发明申请
- 专利标题： GLASS-SEALED LIGHT EMITTING ELEMENT, CIRCUIT BOARD WITH THE GLASS-SEALED LIGHT EMITTING ELEMENT, AND METHODS FOR MANUFACTURING THOSE
- 专利标题（中）： 玻璃密封发光元件，带有玻璃密封发光元件的电路板及其制造方法
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申请号： US11870714申请日： 2007-10-11
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公开(公告)号： US20080136326A1公开(公告)日： 2008-06-12
- 发明人: Nobuhiro Nakamura , Syuji Matsumoto , Hitoshi Onoda , Yutaka Segawa , Tetsuro Matsumoto , Hiroshi Usui
- 申请人： Nobuhiro Nakamura , Syuji Matsumoto , Hitoshi Onoda , Yutaka Segawa , Tetsuro Matsumoto , Hiroshi Usui
- 申请人地址： JP Chiyoda-ku
- 专利权人： ASAHI GLASS COMPANY LIMITED
- 当前专利权人： ASAHI GLASS COMPANY LIMITED
- 当前专利权人地址： JP Chiyoda-ku
- 优先权： JP2005-118415 20050415; JP2005-322943 20051107
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A diode chip is sealed by a glass material.There are provided a light emitting diode chip and a glass member in close contact with at least one portion of the surface of the light emitting diode chip. The glass member has a surface shape containing a curved surface at least a portion thereof. The curved surface is preferably a portion of a spherical surface or a spheroidal surface. The glass member has a surface shape containing a spherical portion and a flat portion, and the diode chip is preferably disposed on the flat portion.
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