公开(公告)号：US12036607B2

公开(公告)日：2024-07-16

申请号：US17702337

申请日：2022-03-23

Applicant: Alexander John Cruz ,  Navin Sakthivel

Inventor： Alexander John Cruz ,  Navin Sakthivel

IPC: B22F10/62 ,  B22F10/68 ,  B28B1/00 ,  B28B11/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20

CPC classification number: B22F10/62 ,  B22F10/68 ,  B28B1/001 ,  B28B11/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B22F2301/205

Abstract: A method of manufacturing a nanoporous structure on a substrate includes: additively forming a precursor structure from at least one of a metal oxide or a metal cluster compound on a substrate; exposing the precursor structure to a vapor of an organic linker; and reacting the at least one of the metal oxide or the metal cluster compound in the precursor structure with the organic linker to form the nanoporous structure comprising a metal-organic framework.

公开(公告)号：US11844279B2

公开(公告)日：2023-12-12

申请号：US17846573

申请日：2022-06-22

Applicant: Elan Yogeswaren ,  Navin Sakthivel ,  Otto Fanini

Inventor： Elan Yogeswaren ,  Navin Sakthivel ,  Otto Fanini

IPC: H10N30/045 ,  H10N30/053 ,  H10N30/30

CPC classification number: H10N30/045 ,  H10N30/053 ,  H10N30/302

Abstract: An apparatus for fabricating a piezoelectric transducer includes a base and a piezoelectric powder depositor to traverse the base and deposit a plurality of layers of piezoelectric powder on the base. The apparatus also includes an electrode disposed at an end of a boom of which is moveable to a selected location with respect to the base and a voltage source to apply a voltage to the electrode to establish an electric field between the electrode and base with sufficient strength to sinter and pole each layer of piezoelectric material and a controller having instructions to deposit the plurality of layers of the piezoelectric powder on the base and to control a position of the electrode and actuate the voltage source to the electrode to sinter and pole the layer of piezoelectric material at defined locations after each layer is deposited to form the piezoelectric transducer in a selected shape.

公开(公告)号：US20230311213A1

公开(公告)日：2023-10-05

申请号：US17702337

申请日：2022-03-23

Applicant: Alexander John Cruz ,  Navin Sakthivel

Inventor： Alexander John Cruz ,  Navin Sakthivel

IPC: B22F10/68 ,  B33Y10/00 ,  B28B1/00 ,  B22F10/62 ,  B33Y30/00 ,  B33Y40/20 ,  B28B11/00

CPC classification number: B22F10/62 ,  B22F10/68 ,  B28B1/001 ,  B28B11/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B22F2301/205

Abstract: A method of manufacturing a nanoporous structure on a substrate includes: additively forming a precursor structure from at least one of a metal oxide or a metal cluster compound on a substrate; exposing the precursor structure to a vapor of an organic linker; and reacting the at least one of the metal oxide or the metal cluster compound in the precursor structure with the organic linker to form the nanoporous structure comprising a metal-organic framework.

公开(公告)号：US20230288378A1

公开(公告)日：2023-09-14

申请号：US17494478

申请日：2021-10-05

Applicant: Navin Sakthivel ,  Aaron Avagliano ,  Baskaran Ganesan ,  Wei Chen

Inventor： Navin Sakthivel ,  Aaron Avagliano ,  Baskaran Ganesan ,  Wei Chen

IPC: G01N29/28 ,  G01N29/02 ,  G01N33/00 ,  G10K11/02

CPC classification number: G01N29/28 ,  G01N29/02 ,  G01N33/005 ,  G10K11/02 ,  G01N29/2437

Abstract: A buffer rod for an acoustic measurement device including a ceramic nonmetallic body, a window plate disposed at one longitudinal end of the body, an opposite end of the body configured to interact with a transducer.

