Sensor package and method of forming same
    2.
    发明授权
    Sensor package and method of forming same 有权
    传感器封装及其形成方法

    公开(公告)号:US09040355B2

    公开(公告)日:2015-05-26

    申请号:US13546902

    申请日:2012-07-11

    IPC分类号: H01L21/00 B81B7/00 B81C1/00

    摘要: A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36), and providing a controller wafer (82) having control circuitry (42) at one side (38) and bonding perimeters (46) on an opposing side (40). The bonding perimeters (46) of the controller wafer (82) are bonded to corresponding bonding perimeters (36) of the sensor wafer (74) to form a stacked wafer structure (48) in which the control circuitry (42) faces outwardly. The controller wafer (82) is sawn to reveal bond pads (32) on the sensor wafer (74) which are wire bonded to corresponding bond pads (44) formed on the same side (38) of the wafer (82) as the control circuitry (42). The structure (48) is encapsulated in packaging material (62) and is singulated to produce the sensor packages (20).

    摘要翻译: 形成传感器封装(20)的方法(70)需要提供传感器晶片(74),传感器晶片(74)具有形成在位于通过接合周边(36)所描绘的区域(34)内的侧面(26)上的传感器(30),并且提供控制器 具有在一侧(38)处的控制电路(42)和在相对侧(40)上的接合周边(46)的晶片(82)。 控制器晶片(82)的接合周边(46)被接合到传感器晶片(74)的对应的接合周边(36),以形成其中控制电路(42)面向外的堆叠的晶片结构(48)。 锯切控制器晶片(82)以露出传感器晶片(74)上的接合焊盘(32),该接合焊盘引线键合到形成在晶片(82)的同一侧(38)上的对应接合焊盘(44) 电路(42)。 结构(48)被封装在包装材料(62)中,并被分割以产生传感器封装(20)。

    SEQUENTIAL WAFER BONDING
    4.
    发明申请
    SEQUENTIAL WAFER BONDING 有权
    顺序波形结合

    公开(公告)号:US20150061044A1

    公开(公告)日:2015-03-05

    申请号:US14011289

    申请日:2013-08-27

    IPC分类号: B81B7/00 B81C1/00

    摘要: Embodiments of methods of fabricating a sensor device includes attaching a first wafer to a sensor wafer with a first bond material, and attaching a second wafer to the sensor wafer with a second bond material, the second bond material having a lower bonding temperature than the first bond material. After attaching the second wafer, an opening (e.g., a trench cut) through the second wafer is formed, and an adhesive material is provided through the opening to further secure the second wafer to the sensor wafer. Embodiments of sensor devices formed using such methods include a first device cavity having a first pressure, and a second device cavity having a second pressure.

    摘要翻译: 制造传感器装置的方法的实施例包括用第一接合材料将第一晶片附接到传感器晶片,并且用第二接合材料将第二晶片附接到传感器晶片,第二接合材料具有比第一接合材料低的接合温度 债券资料。 在安装第二晶片之后,形成通过第二晶片的开口(例如,沟槽切割),并且通过该开口提供粘合材料以进一步将第二晶片固定到传感器晶片。 使用这种方法形成的传感器装置的实施例包括具有第一压力的第一装置腔和具有第二压力的第二装置腔。

    SENSOR PACKAGING METHOD AND SENSOR PACKAGES
    5.
    发明申请
    SENSOR PACKAGING METHOD AND SENSOR PACKAGES 有权
    传感器包装方法和传感器包装

    公开(公告)号:US20140124958A1

    公开(公告)日:2014-05-08

    申请号:US14151305

    申请日:2014-01-09

    IPC分类号: H01L23/528

    摘要: A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure. The structure includes a sensor wafer (92) and a cap wafer (94) Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers. One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers to expose the bond pads, forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).

