公开(公告)号：US20050095774A1

公开(公告)日：2005-05-05

申请号：US10935430

申请日：2004-09-08

申请人： Yukihiro Ushiku ,  Akira Ogawa ,  Hidenori Kakinuma ,  Shunji Shuto ,  Masahiro Abe ,  Tatsuo Akiyama ,  Shigeru Komatsu

发明人： Yukihiro Ushiku ,  Akira Ogawa ,  Hidenori Kakinuma ,  Shunji Shuto ,  Masahiro Abe ,  Tatsuo Akiyama ,  Shigeru Komatsu

IPC分类号： H01L21/3065 ,  G05B19/418 ,  H01L21/00 ,  H01L21/02 ,  H01L21/31 ,  H01L21/316 ,  H01L21/331

CPC分类号： G05B19/4184 ,  G05B19/41885 ,  G05B2219/32368 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/22 ,  Y02P90/26 ,  Y02P90/265

摘要： The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.

摘要翻译： 本发明提供了一种在半导体器件制造系统中交错数据帧的解决方案，其中用于对其表面上的半导体衬底和薄膜中的任一个进行处理的处理装置; 用于诊断处理装置的状态的自诊断系统; 以及参数拟合装置，当已经确定了所述处理的半导体衬底的检查结果被确定为正确时，用于维持所述自我诊断系统的参数，并且当所述检查结果具有所述参数时，改变所述自我诊断系统的参数 被确定为不正确。

公开(公告)号：US07702413B2

公开(公告)日：2010-04-20

申请号：US10935430

申请日：2004-09-08

申请人： Yukihiro Ushiku ,  Akira Ogawa ,  Hidenori Kakinuma ,  Shunji Shuto ,  Masahiro Abe ,  Tatsuo Akiyama ,  Shigeru Komatsu

发明人： Yukihiro Ushiku ,  Akira Ogawa ,  Hidenori Kakinuma ,  Shunji Shuto ,  Masahiro Abe ,  Tatsuo Akiyama ,  Shigeru Komatsu

IPC分类号： G06F19/00

CPC分类号： G05B19/4184 ,  G05B19/41885 ,  G05B2219/32368 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/22 ,  Y02P90/26 ,  Y02P90/265

摘要： The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.

摘要翻译： 本发明提供了一种在半导体器件制造系统中交错数据帧的解决方案，其中用于对其表面上的半导体衬底和薄膜中的任一个进行处理的处理装置; 用于诊断处理装置的状态的自诊断系统; 以及参数拟合装置，当已经确定了所述处理的半导体衬底的检查结果被确定为正确时，用于维持所述自我诊断系统的参数，并且当所述检查结果具有所述参数时，改变所述自我诊断系统的参数 被确定为不正确。

公开(公告)号：US07623937B2

公开(公告)日：2009-11-24

申请号：US10935430

申请日：2004-09-08

申请人： Yukihiro Ushiku ,  Akira Ogawa ,  Hidenori Kakinuma ,  Shunji Shuto ,  Masahiro Abe ,  Tatsuo Akiyama ,  Shigeru Komatsu

发明人： Yukihiro Ushiku ,  Akira Ogawa ,  Hidenori Kakinuma ,  Shunji Shuto ,  Masahiro Abe ,  Tatsuo Akiyama ,  Shigeru Komatsu

IPC分类号： G06F19/00

摘要： The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.