公开(公告)号：US4975473A

公开(公告)日：1990-12-04

申请号：US317366

申请日：1989-03-01

Applicant: Katsumi Kaneda ,  Teruo Hyugaji ,  Akio Tanaka ,  Nobuo Kuroda ,  Itsuro Yamamoto ,  Noriaki Matsuda

Inventor： Katsumi Kaneda ,  Teruo Hyugaji ,  Akio Tanaka ,  Nobuo Kuroda ,  Itsuro Yamamoto ,  Noriaki Matsuda

IPC: D21H19/58

CPC classification number: D21H19/58

Abstract: A coating composition for a cast-coated paper which principally comprises a pigment and an adhesive and in which the adhesive is composed of (A) a rubber latex having an average particle size of 0.1 to 0.3 micron and (B) a rubber latex or an acrylic emulsion having an average particle size of 0.5 to 1.5 micron and the sum of the solid content of the components (A) and (B) is in the range of 9 to 30 parts by weight per 100 parts by weight of the pigment is herein provided. The coating composition may further contain casein as a binder. In addition, inorganic compounds selected from NaCl, Na.sub.2 SO.sub.4, ZnO and MgO and organic acid salts selected from formates or acetates of Ca, Zn, Mg may be added to the coating composition as coagulants. The use of the aforesaid coating composition makes it possible to produce cast-coated paper having excellent permeability, gloss and surface strength at a high speed.

公开(公告)号：US10384398B2

公开(公告)日：2019-08-20

申请号：US15317611

申请日：2014-05-02

Applicant: Nobuo Kuroda ,  Eiji Kuwahara

Inventor： Eiji Kuwahara

IPC: B29C65/32 ,  B29C51/08 ,  B44C3/08 ,  H05B6/14 ,  B29C65/74 ,  B29C65/00 ,  B29C35/08 ,  B29C43/18 ,  B29C43/40 ,  B29C65/04 ,  B44C3/02 ,  B29C35/12 ,  B29K23/00 ,  B29K105/00 ,  B29L31/00 ,  B29L17/00 ,  B29C65/36 ,  B29C43/04 ,  B29C43/14 ,  B29C43/36 ,  B29K105/20

Abstract: A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency dielectric heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency dielectric heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.

公开(公告)号：US20170197354A1

公开(公告)日：2017-07-13

申请号：US15326988

申请日：2014-07-17

Applicant: Nobuo KURODA ,  Eiji KUWAHARA

Inventor： Eiji KUWAHARA

IPC: B29C59/02 ,  B44C5/00 ,  B32B37/06 ,  B41M5/24 ,  B32B38/06 ,  B32B38/00 ,  B32B27/06 ,  B41F15/00 ,  B44C1/22 ,  B32B37/10

CPC classification number: B29C59/026 ,  B23K26/0006 ,  B23K26/352 ,  B23K26/359 ,  B23K2103/172 ,  B23K2103/42 ,  B29C2035/0811 ,  B29K2905/00 ,  B32B3/266 ,  B32B5/02 ,  B32B5/18 ,  B32B5/245 ,  B32B7/04 ,  B32B27/06 ,  B32B27/065 ,  B32B27/08 ,  B32B27/12 ,  B32B27/304 ,  B32B27/32 ,  B32B27/36 ,  B32B27/40 ,  B32B37/06 ,  B32B37/10 ,  B32B38/0008 ,  B32B38/06 ,  B32B38/145 ,  B32B2250/03 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2266/0235 ,  B32B2266/0278 ,  B32B2307/402 ,  B32B2307/404 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2307/546 ,  B32B2307/58 ,  B32B2307/75 ,  B32B2451/00 ,  B32B2519/00 ,  B41F15/00 ,  B41M5/24 ,  B44B5/008 ,  B44C1/228 ,  B44C3/005 ,  B44C3/082 ,  B44C5/00

Abstract: A method for manufacturing emblems that can be mass-produced while being able to identify individual people, characterized in being configured so that the upper surface of an intermediate layer material is made visible by: placing the intermediate layer material on a lower layer material and a thermoplastic synthetic resin film upper layer material on said intermediate layer material, pressing the upper layer material, intermediate layer material and lower material with an engraving die that has a thermal cutting blade that follows the emblem countour line and performing induction heating by transmitting a high frequency to form a design on the upper layer material, removing unneccesary sections and creating an intermediate decorative piece, fitting said intermediate decorative piece in a jig and setting same in a laser engraver, and perfoming laser engraving using said individual information data and removing portions of the upper layer material according to the individual information data.

