公开(公告)号：US20120208374A1

公开(公告)日：2012-08-16

申请号：US13455916

申请日：2012-04-25

申请人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

发明人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

IPC分类号： H01L21/312

CPC分类号： H01L21/02115 ,  C23C16/26 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/0338

摘要： Embodiments described herein relate to materials and processes for patterning and etching features in a semiconductor substrate. In one embodiment, a method of forming a composite amorphous carbon layer is provided. The method comprises positioning a substrate in a process chamber, introducing a hydrocarbon source gas into the process chamber, introducing a diluent source gas into the process chamber, introducing a plasma-initiating gas into the process chamber, generating a plasma in the process chamber, forming an amorphous carbon initiation layer on the substrate, wherein the hydrocarbon source gas has a volumetric flow rate to diluent source gas flow rate ratio of 1:12 or less, and forming a bulk amorphous carbon layer on the amorphous carbon initiation layer, wherein a hydrocarbon source gas used to form the bulk amorphous carbon layer has a volumetric flow rate to a diluent source gas flow rate of 1:6 or greater.

摘要翻译： 本文描述的实施例涉及用于图案化和蚀刻半导体衬底中的特征的材料和工艺。 在一个实施方案中，提供了形成复合无定形碳层的方法。 该方法包括将基板定位在处理室中，将烃源气体引入处理室中，将稀释源气体引入处理室，将等离子体起始气体引入处理室，在处理室中产生等离子体， 在所述基板上形成无定形碳起始层，其中所述烃源气体的体积流量与稀释剂源气体流量比为1:12以下，并且在所述无定形碳起始层上形成块状无定形碳层，其中， 用于形成大块无定形碳层的烃源气体的体积流量为稀释剂源气体流速为1：6或更大。

公开(公告)号：US20110159211A1

公开(公告)日：2011-06-30

申请号：US12974365

申请日：2010-12-21

申请人： Dale R. Du Bois ,  Mohamad A. Ayoub ,  Robert Kim ,  Amit Bansal ,  Mark Fodor ,  Binh Nguyen ,  Siu F. Cheng ,  Hang Yu ,  Chiu Chan ,  Ganesh Balasubramanian ,  Deenesh Padhi ,  Juan Carlos Rocha

发明人： Dale R. Du Bois ,  Mohamad A. Ayoub ,  Robert Kim ,  Amit Bansal ,  Mark Fodor ,  Binh Nguyen ,  Siu F. Cheng ,  Hang Yu ,  Chiu Chan ,  Ganesh Balasubramanian ,  Deenesh Padhi ,  Juan Carlos Rocha

IPC分类号： C23C16/00 ,  B05C11/00

CPC分类号： C23C16/04 ,  C23C14/04 ,  C23C14/042 ,  C23C16/042 ,  C23C16/4401 ,  C23C16/45589 ,  C23C16/4585 ,  C30B25/12 ,  H01J37/32642 ,  H01J37/32651 ,  H01J37/32715 ,  H01J37/3441 ,  H01L21/68721 ,  H01L21/68735

摘要： Embodiments of the invention contemplate a shadow ring that provides increased or decreased and more uniform deposition on the edge of a wafer. By removing material from the top and/or bottom surfaces of the shadow ring, increased edge deposition and bevel coverage can be realized. In one embodiment, the material on the bottom surface is reduced by providing a recessed slot on the bottom surface. By increasing the amount of material of the shadow ring, the edge deposition and bevel coverage is reduced. Another approach to adjusting the deposition at the edge of the wafer includes increasing or decreasing the inner diameter of the shadow ring. The material forming the shadow ring may also be varied to change the amount of deposition at the edge of the wafer.

摘要翻译： 本发明的实施例设想一种阴影环，其在晶片的边缘上提供增加或减少的和更均匀的沉积。 通过从阴影环的顶部和/或底部表面去除材料，可以实现增加的边缘沉积和斜面覆盖。 在一个实施例中，通过在底表面上设置凹槽来减小底表面上的材料。 通过增加阴影环的材料量，降低了边缘沉积和斜面覆盖。 调整晶片边缘处沉积的另一种方法包括增加或减小阴影环的内径。 形成阴影环的材料也可以改变以改变晶片边缘处的沉积量。

公开(公告)号：US08349741B2

公开(公告)日：2013-01-08

申请号：US13455916

申请日：2012-04-25

申请人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

发明人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

IPC分类号： H01L21/308 ,  H01L21/32

CPC分类号： H01L21/02115 ,  C23C16/26 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/0338

