其特征在于，包括对含TeO 2的玻璃进行加压成型，其中，所述加压成型是在氮分压为102Pa以下的气氛中进行的。 玻璃元件，其中用于加压成型的与玻璃接触的模具的表面由碳制成。 上述制造光学玻璃元件的方法，其中通过压制成型获得的模制玻璃在至少比玻璃化转变点低50℃的温度范围内的含氧气氛中保持 的含TeO 2的玻璃，并且至多为玻璃的软化点。

公开(公告)号：US20060231737A1

公开(公告)日：2006-10-19

申请号：US11325529

申请日：2006-01-05

申请人： Syuji Matsumoto ,  Tomoyuki Kobayashi ,  Naoki Sugimoto ,  Satoshi Fujimine ,  Nobuhiro Nakamura

发明人： Syuji Matsumoto ,  Tomoyuki Kobayashi ,  Naoki Sugimoto ,  Satoshi Fujimine ,  Nobuhiro Nakamura

IPC分类号： H01L27/00

CPC分类号： H01L33/00 ,  C03C3/122 ,  C03C3/19 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting diode element having a light emitting diode sealed by glass, wherein the glass consists essentially of, as represented by mol % based on the following oxides, from 30 to 70% of SnO, from 15 to 50% of P2O5, from 0.1 to 20% of ZnO, from 0 to 10% of SiO2+GeO2, from 0 to 30% of Li2O+Na2O+K2O, and from 0 to 20% of MgO+CaO+SrO+BaO. Glass for covering a light emitting diode element, which has an internal transmittance of at least 80% with thickness of 1 mm for a light having a wavelength of 405. nm and which consists essentially of, as represented by mol % based on the following oxides, from 40 to 53% of TeO2, from 0 to 10% of GeO2, from 5 to 30% of B2O3, from 0 to 10% of Ga2O3, from 0 to 10% of Bi2O3, from 3 to 20% of ZnO, from 0 to 3% of Y2O3, from 0 to 3% of La2O3, from 0 to 7% of Gd2O3 and from 0 to 5% of Ta2O5, and TeO2+B2O3 is at most 75 mol %.

摘要翻译： 具有由玻璃密封的发光二极管的发光二极管元件，其中所述玻璃基本上由以下氧化物的摩尔％表示：SnO 30-70％，P < 2％O 5，0.1％至20％的ZnO，0至10％的SiO 2 + GeO 2 2，来自 0〜30％的Li 2 O + Na 2 O + K 2 O，0〜20％的MgO + CaO + SrO +宝。 用于覆盖发光二极管元件的玻璃，对于具有405nm波长的光，其具有至少80％的内部透射率，厚度为1mm，并且基本上由以下氧化物的摩尔％表示 ，40〜53％的TeO 2，0〜10％的GeO 2 2，5〜30％的B 2 O 2， 0〜10％的Ga 2 O 3，0〜10％的Bi 2 O 3， 3％〜3％，3％〜20％的ZnO，0〜3％的Y 2 O 3 3，0〜3％的La _{2 3，0〜7％的Gd 2 O 3 3和0〜5％的Ta 2 5，并且TeO 2 + B 2 O 3 3至多为75摩尔 ％。}

公开(公告)号：US08461069B2

公开(公告)日：2013-06-11

申请号：US13270761

申请日：2011-10-11

申请人： Syuji Matsumoto ,  Tomoyuki Kobayashi ,  Naoki Sugimoto ,  Satoshi Fujimine ,  Nobuhiro Nakamura

发明人： Syuji Matsumoto ,  Tomoyuki Kobayashi ,  Naoki Sugimoto ,  Satoshi Fujimine ,  Nobuhiro Nakamura

IPC分类号： C03C3/62 ,  H01L33/00 ,  C03C3/19

CPC分类号： H01L33/00 ,  C03C3/122 ,  C03C3/19 ,  H01L33/54 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting diode element having a light emitting diode; and a glass covering sealing the light emitting diode is provided. The glass of the covering consists essentially of from 30 to 70 mol% of SnO, from 15 to 50 mol% of P2O5, from 0.1 to 20 mol% of ZnO, from 0 to 10 mol% of SiO2+GeO2, from 0 to 30% of Li2O+Na2O+K2O, and from 0 to 20% of MgO+CaO+SrO+BaO. In an embodiment, a refractive index of the glass of the covering is at least 1.6 at a wavelength of 400nm.