    摘要翻译: 方法(80)需要提供(82)结构(117),提供(100)控制器元件(102,24),并将控制器元件(116)结合(116)到结构的外表面(52,64)。 该结构包括传感器晶片(92)和盖晶片(94)晶片(92,94)的内表面(34,36)被耦合在一起,传感器(30)插入晶片之间。 一个晶片(94,92)包括具有形成在其内表面(34,36)上的接合焊盘(42)的衬底部分(40,76)。 另一个晶片(94,92)隐藏基板部分(40,76)。 在结合之后,方法学(80)需要在元件(102,24)上形成(120)导电元件(60),从晶片去除(126)材料部分(96,98,107)以暴露接合焊盘,形成 130)电互连(56),施加(134)包装材料(64)和单分离(138)以产生传感器封装(20,70)。

    SENSOR PACKAGING METHOD AND SENSOR PACKAGES
    6.
    发明申请
    SENSOR PACKAGING METHOD AND SENSOR PACKAGES 有权
    传感器包装方法和传感器包装

    公开(公告)号:US20140061948A1

    公开(公告)日:2014-03-06

    申请号:US13597824

    申请日:2012-08-29

    IPC分类号: H01L23/52 H01L21/50

    摘要: A method (80) entails providing (82) a structure (117), providing (100) a controller element (102, 24), and bonding (116) the controller element to an outer surface (52, 64) of the structure (117). The structure includes a sensor wafer (92) and a cap wafer (94). Inner surfaces (34, 36) of the wafers (92, 94) are coupled together, with sensors (30) interposed between the wafers (92, 94). One wafer (94, 92) includes a substrate portion (40, 76) with bond pads (42) formed on its inner surface (34, 36). The other wafer (94, 92) conceals the substrate portion (40, 76). After bonding, methodology (80) entails forming (120) conductive elements (60) on the element (102, 24), removing (126) material sections (96, 98, 107) from the wafers (92, 94, 102) to expose the bond pads (42), forming (130) electrical interconnects (56), applying (134) packaging material (64), and singulating (138) to produce sensor packages (20, 70).

    摘要翻译: 方法(80)需要提供(82)结构(117),提供(100)控制器元件(102,24),并且将所述控制器元件(116)结合(116)到所述结构的外表面(52,64) 117)。 该结构包括传感器晶片(92)和盖晶片(94)。 晶片(92,94)的内表面(34,36)被耦合在一起,传感器(30)置于晶片(92,94)之间。 一个晶片(94,92)包括具有形成在其内表面(34,36)上的接合焊盘(42)的衬底部分(40,76)。 另一个晶片(94,92)隐藏基板部分(40,76)。 在键合之后,方法(80)需要在元件(102,24)上形成(120)导电元件(60),将材料部分(96,98,107)从晶片(92,94,107)移除到 露出接合焊盘(42),形成(130)电互连(56),施加(134)包装材料(64)和单分离(138)以产生传感器封装(20,70)。

    LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET VENT HOLES, AND METHODS OF THEIR MANUFACTURE
    7.
    发明申请
    LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET VENT HOLES, AND METHODS OF THEIR MANUFACTURE 有权
    LEADFRAMES,空气包,以及具有偏心孔的电子设备及其制造方法

    公开(公告)号:US20140061883A1

    公开(公告)日:2014-03-06

    申请号:US13600648

    申请日:2012-08-31

    IPC分类号: H01L23/495 H01L21/56

    摘要: A leadframe (e.g., incorporated in a device package) includes a feature (e.g., a die pad or lead) with a vent hole formed between first and second opposed surfaces. The cross-sectional area of the vent hole varies substantially between the surfaces (e.g., the vent hole has a constricted portion). The vent hole may be formed from a first opening extending from the first surface toward the second surface to a first depth that is less than a thickness of the leadframe feature, and a second opening extending from the second surface toward the first surface to a second depth that is less than the thickness of the leadframe feature, but that is large enough for the second opening to intersect the first opening. Vertical central axes of the openings are horizontally offset from each other, and the constricted portion of the vent hole corresponds to the intersection of the openings.

