公开(公告)号：US20120291922A1

公开(公告)日：2012-11-22

申请号：US13514076

申请日：2010-12-06

Applicant: Eiji Iwamura ,  Kazushi Gotoh ,  Fumio Ishiga ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

Inventor： Eiji Iwamura ,  Kazushi Gotoh ,  Fumio Ishiga ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

IPC: B23K35/363

CPC classification number: B23K35/3613 ,  B23K35/362 ,  C22C12/00 ,  C22C13/00 ,  H05K3/3484

Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.

Abstract translation: 根据本发明的一个方面的焊膏在助焊剂中包括具有分子量为250或更小的二元酸，分子量为150以上且300以下的一元酸的活化剂，以及 分子量为300以上且600以下的二元酸; 和至少一种选自高密度聚乙烯和聚丙烯的树脂添加剂。 当焊剂的总量为100重量％时，焊膏的树脂添加量为4重量％以上，12重量％以下，粘度为400Pa·s以上 在80℃

公开(公告)号：US20120291921A1

公开(公告)日：2012-11-22

申请号：US13513880

申请日：2010-12-06

Applicant: Eiji Iwamura ,  Kazushi Gotoh ,  Shinsuke Nagasaka ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

Inventor： Eiji Iwamura ,  Kazushi Gotoh ,  Shinsuke Nagasaka ,  Takayasu Yoshioka ,  Masayoshi Utsuno ,  Atsuo Nakamura ,  Teruo Okochi ,  Masaki Sanji ,  Takuji Sukekawa ,  Kenshi Ikedo ,  Yoshiyuki Andoh ,  Takeshi Shirai ,  Kimiaki Mori ,  Rie Wada ,  Kensuke Nakanishi ,  Masami Aihara ,  Seishi Kumamoto

IPC: B23K35/363

CPC classification number: B23K35/362 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613 ,  C22C13/00 ,  H05K3/3489

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.

Abstract translation: 根据本发明的一个方面的用于焊膏的焊剂包括通过使具有C6-C15烷基的（甲基）丙烯酸酯和除上述（甲基）丙烯酸酯之外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸类树脂; 和松香。 当松香的重量为1时，丙烯酸树脂的重量比为0.5以上且1.2以下，通过施加10Pa以上且150Pa以下的剪切力使焊膏的焊剂流动，或 减。