摘要： Embodiments described herein relate to materials and processes for patterning and etching features in a semiconductor substrate. In one embodiment, a method of forming a composite amorphous carbon layer is provided. The method comprises positioning a substrate in a process chamber, introducing a hydrocarbon source gas into the process chamber, introducing a diluent source gas into the process chamber, introducing a plasma-initiating gas into the process chamber, generating a plasma in the process chamber, forming an amorphous carbon initiation layer on the substrate, wherein the hydrocarbon source gas has a volumetric flow rate to diluent source gas flow rate ratio of 1:12 or less, and forming a bulk amorphous carbon layer on the amorphous carbon initiation layer, wherein a hydrocarbon source gas used to form the bulk amorphous carbon layer has a volumetric flow rate to a diluent source gas flow rate of 1:6 or greater.

摘要翻译： 本文描述的实施例涉及用于图案化和蚀刻半导体衬底中的特征的材料和工艺。 在一个实施方案中，提供了形成复合无定形碳层的方法。 该方法包括将基板定位在处理室中，将烃源气体引入处理室中，将稀释源气体引入处理室，将等离子体起始气体引入处理室，在处理室中产生等离子体， 在所述基板上形成无定形碳起始层，其中所述烃源气体的体积流量与稀释剂源气体流量比为1:12以下，并且在所述无定形碳起始层上形成块状无定形碳层，其中， 用于形成大块无定形碳层的烃源气体的体积流量为稀释剂源气体流速为1：6或更大。

公开(公告)号：US20120208339A1

公开(公告)日：2012-08-16

申请号：US13456058

申请日：2012-04-25

申请人： Siu F. Cheng ,  Deenesh PADHI

发明人： Siu F. Cheng ,  Deenesh PADHI

IPC分类号： H01L21/02

CPC分类号： H01L45/04 ,  H01L28/20 ,  H01L45/145

摘要： A method and apparatus is provided for forming a resistive memory device having good adhesion among the components thereof. A first conductive layer is formed on a substrate, and the surface of the first conductive layer is treated to add adhesion promoting materials to the surface. The adhesion promoting materials may form a layer on the surface, or they may incorporate into the surface or merely passivate the surface of the first conductive layer. A variable resistance layer is formed on the treated surface, and a second conductive layer is formed on the variable resistance layer. Adhesion promoting materials may also be included at the interface between the variable resistance layer and the second conductive layer.

摘要翻译： 提供了一种用于形成其组件之间具有良好粘附性的电阻式存储器件的方法和装置。 在基板上形成第一导电层，并处理第一导电层的表面以向表面添加增粘材料。 粘合促进材料可以在表面上形成一层，或者它们可以结合到表面中或仅仅钝化第一导电层的表面。 在经处理​​的表面上形成可变电阻层，在可变电阻层上形成第二导电层。 粘合促进材料也可以包括在可变电阻层和第二导电层之间的界面处。

公开(公告)号：US08227352B2

公开(公告)日：2012-07-24

申请号：US13093679

申请日：2011-04-25

申请人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

发明人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

IPC分类号： H01L21/308 ,  H01L21/32

CPC分类号： H01L21/02115 ,  C23C16/26 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/0338

摘要： Embodiments described herein relate to materials and processes for patterning and etching features in a semiconductor substrate. In one embodiment, a method of forming a composite amorphous carbon layer for improved stack defectivity on a substrate is provided. The method comprises positioning a substrate in a process chamber, introducing a hydrocarbon source gas into the process chamber, introducing a diluent source gas into the process chamber, introducing a plasma-initiating gas into the process chamber, generating a plasma in the process chamber, forming an amorphous carbon initiation layer on the substrate, wherein the hydrocarbon source gas has a volumetric flow rate to diluent source gas flow rate ratio of 1:12 or less; and forming a bulk amorphous carbon layer on the amorphous carbon initiation layer, wherein a hydrocarbon source gas used to form the bulk amorphous carbon layer has a volumetric flow rate to a diluent source gas flow rate of 1:6 or greater to form the composite amorphous carbon layer.

