摘要:
A semiconductor device has field shield isolation or trench type isolation between elements which suppresses penetration of field oxide into an element active region of the device. A common gate is located between two MOS transistors, which may be of opposite conductivity type. After gate electrode wiring layers are formed in a field region and an active region to the same level, a pad polysilicon film formed on the entire surface to cover the patterns of these gate electrode wiring layers, which are in separated patterns.
摘要:
A polycide wiring layer constituted by a polysilicon film and a silicide film is used as a bit line of a DRAM. When a memory cell region having an n-type impurity diffusion layer and a peripheral circuit region having a p-type impurity diffusion layer are to be electrically connected through the polysilicon film, a diffusion prevention film consisting of TiSiN or WSiN is formed as an underlying film of the polysilicon film. With this diffusion prevention film, interdiffusion between the n- and p-type impurity diffusion layers can be prevented. In addition, heat resistance at 900.degree. C. or more can be obtained in processes after formation of the diffusion prevention film.
摘要:
A semiconductor memory device has word line conductor films, bit line conductor films transverse to the word line conductor films and memory cells provided at intersections between the word line conductor films and bit line conductor films. Each memory cell has a transistor structure formed at a surface portion of a semiconductor substrate and a capacitor structure formed over the semiconductor substrate. The word line conductor films are formed at a level lower than the capacitor structures of the memory cells to improve the resolution of patterns for the semiconductor memory device.
摘要:
A semiconductor memory device comprises a plurality of memory cells on a semiconductor substrate, each including a transistor with a pair of impurity diffusion layers and a gate electrode, and a capacitor, a first insulating film covering the transistors, a plurality of parallel extending word lines formed on the substrate, each being connected to the gate electrode of the transistor of at least one selected memory cell, a plurality of bit lines, each connected to one of the pair of impurity diffusion layers of at least one selected memory cell through a first contact hole in the first insulating layer, each bit line formed with a conductive film on a top surface thereof and a second insulating film interposed therebetween, a lower electrode of the capacitor at a predetermined position on the first insulating film electrically connected to one of the bit lines and to the other of the pair of impurity diffusion layers through a second contact hole formed in the first insulating film, wherein the conductive film on the top surface of each of the bit lines is formed by a material having an etching rate lower than that of the first insulating film in etching the first insulating film for the second contact hole.
摘要:
A non-volatile semiconductor memory device capable of selectively storing one of at least three different data comprises a memory array including a plurality of memory cells, each having a control gate, a floating gate, a drain, and a source, a circuit for producing a stepped voltage whose level is varied stepwise to a number of different levels corresponding to a number of data to be stored, a circuit for producing a pulse voltage having a predetermined voltage level and a predetermined pulse width, and a circuit for selecting one of the plurality of memory cells, wherein during storing of the at least three different data the stepped voltage and the pulse voltage are applied to the control gate and the drain of the selected memory cell, respectively, while a timing of application of the pulse voltage to the drain is controlled relative to a timing of application of the stepped voltage to the control gate, depending on which of the at least three different data is to be stored into the selected memory cell.
摘要:
The MOS field-effect transistor has a semiconductor substrate of a first conductivity type, a pair of first polycrystalline silicon layers of a second conductivity type different from the first conductivity type which are formed on the semiconductor substrate and separated from each other by a small gap, a pair of diffusion layers of the second conductivity type formed in those regions of the semiconductor substrate which are in contact with the pair of first polycrystalline silicon layers, respectively, a gate insulating film formed to cover the pair of first polycrystalline silicon layers of the second conductivity type and a part of the semiconductor substrate exposed to an outside at the small gap, and a gate electrode formed on the gate insulating film. The nonvolatile semiconductor memory device is arranged by using the MOS field-effect transistor mentioned above.
摘要:
A non-volatile memory device is fabricated on a semiconductor substrate structure and comprises a word line formed by a buried layer in the semiconductor substrate structure and a plurality of memory cells associated with the word line, and each of the memory cells comprises a control gate region of formed in the semiconductor substrate structure and extending from the word line to a major surface portion of the semiconductor substrate structure, a first gate insulating film covering a top surface of the control gate region, a source region of formed in the major surface portion of the semiconductor substrate structure, a drain region formed in the major surface portion of the semiconductor substrate structure and spaced from the control gate region and the source region, a second gate insulating film provided over that area between the source and drain regions, and a floating gate electrode extending from the first gate insulating film to the second gate insulating film, since the word line extends below the major surface, the word line does not consume a real estate of the semiconductor substrate structure and, accordingly, enhances the integration density of the non-volatile memory device.
摘要:
The semiconductor memory device comprises a field shield element isolation structure for defining a plurality of element regions electrically isolated from one another; a plurality of memory cells disposed in a matrix of rows and columns, each including a transistor having two impurity diffusion layers, a gate electrode and a capacitor; a plurality of bit lines extending in a row direction; a plurality of word lines extending in a column direction; a plurality of memory cell pairs, each formed in one of the element regions and including adjacent two of the memory cells disposed in the row direction, wherein each of the transistors of the two memory cells in each memory cell pair has two impurity diffusion layers, one of which is common to both the transistors and connected to one of the bit lines extending in the row direction immediately thereabove through a first pad polycrystalline silicon film; a second pad polycrystalline silicon film formed on the other impurity diffusion layer of each transistor so as to extend over a portion of the element isolation structure defining the element region and adjacent thereto in the column direction; and a lower electrode of a capacitor of each memory cell in each memory cell pair formed on and insulated from the bit line connected to the common impurity diffusion layer of the respective transistors and connected to the other impurity diffusion layer of the transistor through one of the second pad polycrystalline films.
摘要:
A semiconductor substrate has two element forming regions and one element separation region between the two element forming regions. A shield electrode for electrically separating the two element forming regions is formed in the semiconductor substrate at the element separating region. A trench capacitor is formed in the semiconductor substrate at the element separation region. The trench capacitor has a trench, a first conductive layer covering at least the inner wall of the trench, a dielectric layer formed at least on the first conductive layer in the trench, and a second conductive layer formed at least on the dielectric layer in the trench. The shield electrode and the first conductive layer is made of the same layer. A transistor having a pair of impurity doped regions is formed in the semiconductor substrate at the element forming region, the second conductive layer of the trench capacitor is electrically connected to one of the pair of impurity doped regions of the transistor.
摘要:
A semiconductor memory device comprises a field shield element isolation structure defining a plurality of electrically isolated element regions and a plurality of memory cells in a matrix of rows and columns, each including a transistor having two impurity diffusion layers, a gate electrode and a capacitor. A plurality of bit lines extends in a row direction and a plurality of word lines in a column direction. A memory cell pair is formed in each of the element regions and includes two adjacent memory cells disposed in the row direction. Each of the transistors of the two memory cells in each pair has two impurity diffusion layers, one of which is common to both transistors and connected to one of the bit lines extending in the row direction immediately thereabove through a first pad polycrystalline silicon film. A second pad is formed on the other impurity diffusion layer of each transistor to extend over a portion of the element isolation structure and adjacent thereto in the column direction. A lower electrode of a capacitor of memory cell in each pair is formed on and insulated from the bit line connected to the common impurity diffusion layer of the respective transistors and to the other impurity diffusion layer through one of the second pad polycrysatalline films.