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    Method of treating a surface to protect the same
    2.
    发明授权
    Method of treating a surface to protect the same 有权
    处理表面以保护其表面的方法

    公开(公告)号：US08119203B2

    公开(公告)日：2012-02-21

    申请号：US11420904

    申请日：2006-05-30

    申请人： Robert L. Hise ,  Geoffrey E. Scanlon ,  Joseph Bergmeister, III ,  Daniel B. Knorr

    发明人： Robert L. Hise ,  Geoffrey E. Scanlon ,  Joseph Bergmeister, III ,  Daniel B. Knorr

    IPC分类号： C10G35/00 ,  B05D3/00 ,  B05D3/02

    CPC分类号： C10G35/04 ,  C10G75/00 ,  C23C4/18 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023

    摘要： A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer on the substrate and followed by curing of the applied metal layer at sub-atmospheric pressure to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to a substrate of an unassembled component of a reactor system to form an applied metal layer on the substrate of the unassembled component and curing the applied metal layer on the substrate of the unassembled component to form a metal protective layer. A method of treating a substrate by applying a layer of at least one metal to the substrate to form an applied metal layer, curing the applied metal layer at a first temperature and pressure for a first period of time, and curing the applied metal layer at a second temperature and pressure for a second period of time, wherein the curing forms a metal protective layer.

    摘要翻译： 一种通过将至少一种金属层施加到衬底上以在衬底上形成施加的金属层并随后在亚大气压下固化所施加的金属层以形成金属保护层来处理衬底的方法。 一种通过将至少一种金属层施加到反应器系统的未组装组分的衬底上来处理衬底的方法，以在未组装的组件的衬底上形成施加的金属层，并将所施加的金属层固化在所述衬底上 未组装的组分形成金属保护层。 一种通过将至少一种金属层施加到基板上以形成施加的金属层来处理基板的方法，在第一温度和压力下固化所施加的金属层一段时间，并且将施加的金属层固化在 第二温度和压力持续第二时间段，其中所述固化形成金属保护层。