摘要翻译： 本文描述的实施例涉及用于图案化和蚀刻半导体衬底中的特征的材料和工艺。 在一个实施例中，提供了形成用于提高衬底缺陷率的复合非晶碳层的方法。 该方法包括将基板定位在处理室中，将烃源气体引入处理室中，将稀释源气体引入处理室，将等离子体起始气体引入处理室，在处理室中产生等离子体， 在所述基板上形成无定形碳起始层，其中所述烃源气体的体积流量与稀释剂源气体流量比为1:12以下; 以及在所述无定形碳起始层上形成块状无定形碳层，其中用于形成所述块状无定形碳层的烃源气体具有以1:6或更大的稀释剂源气体流量的体积流量，以形成所述复合非晶体 碳层。

公开(公告)号：US20090269512A1

公开(公告)日：2009-10-29

申请号：US12110879

申请日：2008-04-28

申请人： Jianhua Zhou ,  Deenesh Padhi ,  Karthik Janakiraman ,  Hang Yu ,  Siu F. Cheng ,  Yoganand Saripalli ,  Tersem Summan

发明人： Jianhua Zhou ,  Deenesh Padhi ,  Karthik Janakiraman ,  Hang Yu ,  Siu F. Cheng ,  Yoganand Saripalli ,  Tersem Summan

IPC分类号： C23C16/44

CPC分类号： C23C16/5096 ,  H01J37/32541 ,  Y10T117/10

摘要： A method and apparatus for adjust local plasma density during a plasma process. One embodiment provides an electrode assembly comprising a conductive faceplate having a nonplanar surface. The nonplanar surface is configured to face a substrate during processing and the conductive faceplate is disposed so that the nonplanar surface is opposing a substrate support having an electrode. The conductive faceplate and the substrate support form a plasma volume. The nonplanar surface is configured to adjust electric field between the conductive plate and the electrode by varying a distance between the conductive plate and the electrode.

摘要翻译： 一种用于在等离子体工艺期间调节局部等离子体密度的方法和装置。 一个实施例提供了一种电极组件，其包括具有非平面表面的导电面板。 非平面表面被配置为在处理期间面向衬底，并且设置导电面板使得非平面表面与具有电极的衬底支撑件相对。 导电面板和基板支撑件形成等离子体体积。 非平面被配置为通过改变导电板和电极之间的距离来调节导电板和电极之间的电场。

公开(公告)号：US08097082B2

公开(公告)日：2012-01-17

申请号：US12110879

申请日：2008-04-28

申请人： Jianhua Zhou ,  Deenesh Padhi ,  Karthik Janakiraman ,  Hang Yu ,  Siu F. Cheng ,  Yoganand Saripalli ,  Tersem Summan

发明人： Jianhua Zhou ,  Deenesh Padhi ,  Karthik Janakiraman ,  Hang Yu ,  Siu F. Cheng ,  Yoganand Saripalli ,  Tersem Summan

IPC分类号： C23C16/50

CPC分类号： C23C16/5096 ,  H01J37/32541 ,  Y10T117/10

摘要： A method and apparatus for adjust local plasma density during a plasma process. One embodiment provides an electrode assembly comprising a conductive faceplate having a nonplanar surface. The nonplanar surface is configured to face a substrate during processing and the conductive faceplate is disposed so that the nonplanar surface is opposing a substrate support having an electrode. The conductive faceplate and the substrate support form a plasma volume. The nonplanar surface is configured to adjust electric field between the conductive plate and the electrode by varying a distance between the conductive plate and the electrode.

摘要翻译： 一种用于在等离子体工艺期间调节局部等离子体密度的方法和装置。 一个实施例提供了一种电极组件，其包括具有非平面表面的导电面板。 非平面表面被配置为在处理期间面向衬底，并且设置导电面板使得非平面表面与具有电极的衬底支撑件相对。 导电面板和基板支撑件形成等离子体体积。 非平面被配置为通过改变导电板和电极之间的距离来调节导电板和电极之间的电场。

公开(公告)号：US08569105B2

公开(公告)日：2013-10-29

申请号：US13456058

申请日：2012-04-25

申请人： Siu F. Cheng ,  Deenesh Padhi

发明人： Siu F. Cheng ,  Deenesh Padhi

IPC分类号： H01L21/00

CPC分类号： H01L45/04 ,  H01L28/20 ,  H01L45/145

摘要： A method and apparatus is provided for forming a resistive memory device having good adhesion among the components thereof. A first conductive layer is formed on a substrate, and the surface of the first conductive layer is treated to add adhesion promoting materials to the surface. The adhesion promoting materials may form a layer on the surface, or they may incorporate into the surface or merely passivate the surface of the first conductive layer. A variable resistance layer is formed on the treated surface, and a second conductive layer is formed on the variable resistance layer. Adhesion promoting materials may also be included at the interface between the variable resistance layer and the second conductive layer.

