公开(公告)号：US20110070373A1

公开(公告)日：2011-03-24

申请号：US12700953

申请日：2010-02-05

Applicant: Shien-Wen Wang ,  An-Cheng Sun ,  Jen-Hwa Hsu ,  Po-Cheng Kuo ,  Ching-Ray Chang

Inventor： Shien-Wen Wang ,  An-Cheng Sun ,  Jen-Hwa Hsu ,  Po-Cheng Kuo ,  Ching-Ray Chang

IPC: B05D3/02 ,  C23C14/34

CPC classification number: C23C14/185 ,  C03C17/40 ,  C22C5/04 ,  C23C14/025 ,  C23C14/352

Abstract: A method for forming an ordered alloy includes: (a) forming a layer of a first metal with a layer thickness of less than 0.3 nm over a substrate; (b) forming a layer of a second metal with a layer thickness of less than 0.3 nm on the layer of the first metal under an elevated temperature sufficient to cause interdiffusion of atoms of the first and second metals between the layer of the first metal and the layer of the second metal so as to form the ordered alloy; and (c) repeating steps (a) and (b) until a predetermined layer thickness of the ordered alloy is achieved.

Abstract translation: 形成有序合金的方法包括：（a）在衬底上形成层厚度小于0.3nm的第一金属层; （b）在高温下在第一金属层上形成厚度小于0.3nm的第二金属层，足以使第一和第二金属的原子在第一金属和第 第二金属层以形成有序合金; 和（c）重复步骤（a）和（b），直到实现有序合金的预定层厚。