Liquid tight sealing of heat-insulating walls of a liquefied natural gas carrier
    1.
    发明授权
    Liquid tight sealing of heat-insulating walls of a liquefied natural gas carrier 有权
    液化天然气载体隔热墙液密密封

    公开(公告)号:US08317056B2

    公开(公告)日:2012-11-27

    申请号:US11777155

    申请日:2007-07-12

    摘要: A structure and method for bonding heat-insulating protection walls of a liquefied natural gas carrier is provided. Each of the heat-insulating protection walls is formed of an insulation foam layer and a fiber-reinforced composite reinforcing sheet attached to a surface of the insulation foam layer. The heat-insulating protection walls are provided in a tank of the liquefied natural gas carrier in a mutually adjoining relationship and bonded to one another at a junction to keep the tank cold. The structure includes a fiber-reinforced composite joint sheet positioned in alignment with the juncture of the heat-insulating protection walls and bonded to the fiber-reinforced composite reinforcing sheet by an adhesive agent and a spacer interposed between the fiber-reinforced composite reinforcing sheet and the fiber-reinforced composite joint sheet for keeping the adhesive agent uniform in thickness.

    摘要翻译: 提供了一种用于粘合液化天然气载体的隔热保护壁的结构和方法。 每个绝热保护壁由绝缘泡沫层和附着在绝缘泡沫层的表面上的纤维增强复合增强片形成。 隔热保护壁以相互邻接的关系设置在液化天然气载体的槽中,并且在连接处彼此粘合以保持冷藏。 该结构包括与隔热保护壁的接合部对准的纤维增强复合接合片,并通过粘合剂与间隔开的纤维增强复合增强片粘贴,纤维增强复合增强片与纤维增强复合增强片 用于保持粘合剂厚度均匀的纤维增强复合接合片。

    Method for testing standby current of semiconductor package
    5.
    发明授权
    Method for testing standby current of semiconductor package 失效
    半导体封装待机电流测试方法

    公开(公告)号:US07368933B2

    公开(公告)日:2008-05-06

    申请号:US11335270

    申请日:2006-01-18

    IPC分类号: G01R31/01 G01R31/28 G01R31/26

    CPC分类号: G01R31/3008

    摘要: A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.

    摘要翻译: 提供一种用于测试半导体封装的待机电流的系统和方法。 该方法包括测试形成在具有预定晶圆行程号的晶片上的半导体芯片,收集半导体芯片的待机电流的测量值,并通过使用晶片测试器将待机电流的测量值存储在数据库中; 识别要测试的每个半导体封装的晶片运行次数; 将与识别的晶片运行数相对应的半导体芯片的待机电流的测量值从数据库下载到半导体封装测试器; 通过使用半导体封装测试器提取定义下载的待机电流测量值的预定上限值的边界值; 将边界值设置为通过使用半导体封装测试器来测试半导体封装的程序的备用电流极限; 并根据待机电流限制测试半导体封装。