摘要翻译： 提供了一种用于形成其组件之间具有良好粘附性的电阻式存储器件的方法和装置。 在基板上形成第一导电层，并处理第一导电层的表面以向表面添加增粘材料。 粘合促进材料可以在表面上形成一层，或者它们可以结合到表面中或仅仅钝化第一导电层的表面。 在经处理​​的表面上形成可变电阻层，在可变电阻层上形成第二导电层。 粘合促进材料也可以包括在可变电阻层和第二导电层之间的界面处。

公开(公告)号：US20120015521A1

公开(公告)日：2012-01-19

申请号：US13093679

申请日：2011-04-25

申请人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

发明人： Hang Yu ,  Deenesh Padhi ,  Man-Ping Cai ,  Naomi Yoshida ,  Li Yan Miao ,  Siu F. Cheng ,  Shahid Shaikh ,  Sohyun Park ,  Heung Lak Park ,  Bok Hoen Kim

IPC分类号： H01L21/308 ,  H01L21/32

CPC分类号： H01L21/02115 ,  C23C16/26 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/0338

摘要： Embodiments described herein relate to materials and processes for patterning and etching features in a semiconductor substrate. In one embodiment, a method of forming a composite amorphous carbon layer for improved stack defectivity on a substrate is provided. The method comprises positioning a substrate in a process chamber, introducing a hydrocarbon source gas into the process chamber, introducing a diluent source gas into the process chamber, introducing a plasma-initiating gas into the process chamber, generating a plasma in the process chamber, forming an amorphous carbon initiation layer on the substrate, wherein the hydrocarbon source gas has a volumetric flow rate to diluent source gas flow rate ratio of 1:12 or less; and forming a bulk amorphous carbon layer on the amorphous carbon initiation layer, wherein a hydrocarbon source gas used to form the bulk amorphous carbon layer has a volumetric flow rate to a diluent source gas flow rate of 1:6 or greater to form the composite amorphous carbon layer.

摘要翻译： 本文描述的实施例涉及用于图案化和蚀刻半导体衬底中的特征的材料和工艺。 在一个实施例中，提供了形成用于提高衬底缺陷率的复合非晶碳层的方法。 该方法包括将基板定位在处理室中，将烃源气体引入处理室中，将稀释源气体引入处理室，将等离子体起始气体引入处理室，在处理室中产生等离子体， 在所述基板上形成无定形碳起始层，其中所述烃源气体的体积流量与稀释剂源气体流量比为1:12以下; 以及在所述无定形碳起始层上形成块状无定形碳层，其中用于形成所述块状无定形碳层的烃源气体具有以1:6或更大的稀释剂源气体流量的体积流量，以形成所述复合非晶体 碳层。

公开(公告)号：US20110244142A1

公开(公告)日：2011-10-06

申请号：US12750378

申请日：2010-03-30

申请人： SIU F. CHENG ,  Jacob Janzen ,  Deenesh Padhi ,  Bok Hoen Kim

发明人： SIU F. CHENG ,  Jacob Janzen ,  Deenesh Padhi ,  Bok Hoen Kim

IPC分类号： C23C16/513

CPC分类号： H01L21/0273 ,  C23C16/26 ,  H01L21/02118 ,  H01L21/02274 ,  H01L21/3065

摘要： Embodiments described herein generally relate to the fabrication of integrated circuits and more particularly to nitrogen doped amorphous carbon layers and processes for depositing nitrogen doped amorphous carbon layers on a semiconductor substrate. In one embodiment, a method of forming a nitrogen doped amorphous carbon layer on a substrate is provided. The method comprises positioning a substrate in a substrate processing chamber, introducing a nitrogen containing hydrocarbon source into the processing chamber, introducing a hydrocarbon source into the processing chamber, introducing a plasma-initiating gas into the processing chamber, generating a plasma in the processing chamber, and forming a nitrogen doped amorphous carbon layer on the substrate.

摘要翻译： 本文描述的实施例通常涉及集成电路的制造，更具体地涉及氮掺杂非晶碳层以及用于在半导体衬底上沉积氮掺杂的非晶碳层的工艺。 在一个实施例中，提供了在衬底上形成氮掺杂非晶碳层的方法。 该方法包括将基板定位在基板处理室中，将含氮烃源引入处理室，将烃源引入处理室，将等离子体起始气体引入处理室，在处理室中产生等离子体 ，并在衬底上形成氮掺杂的无定形碳层。