摘要翻译： 一种具有发光二极管的发光二极管元件; 并提供密封发光二极管的玻璃盖。 该覆盖层的玻璃基本上由SnO 30-70mol％，P2O5 15-50mol％，氧化铝0.1-20mol％，SiO 2 + GeO 0至10mol％，0至30 ％的Li 2 O + Na 2 O + K 2 O，0〜20％的MgO + CaO + SrO + BaO。 在一个实施例中，覆盖玻璃的折射率在400nm波长处至少为1.6。

公开(公告)号：US20120187448A1

公开(公告)日：2012-07-26

申请号：US13339577

申请日：2011-12-29

申请人： Syuji MATSUMOTO

发明人： Syuji MATSUMOTO

IPC分类号： H01L33/52 ,  C03C3/16

CPC分类号： C03C3/16 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2924/181 ,  Y10T428/1414 ,  Y10T428/166 ,  Y10T428/252 ,  H01L2924/00012

摘要： Glass is provided which is capable of covering at a covering treatment temperature of at most 400° C. and which has a low thermal expansion coefficient and excellent weather resistance. Glass comprising, as represented by mol % based on oxides, from 29% to 33% of P2O5, from 43% to 58% of SnO, from 11% to 25% of ZnO, from 0.1% to 2% of Ga2O3, from 0.5% to 5% of CaO, and from 0% to 1% of SrO, provided that the sum X of ZnO, Ga2O3 and CaO is within a range of from 13% to 27%, as represented by mol % based on oxides.

摘要翻译： 提供能够以最高400℃的覆盖处理温度覆盖并且具有低热膨胀系数和优异耐候性的玻璃。 包含以氧化物的摩尔％表示的玻璃，P 2 O 5的29％至33％，SnO的43％至58％，ZnO的11％至25％，Ga 2 O 3的0.1％至2％，0.5 CaO至5％，SrO 0％〜1％，条件是ZnO，Ga2O3，CaO的和X为13〜27％的范围，以氧化物的摩尔％表示。

公开(公告)号：US07872417B2

公开(公告)日：2011-01-18

申请号：US11870714

申请日：2007-10-11

申请人： Nobuhiro Nakamura ,  Syuji Matsumoto ,  Hitoshi Onoda ,  Yutaka Segawa ,  Tetsuro Matsumoto ,  Hiroshi Usui

发明人： Nobuhiro Nakamura ,  Syuji Matsumoto ,  Hitoshi Onoda ,  Yutaka Segawa ,  Tetsuro Matsumoto ,  Hiroshi Usui

IPC分类号： H01J1/62 ,  H01L33/00

CPC分类号： H01L33/54 ,  C03C3/253 ,  C03C27/00 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A diode chip is sealed by a glass material.There are provided a light emitting diode chip and a glass member in close contact with at least one portion of the surface of the light emitting diode chip. The glass member has a surface shape containing a curved surface at least a portion thereof. The curved surface is preferably a portion of a spherical surface or a spheroidal surface. The glass member has a surface shape containing a spherical portion and a flat portion, and the diode chip is preferably disposed on the flat portion.

