公开(公告)号：US08359486B2

公开(公告)日：2013-01-22

申请号：US12783813

申请日：2010-05-20

Applicant: Po-Yao Huang ,  Chien-Ting Wang

Inventor： Po-Yao Huang ,  Chien-Ting Wang

IPC: G06F1/26

CPC classification number: G06F1/3203 ,  G06F1/325 ,  G06F1/3253 ,  Y02D10/151 ,  Y02D50/20

Abstract: A high speed input/output (HSIO) system and a power saving control method for the HSIO system are provided. The HSIO system has a plurality of transmission speed modes. When an external device is connected to the HSIO system and an auto-configuration link is completed, the power saving control method forcibly sets an interface controller to any desired transmission speed specification in accordance with an actual transmission speed of to-be-transmitted data. Therefore, transmission speed mode of a single physical layer can be changed to achieve a low power transmission.

Abstract translation: 提供高速输入/输出（HSIO）系统和HSIO系统的省电控制方法。 HSIO系统具有多种传输速度模式。 当外部设备连接到HSIO系统并且自动配置链路完成时，省电控制方法根据要发送的数据的实际传输速度强制地将接口控制器设置为任何期望的传输速度规范。 因此，可以改变单个物理层的传输速度模式以实现低功率传输。

公开(公告)号：US08404501B2

公开(公告)日：2013-03-26

申请号：US12961512

申请日：2010-12-07

Applicant: Po-Yao Huang ,  Chia-Yu Jin ,  Yeong-Jar Chang

Inventor： Po-Yao Huang ,  Chia-Yu Jin ,  Yeong-Jar Chang

IPC: H01L21/00 ,  H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC classification number: G02B6/4292 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4251 ,  G02B6/4253 ,  G02B6/4257 ,  G02B6/4274 ,  G02B6/428 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package structure includes a package substrate, at least a chip, solder balls, a light emitting/receiving device, a optical intermediary device and an optical transmission device. The package substrate has a first surface, a second surface, a circuit and solder ball pads, wherein each solder ball pad is electrically connected to the circuit. The chip is disposed on the first surface and electrically connected to the circuit. The solder balls are respectively disposed on the solder ball pads. The light emitting/receiving device is disposed on the package substrate and electrically connected to the circuit. The optical intermediary device is disposed above the light emitting/receiving device. The optical transmission device is inserted in the optical intermediary device, wherein a light emitting by the light emitting/receiving device is emitted to the optical transmission device via the optical intermediary device so that an optical signal is transmitted through the optical transmission device.

Abstract translation: 半导体封装结构包括封装衬底，至少芯片，焊球，发光/接收器件，光中介器件和光传输器件。 封装衬底具有第一表面，第二表面，电路和焊球垫，其中每个焊球焊盘电连接到电路。 芯片设置在第一表面上并电连接到电路。 焊球分别设置在焊球垫上。 发光/接收装置设置在封装基板上并与电路电连接。 光中继装置设置在发光/接收装置的上方。 光传输装置被插入到光中继装置中，其中由发光/接收装置发射的光经由光中介装置发射到光传输装置，使得光信号通过光传输装置传输。

公开(公告)号：US20120138961A1

公开(公告)日：2012-06-07

申请号：US12961512

申请日：2010-12-07

Applicant: Po-Yao Huang ,  Chia-Yu Jin ,  Yeong-Jar Chang

Inventor： Po-Yao Huang ,  Chia-Yu Jin ,  Yeong-Jar Chang

IPC: H01L31/12 ,  H01L31/18

CPC classification number: G02B6/4292 ,  G02B6/4214 ,  G02B6/4249 ,  G02B6/4251 ,  G02B6/4253 ,  G02B6/4257 ,  G02B6/4274 ,  G02B6/428 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package structure includes a package substrate, at least a chip, solder balls, a light emitting/receiving device, a optical intermediary device and an optical transmission device. The package substrate has a first surface, a second surface, a circuit and solder ball pads, wherein each solder ball pad is electrically connected to the circuit. The chip is disposed on the first surface and electrically connected to the circuit. The solder balls are respectively disposed on the solder ball pads. The light emitting/receiving device is disposed on the package substrate and electrically connected to the circuit. The optical intermediary device is disposed above the light emitting/receiving device. The optical transmission device is inserted in the optical intermediary device, wherein a light emitting by the light emitting/receiving device is emitted to the optical transmission device via the optical intermediary device so that an optical signal is transmitted through the optical transmission device.