公开(公告)号：US20140332146A1

公开(公告)日：2014-11-13

申请号：US14302033

申请日：2014-06-11

Applicant: Nobuo Kuroda ,  Eiji Kuwahara

Inventor： Eiji KUWAHARA

IPC: B29C65/04 ,  B29C59/16 ,  B29C59/02

CPC classification number: B29C65/04 ,  B29C35/12 ,  B29C43/40 ,  B29C43/52 ,  B29C59/02 ,  B29C59/026 ,  B29C59/16 ,  B29C65/366 ,  B29C65/3676 ,  B29C65/7441 ,  B29C66/1122 ,  B29C66/30621 ,  B29C66/433 ,  B29C66/4724 ,  B29C66/71 ,  B29C66/72328 ,  B29C66/73921 ,  B29C66/81415 ,  B29C66/81427 ,  B29C66/81431 ,  B29C66/81457 ,  B29C66/8322 ,  B29C2035/0811 ,  B29L2031/722 ,  B29L2031/744 ,  B44C1/005 ,  Y10T156/1039 ,  B29K2027/06 ,  B29K2075/00 ,  B29K2067/00 ,  B29K2023/00

Abstract: A method and an apparatus for producing a three-dimensional decoration piece that does not damage the tacky bonding or adhesion strength of the lower layer material of the decoration piece. The method includes putting an upper layer material on a first table operating as cathode; lowering an upper mold operating as anode onto the first table, emitting a high frequency wave for dielectric heating; stopping the high frequency dielectric heating; moving a second table carrying a lower layer material having a tacky bonding property to below the upper mold; and lowering said upper mold onto the second table. In the apparatus, the second table or the lower mold is provided on the top surface thereof with recessed sections that are transversally and inwardly separated from a position where an edge of the first machining means contacts, by 0.2 mm to 1 mm; and a cushion member being arranged in the respective recessed sections.

Abstract translation: 一种用于制造三维装饰件的方法和装置，其不会损坏装饰件的下层材料的粘合或粘合强度。 该方法包括将上层材料放置在作为阴极操作的第一工作台上; 将作为阳极工作的上模降低到第一台上，发射用于介电加热的高频波; 停止高频电介质加热; 将具有粘合性的下层材料的第二台移动到上模的下方; 并将所述上模降低到所述第二台上。 在该装置中，第二工作台或下模具的顶面设置有从第一加工装置的边缘与第一加工装置的边缘接触的位置横向和向内分离的凹入部分0.2mm至1mm; 以及缓冲构件，其布置在各个凹部中。

公开(公告)号：US20170217084A1

公开(公告)日：2017-08-03

申请号：US15317611

申请日：2014-05-02

Applicant: Nobuo KURODA ,  Eiji KUWAHARA

Inventor： Eiji KUWAHARA

IPC: B29C65/32 ,  H05B6/14 ,  B29C51/08 ,  B44C3/08

CPC classification number: B29C65/32 ,  B29C35/0805 ,  B29C35/12 ,  B29C43/04 ,  B29C43/14 ,  B29C43/18 ,  B29C43/40 ,  B29C51/08 ,  B29C65/04 ,  B29C65/366 ,  B29C65/3676 ,  B29C65/7441 ,  B29C66/00463 ,  B29C66/1122 ,  B29C66/30621 ,  B29C66/433 ,  B29C66/71 ,  B29C66/73921 ,  B29C66/8122 ,  B29C66/81457 ,  B29C66/8322 ,  B29C2043/3602 ,  B29C2793/009 ,  B29K2023/12 ,  B29K2105/20 ,  B29K2105/256 ,  B29L2017/006 ,  B29L2031/722 ,  B29L2031/744 ,  B44C3/02 ,  B44C3/085 ,  H05B6/14 ,  B29K2021/00 ,  B29K2027/06 ,  B29K2075/00 ,  B29K2067/00 ,  B29K2023/00

Abstract: A device and a method for manufacturing an emblem of thermoplastic synthetic resin with an incorporated IC chip by high frequency induction heating without damaging the IC chip, the device including: an upper metal mold having with a fusion cutting blade; a support frame along the perimeter and upper surface of the table; a slide board on top of the table that is slidable in axial directions relative to the table; a metal plate on the upper surface of the slide board; wherein pressing the upper layer material with the mold from above and subjecting the material to high frequency induction heating, the IC chip is placed in an upper position of the recessed section, then the slide board is driven to slide below the mold and subsequently the heating operation is executed without any risk of applying pressure onto the IC chip.