    摘要翻译: 引线框架(例如,结合在器件封装中)包括具有形成在第一和第二相对表面之间的通气孔的特征(例如,管芯焊盘或引线)。 通气孔的横截面面积在表面之间变化很大(例如,通气孔具有收缩部分)。 通气孔可以由从第一表面朝向第二表面延伸到第一深度小于引线框架特征的厚度的第一开口形成,第二开口从第二表面延伸到第一表面到第二表面 深度小于引线框架特征的厚度,但是足够大以使第二开口与第一开口相交。 开口的垂直中心轴水平地相互偏移,通气孔的收缩部分对应于开口的交点。

    Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof
    8.
    发明授权
    Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof 有权
    具有轴向隔开的密封腔的微电子封装及其制造方法

    公开(公告)号:US09499397B2

    公开(公告)日:2016-11-22

    申请号:US14230273

    申请日:2014-03-31

    IPC分类号: B81B7/02

    摘要: Microelectronic packages and methods for producing microelectronic packages are provided. In one embodiment, the method includes bonding a first Microelectromechanical Systems (MEMS) die having a first MEMS transducer structure thereon to a cap piece. The first MEMS die and cap piece are bonded such that a first hermetically-sealed cavity is formed enclosing the first MEMS transducer. A second MEMS die having a second MEMS transducer structure thereon is further bonded to one of the cap piece and the second MEMS die. The second MEMS die and the cap piece are bonded such that a second hermetically-sealed cavity is formed enclosing the second MEMS transducer. The second hermetically-sealed cavity contains a different internal pressure than does the first hermetically-sealed cavity.

    摘要翻译: 提供微电子封装和用于制造微电子封装的方法。 在一个实施例中,该方法包括将其上具有第一MEMS换能器结构的第一微机电系统(MEMS)管芯结合到盖件上。 第一MEMS管芯和盖件被接合,使得形成封闭第一MEMS换能器的第一密封腔。 其上具有第二MEMS换能器结构的第二MEMS管芯进一步结合到盖件和第二MEMS管芯之一。 第二MEMS管芯和盖件被接合,使得形成封闭第二MEMS换能器的第二密封空腔。 第二个密封腔与第一个密封腔相比具有不同的内部压力。

    MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR THE PRODUCTION THEREOF
    9.
    发明申请
    MICROELECTRONIC PACKAGES HAVING HERMETIC CAVITIES AND METHODS FOR THE PRODUCTION THEREOF 审中-公开
    具有渗透性的微电子封装及其生产方法

    公开(公告)号:US20160167952A1

    公开(公告)日:2016-06-16

    申请号:US14230975

    申请日:2014-03-31

    IPC分类号: B81B7/02 B81C1/00

    摘要: Microelectronic packages having hermetic cavities are provided, as are methods for producing such packages. In one embodiment, the microelectronic package includes a sensor die having first and second Microelectromechanical Systems (MEMS) transducer structures formed thereon. First and second cap pieces are coupled to the sensor die by, for example, direct or indirect bonding. A first hermetic cavity encloses the first MEMS transducer structure and is at least partially defined by the first cap piece and the sensor die. Similarly, a second hermetic cavity encloses the second MEMS transducer structure and at least partially defined by the second cap piece and the sensor die. A vent hole is fluidly coupled to the first hermetic cavity and is sealed by the second cap piece.

    摘要翻译: 提供具有密封腔的微电子封装,以及用于制造这种封装的方法。 在一个实施例中,微电子封装包括具有形成在其上的第一和第二微机电系统(MEMS)换能器结构的传感器管芯。 第一和第二盖片通过例如直接或间接粘合而耦合到传感器管芯。 第一密封腔包围第一MEMS换能器结构,并且至少部分地由第一盖片和传感器芯片限定。 类似地,第二密封腔封闭第二MEMS换能器结构,并且至少部分地由第二盖片和传感器芯片限定。 通气孔流体地联接到第一密封腔并被第二盖片密封。