Laser diode package with enhanced cooling
    3.
    发明授权
    Laser diode package with enhanced cooling 有权
    激光二极管封装,增强散热

    公开(公告)号:US08208509B2

    公开(公告)日:2012-06-26

    申请号:US13198414

    申请日:2011-08-04

    IPC分类号: H01S3/04

    摘要: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

    摘要翻译: 激光二极管封装组件包括填充有紧密接近激光二极管的可熔金属的储存器。 可熔金属在激光器的操作过程中吸收激光二极管的热量,并从固体相变到液态。 金属在相变过程中吸收热量。 一旦激光二极管关闭,液态金属冷却并重新固化。 储存器被设计成使得液态金属即使处于液态也不会离开储存器。 激光二极管组件还包括具有一个或多个翅片结构的盖,其延伸到储存器中并且与储存器中的金属接触。

    Laser diode package with enhanced cooling
    5.
    发明授权
    Laser diode package with enhanced cooling 有权
    激光二极管封装,增强散热

    公开(公告)号:US08018980B2

    公开(公告)日:2011-09-13

    申请号:US12693052

    申请日:2010-01-25

    IPC分类号: H01S3/04

    摘要: A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

    摘要翻译: 激光二极管封装组件包括填充有紧密接近激光二极管的可熔金属的储存器。 在激光器的操作过程中,易熔金属从激光二极管吸收热量并从固体发生相变。 金属在相变过程中吸收热量。 一旦激光二极管关闭,液态金属冷却并重新固化。 储存器被设计成使得液态金属即使处于液态也不会离开储存器。 激光二极管组件还包括具有一个或多个翅片结构的盖,其延伸到储存器中并且与储存器中的金属接触。

    Microminiature optical waveguide structure and method for fabrication
    6.
    发明授权
    Microminiature optical waveguide structure and method for fabrication 失效
    微型光波导结构及其制造方法

    公开(公告)号:US5846694A

    公开(公告)日:1998-12-08

    申请号:US600571

    申请日:1996-02-13

    摘要: A method for manufacturing low-cost, nearly circular cross section waveguides comprises starting with a substrate material that a molten waveguide material can not wet or coat. A thin layer is deposited of an opposite material that the molten waveguide material will wet and is patterned to describe the desired surface-contact path pedestals for a waveguide. A waveguide material, e.g., polymer or doped silica, is deposited. A resist material is deposited and unwanted excess is removed to form pattern masks. The waveguide material is etched away to form waveguide precursors and the masks are removed. Heat is applied to reflow the waveguide precursors into near-circular cross-section waveguides that sit atop the pedestals. The waveguide material naturally forms nearly circular cross sections due to the surface tension effects. After cooling, the waveguides will maintain the round shape. If the width and length are the same, then spherical ball lenses are formed. Alternatively, the pedestals can be patterned to taper along their lengths on the surface of the substrate. This will cause the waveguides to assume a conical taper after reflowing by heat.

    摘要翻译: 用于制造低成本,近圆形横截面波导的方法包括从熔融波导材料不能润湿或涂覆的基底材料开始。 沉积相对材料的薄层,熔融波导材料将被润湿并被图案化以描述用于波导的期望的表面 - 接触路径基座。 沉积波导材料,例如聚合物或掺杂二氧化硅。 沉积抗蚀剂材料并除去不想要的多余物以形成图案掩模。 将波导材料蚀刻掉以形成波导前体,并除去掩模。 施加热量以将波导前体重新流入位于基座顶部的近圆形横截面波导。 由于表面张力效应,波导材料自然形成近似圆形的横截面。 在冷却之后,波导将保持圆形。 如果宽度和长度相同,则形成球形球透镜。 或者,可以将基座图案化为沿其基板的表面上的长度逐渐变细。 这将导致波导在通过热回流之后呈现锥形锥形。

    Enhanced vbasis laser diode package
    9.
    发明授权
    Enhanced vbasis laser diode package 有权
    增强型vbasis激光二极管封装

    公开(公告)号:US08811445B2

    公开(公告)日:2014-08-19

    申请号:US12748724

    申请日:2010-03-29

    IPC分类号: H01S5/00

    摘要: A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.

    摘要翻译: 提供具有上表面和下表面的基板。 基板包括形成在上表面中的多个V形槽。 每个V形槽包括垂直于第一侧的第一侧和第二侧。 激光二极管棒组件设置在每个V形槽内并且附接到第一侧。 所述激光二极管棒组件包括设置在所述V形槽的第一侧上的第一粘附层,附着到所述第一粘合层的金属板,设置在所述金属板上的第二粘附层,以及附接到所述第二粘合层的所述第二粘合层 粘附层。 激光二极管棒的热膨胀系数(CTE)基本上类似于金属板的热膨胀系数。

    ENHANCED VBASIS LASER DIODE PACKAGE
    10.
    发明申请
    ENHANCED VBASIS LASER DIODE PACKAGE 有权
    增强型VBASIS激光二极管封装

    公开(公告)号:US20110235669A1

    公开(公告)日:2011-09-29

    申请号:US12748724

    申请日:2010-03-29

    IPC分类号: H01S5/40 H01L21/50

    摘要: A substrate having an upper surface and a lower surface is provided. The substrate includes a plurality of v-grooves formed in the upper surface. Each v-groove includes a first side and a second side perpendicular to the first side. A laser diode bar assembly is disposed within each of the v-grooves and attached to the first side. The laser diode bar assembly includes a first adhesion layer disposed on the first side of the v-groove, a metal plate attached to the first adhesion layer, a second adhesion layer disposed over the metal plate, and a laser diode bar attached to the second adhesion layer. The laser diode bar has a coefficient of thermal expansion (CTE) substantially similar to that of the metal plate.

    摘要翻译: 提供具有上表面和下表面的基板。 基板包括形成在上表面中的多个V形槽。 每个V形槽包括垂直于第一侧的第一侧和第二侧。 激光二极管棒组件设置在每个V形槽内并且附接到第一侧。 所述激光二极管棒组件包括设置在所述V形槽的第一侧上的第一粘附层,附着到所述第一粘合层的金属板,设置在所述金属板上的第二粘附层,以及附接到所述第二粘合层的所述第二粘合层 粘附层。 激光二极管棒的热膨胀系数(CTE)基本上类似于金属板的热膨胀系数。