Abstract translation: 半导体封装结构包括封装衬底，至少芯片，焊球，发光/接收器件，光中介器件和光传输器件。 封装衬底具有第一表面，第二表面，电路和焊球垫，其中每个焊球焊盘电连接到电路。 芯片设置在第一表面上并电连接到电路。 焊球分别设置在焊球垫上。 发光/接收装置设置在封装基板上并与电路电连接。 光中继装置设置在发光/接收装置的上方。 光传输装置被插入到光中继装置中，其中由发光/接收装置发射的光经由光中介装置发射到光传输装置，使得光信号通过光传输装置传输。

公开(公告)号：US08973800B2

公开(公告)日：2015-03-10

申请号：US13799833

申请日：2013-03-13

Applicant: Fu-Chao Liu ,  San-I Huang ,  Po-Yao Huang ,  Hung-Ni Huang

Inventor： Fu-Chao Liu ,  San-I Huang ,  Po-Yao Huang ,  Hung-Ni Huang

IPC: B67B7/92 ,  B67B7/44

CPC classification number: B67B7/92 ,  B67B7/44 ,  Y10T83/403 ,  Y10T83/412 ,  Y10T225/30 ,  Y10T225/371 ,  Y10T225/386

Abstract: An ampoule opener has an opening unit and a cover unit. The opening unit is a rigid frame and has two panels, two head-clamping holes and two pairs of wave-shaped flanges. The panels are respectively an upper panel and a lower panel. The head-clamping holes are elongated in length and tapered in width and are respectively formed through the panels. The pairs of wave-shaped flanges are formed between the panels and the head-clamping holes. The cover unit is flexible, is detachably mounted around the opening unit and has two covering boards, a mounting recess, two body-clamping holes and two pairs of wave-shaped edges. The body-clamping holes are elongated in length and tapered in width and are respectively formed through the mounting boards and communicate with the mounting recess. The pairs of wave-shaped edges are formed between the mounting boards and the body-clamping holes.

Abstract translation: 安瓿开启器具有开启单元和盖单元。 开口单元是刚性框架，具有两个面板，两个头夹紧孔和两对波形法兰。 面板分别是上面板和下面板。 头夹紧孔的长度是细长的，并且在宽度上呈锥形，分别通过面板形成。 一对波形凸缘形成在面板和头夹紧孔之间。 盖单元是柔性的，可拆卸地安装在开口单元周围，并具有两个覆盖板，安装凹槽，两个主体夹紧孔和两对波形边缘。 主体夹紧孔的长度是细长的，并且在宽度上呈锥形，分别形成在安装板上并与安装凹槽连通。 成对的波形边缘形成在安装板和主体夹紧孔之间。

公开(公告)号：US20110231685A1

公开(公告)日：2011-09-22

申请号：US12783813

申请日：2010-05-20

Applicant: Po-Yao Huang ,  Chien-Ting Wang

Inventor： Po-Yao Huang ,  Chien-Ting Wang

IPC: G06F1/32 ,  G06F3/00

CPC classification number: G06F1/3203 ,  G06F1/325 ,  G06F1/3253 ,  Y02D10/151 ,  Y02D50/20

Abstract: A high speed input/output (HSIO) system and a power saving control method for the HSIO system are provided. The HSIO system has a plurality of transmission speed modes. When an external device is connected to the HSIO system and an auto-configuration link is completed, the power saving control method forcibly sets an interface controller to any desired transmission speed specification in accordance with an actual transmission speed of to-be-transmitted data. Therefore, transmission speed mode of a single physical layer can be changed to achieve a low power transmission.

Abstract translation: 提供HSIO系统的高速输入/输出（HSIO）系统和省电控制方法。 HSIO系统具有多种传输速度模式。 当外部设备连接到HSIO系统并且自动配置链路完成时，省电控制方法根据要发送的数据的实际传输速度强制地将接口控制器设置为任何期望的传输速度规范。 因此，可以改变单个物理层的传输速度模式以实现低功率传输。