摘要翻译： 二极管芯片由玻璃材料密封。 提供了与发光二极管芯片的表面的至少一部分紧密接触的发光二极管芯片和玻璃构件。 玻璃构件的至少一部分具有包含弯曲表面的表面形状。 弯曲表面优选是球形表面或球形表面的一部分。 玻璃构件具有包含球形部分和平坦部分的表面形状，并且二极管芯片优选地设置在平坦部分上。

公开(公告)号：US07754631B2

公开(公告)日：2010-07-13

申请号：US12349559

申请日：2009-01-07

申请人： Terutaka Maehara ,  Manabu Nishizawa ,  Junichiro Kase ,  Syuji Matsumoto

发明人： Terutaka Maehara ,  Manabu Nishizawa ,  Junichiro Kase ,  Syuji Matsumoto

IPC分类号： C03C3/087 ,  C03C3/091 ,  C03C3/083 ,  C03C3/085 ,  C03C3/078

CPC分类号： C03C3/091 ,  G02F2001/133302 ,  G02F2202/09

摘要： To provide an alkali-free glass substrate, which has a high Young's modulus, a low linear expansion coefficient, a high strain point and a low density, does not devitrify in the float forming process and is excellent in acid resistance.An alkali-free glass substrate, which contains neither alkali component nor BaO and consists essentially of, as represented by mol % based on oxide, from 57.0 to 65.0% of SiO2, from 10.0 to 12.0% of Al2O3, from 6.0 to 9.0% of B2O3, from 5.0 to 10.0% of MgO, from 5.0 to 10.0% of CaO and from 2.5 to 5.5% of SrO, provided that MgO+CaO+SrO is from 16.0 to 19.0%, MgO/(MgO+CaO+SrO)≧0.40, and B2O3/(SiO2+Al2O3+B2O3)≦0.12; wherein Young's modulus ≧75 GPa; the linear expansion coefficient at from 50 to 350° C. is from 30×10−7/° C. to 40×10−7/° C.; the strain point ≧640° C.; the temperature T2 (the viscosity η satisfies log η=2)≦1,620° C.; the temperature T4 (the viscosity η satisfies log η=4)≦1,245° C.; the devitrification temperature ≦T4; and weight loss per unit area is at most 0.6 mg/cm2, when immersed in 0.1N HCl at 90° C. for 20 hours.

摘要翻译： 为了提供具有高杨氏模量，低线膨胀系数，高应变点和低密度的无碱玻璃基板，在浮法成形工艺中不会失透，并且耐酸性优异。 不含碱成分和BaO的碱性玻璃基材，其基本上由氧化物的摩尔％表示，SiO 2为57.0〜65.0％，Al 2 O 3为10.0〜12.0％，Al 2 O 3为6.0〜9.0％ B 2 O 3，MgO 5.0〜10.0％，CaO 5.0〜10.0％，SrO 2.5〜5.5％，MgO + CaO + SrO为16.0〜19.0％，MgO /（MgO + CaO + SrO）≥ 0.40和B2O3 /（SiO2 + Al2O3 + B2O3）＆nlE; 0.12; 其中杨氏模量≥75GPa; 50〜350℃的线膨胀系数为30×10 -7 /℃至40×10 -7 /℃。 应变点≧640℃。 温度T2（粘度＆eegr;满足log＆eegr = 2）＆nlE; 1,620℃。 温度T4（粘度＆eegr;满足log＆eegr; = 4）＆nlE; 1,245℃; 失透温度＆nlE; T4; 当在90℃下浸入0.1N HCl中20小时时，每单位面积的重量损失为0.6mg / cm 2以下。

公开(公告)号：US20090176640A1

公开(公告)日：2009-07-09

申请号：US12349559

申请日：2009-01-07

申请人： Terutaka Maehara ,  Manabu Nishizawa ,  Junichiro Kase ,  Syuji Matsumoto

发明人： Terutaka Maehara ,  Manabu Nishizawa ,  Junichiro Kase ,  Syuji Matsumoto

IPC分类号： C03C3/091 ,  C03B18/00

CPC分类号： C03C3/091 ,  G02F2001/133302 ,  G02F2202/09

摘要： To provide an alkali-free glass substrate, which has a high Young's modulus, a low linear expansion coefficient, a high strain point and a low density, does not devitrify in the float forming process and is excellent in acid resistance.An alkali-free glass substrate, which contains neither alkali component nor BaO and consists essentially of, as represented by mol % based on oxide, from 57.0 to 65.0% of SiO2, from 10.0 to 12.0% of Al2O3, from 6.0 to 9.0% of B2O3, from 5.0 to 10.0% of MgO, from 5.0 to 10.0% of CaO and from 2.5 to 5.5% of SrO, provided that MgO+CaO+SrO is from 16.0 to 19.0%, MgO/(MgO+CaO+SrO)≧0.40, and B2O3/(SiO2+Al2O3+B2O3)≦0.12; wherein Young's modulus ≧75 GPa; the linear expansion coefficient at from 50 to 350° C. is from 30×10−7/° C. to 40×10−7/° C.; the strain point ≧640° C.; the temperature T2 (the viscosity η satisfies log η=2)≦1,620° C.; the temperature T4 (the viscosity η satisfies log η=4)≦1,245° C.; the devitrification temperature ≦T4; and weight loss per unit area is at most 0.6 mg/cm2, when immersed in 0.1N HCl at 90° C. for 20 hours.

摘要翻译： 为了提供具有高杨氏模量，低线膨胀系数，高应变点和低密度的无碱玻璃基板，在浮法成形工艺中不会失透，并且耐酸性优异。 不含碱成分和BaO的碱性玻璃基材，其基本上由氧化物的摩尔％表示，SiO 2为57.0〜65.0％，Al 2 O 3为10.0〜12.0％，Al 2 O 3为6.0〜9.0％ B2O3为5.0〜10.0％，CaO为5.0〜10.0％，SrO为2.5〜5.5％，MgO + CaO + SrO为16.0〜19.0％，MgO /（MgO + CaO + SrO） = 0.40，B2O3 /（SiO2 + Al2O3 + B2O3）= 0.12; 其中杨氏模量> 75GPa; 在50至350℃的线性膨胀系数为30×10 -7 /℃至40×10 -7 /℃。 应变点> = 640°C。 温度T2（粘度eta满足log eta = 2）= 1,620℃。 温度T4（粘度eta满足log eta = 4）<= 1,245℃。 失透温度<= T4; 当在90℃下浸入0.1N HCl中20小时时，每单位面积的重量损失为0.6mg / cm 2以下。

公开(公告)号：US07514381B2

公开(公告)日：2009-04-07

申请号：US11616179

申请日：2006-12-26

申请人： Syuji Matsumoto ,  Jun Sasai ,  Naoki Sugimoto

发明人： Syuji Matsumoto ,  Jun Sasai ,  Naoki Sugimoto

IPC分类号： C03C3/15 ,  C03C3/155 ,  C03C3/14 ,  C03C3/12

CPC分类号： C03C3/15 ,  C03C3/253

摘要： To provide an optical glass which has a high transmittance and a high refractive index and shows little decrease in the transmitted light intensity when continuously irradiated with a blue-violet laser diode light, and which is less prone to a higher melting temperature and exhibits chemical durability being not low. An optical glass consisting essentially of, as represented by mol %, from 35 to 54% of TeO2, from 0 to 10% of GeO2, from 5 to 30% of B2O3, from 0 to 15% of Ga2O3, from 0 to 8% of Bi2O3, from 3 to 20% of ZnO, from 0 to 10% of MgO+CaO+SrO+BaO, from 1 to 10% of Y2O3+La2O3+Gd2O3, from 0 to 5% of Ta2O5+Nb2O5, from 0 to 1.8% of TiO2, and from 0 to 6% of Li2O+Na2O+K2O+Rb2O+Cs2O. A lens made of such an optical glass.

摘要翻译： 为了提供一种具有高透射率和高折射率的光学玻璃，当连续照射蓝紫色激光二极管灯时，透射光强度几乎没有降低，并且不太容易产生较高的熔融温度并具有化学耐久性 不低 基本上由摩尔％表示的TeO 3为35至54％，0至10％的GeO 2，5至30％的B 2 O 3，0至15％的Ga 2 O 3，0至8％ 的Bi 2 O 3，3〜20％的ZnO，0〜10％的MgO + CaO + SrO + BaO，1〜10％的Y2O3 + La2O3 + Gd2O3，0〜5％的Ta2O5 + Nb2O5，0〜 1.8％的TiO2和0〜6％的Li2O + Na2O + K2O + Rb2O + Cs2O。 由这种光学玻璃制成的镜片。

公开(公告)号：US20080136326A1

公开(公告)日：2008-06-12

申请号：US11870714

申请日：2007-10-11

申请人： Nobuhiro Nakamura ,  Syuji Matsumoto ,  Hitoshi Onoda ,  Yutaka Segawa ,  Tetsuro Matsumoto ,  Hiroshi Usui

发明人： Nobuhiro Nakamura ,  Syuji Matsumoto ,  Hitoshi Onoda ,  Yutaka Segawa ,  Tetsuro Matsumoto ,  Hiroshi Usui

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  C03C3/253 ,  C03C27/00 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A diode chip is sealed by a glass material.There are provided a light emitting diode chip and a glass member in close contact with at least one portion of the surface of the light emitting diode chip. The glass member has a surface shape containing a curved surface at least a portion thereof. The curved surface is preferably a portion of a spherical surface or a spheroidal surface. The glass member has a surface shape containing a spherical portion and a flat portion, and the diode chip is preferably disposed on the flat portion.

摘要翻译： 二极管芯片由玻璃材料密封。 提供了与发光二极管芯片的表面的至少一部分紧密接触的发光二极管芯片和玻璃构件。 玻璃构件的至少一部分具有包含弯曲表面的表面形状。 弯曲表面优选是球形表面或球形表面的一部分。 玻璃构件具有包含球形部分和平坦部分的表面形状，并且二极管芯片优选地设置在平坦部分上。

公开(公告)号：US20080127679A1

公开(公告)日：2008-06-05

申请号：US11969532

申请日：2008-01-04

申请人： Manabu Nishizawa ,  Junichiro Kase ,  Kenta Saito ,  Kei Maeda ,  Syuji Matsumoto

发明人： Manabu Nishizawa ,  Junichiro Kase ,  Kenta Saito ,  Kei Maeda ,  Syuji Matsumoto

IPC分类号： C03B5/225 ,  C03C3/091

CPC分类号： C03B5/225 ,  C03B5/2252 ,  C03C1/004 ,  C03C3/091 ,  Y02P40/57

摘要： To provide a process for producing and alkali free glass for effectively suppressing bubbles, and an alkali free glass produced by the process, which is suitable as a glass substrate for flat panel displays and has few bubbles.A process for producing an alkali free glass containing substantially no alkali metal oxide, which comprises melting a glass starting material having a matrix composition of the following composition, and subjecting the molten glass to a treatment process of removing bubbles under reduced pressure, stirring or transferring under a condition where the molten glass is in contact with a platinum member, wherein the starting material is prepared so as to contain SnO2 in an amount of from 0.01 to 2.0% per 100% of the total amount of the above matrix composition; the starting material is melted under heating at from 1,500 to 1,650° C.; then bubbles contained in the molten glass are permitted to rise to the surface of the molten glass, together with oxygen bubbles generated by a reduction reaction in which SnO2 in the molten glass is reduced to SnO; and in the above treatment process, the oxygen bubbles generated at the interface between the molten glass and the platinum member are permitted to be absorbed by an oxidation reaction in which SnO is oxidized to SnO2, under a condition where the molten glass is from 1,300 to 1,500° C.Composition as represented by the mass percentage: SiO258.4 to 66.0%, Al2O315.3 to 22.0%, B2O3 5.0 to 12.0%, MgO  0 to 6.5%, CaO  0 to 7.0%, SrO  4 to 12.5%, BaO  0 to 2.0%, MgO + CaO + SrO + BaO 9.0 to 18.0%.