公开(公告)号：US11590576B2

公开(公告)日：2023-02-28

申请号：US17356622

申请日：2021-06-24

Applicant: Navin Sakthivel ,  Aaron Avagliano ,  Farhat Shaikh ,  Wei Chen ,  Dan Lu

Inventor： Navin Sakthivel ,  Aaron Avagliano ,  Farhat Shaikh ,  Wei Chen ,  Dan Lu

IPC: B22F10/00 ,  B33Y10/00 ,  B33Y80/00 ,  G01D11/30 ,  E21B47/017 ,  B22F7/06

Abstract: A method of forming a high temperature sensor includes preparing a substrate having a surface from an electrically insulative material having a first coefficient of thermal expansion (CTE), preparing an electrical conductor from a metal material having a second CTE that is different from the first CTE, and creating an interface between the electrical conductor and the substrate with a CTE blending medium that is provided between the substrate and the electrical conductor. The CTE blending medium accommodates differing thermal expansion rates of the substrate and the electrical conductor at temperatures of at least 700° C.

公开(公告)号：US20240017248A1

公开(公告)日：2024-01-18

申请号：US17863719

申请日：2022-07-13

Applicant: Alexander John Cruz ,  Navin Sakthivel ,  Jayesh Jain ,  Michelangelo Bellacci

Inventor： Alexander John Cruz ,  Navin Sakthivel ,  Jayesh Jain ,  Michelangelo Bellacci

IPC: B01J31/16 ,  B33Y80/00 ,  B33Y40/20 ,  B01J35/00 ,  B01J35/02 ,  B01J35/10 ,  B01J37/02 ,  B01J37/00 ,  B01J37/08

CPC classification number: B01J31/1625 ,  B33Y80/00 ,  B33Y40/20 ,  B01J31/1691 ,  B01J35/0013 ,  B01J35/026 ,  B01J35/1061 ,  B01J35/1066 ,  B01J35/1071 ,  B01J35/1076 ,  B01J35/1095 ,  B01J37/0219 ,  B01J37/0228 ,  B01J37/0009 ,  B01J37/08 ,  B33Y10/00

Abstract: A method of immobilizing a metal catalyst in a porous support includes additively forming a precursor structure on a substrate from a metal catalyst and at least one of a metal oxide or a metal cluster compound; exposing the precursor structure to a vapor of an organic linker; and reacting the at least one of the metal oxide or the metal cluster compound in the precursor structure with the organic linker to form a porous support that immobilizes the metal catalyst.

公开(公告)号：US20230333323A1

公开(公告)日：2023-10-19

申请号：US17724354

申请日：2022-04-19

Applicant: Juan Franco ,  Paul Wysocki ,  Navin Sakthivel ,  Aaron Avagliano

Inventor： Juan Franco ,  Paul Wysocki ,  Navin Sakthivel ,  Aaron Avagliano

IPC: G02B6/36

CPC classification number: G02B6/3636

Abstract: An apparatus and method of embedding an optical fiber within a substrate. The apparatus includes a bonding device and a conveyance device. The bonding device bonds a foil layer to the substrate to seal the optical fiber within a groove of the substrate. The conveyance device moves the substrate and the bonding device relative to each other. Relative motion between the substrate and the bonding device draws the optical fiber into the groove and the foil layer over the optical fiber at a collection point.

公开(公告)号：US20230247758A1

公开(公告)日：2023-08-03

申请号：US17588635

申请日：2022-01-31

Applicant: Navin Sakthivel ,  Aaron Avagliano ,  Dinesh Kommireddy ,  Marc Stephen Ramirez

Inventor： Navin Sakthivel ,  Aaron Avagliano ,  Dinesh Kommireddy ,  Marc Stephen Ramirez

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  E21B47/01

CPC classification number: H05K1/024 ,  H05K3/0044 ,  H05K3/4644 ,  E21B47/01 ,  H05K2201/10098 ,  H05K2201/09018 ,  H05K2203/107 ,  B33Y80/00

Abstract: A printed circuit board (PCB) including a rigid dielectric layer having a curved geometry, and a conductive layer attached to the dielectric layer. A method for making a printed circuit board (PCB) including depositing a layer of dielectric material onto a surface, curing and sintering the material on the surface, depositing a first layer of conductive material on the layer of dielectric material, and depositing a second layer of conductive material on the first layer of conductive material, the second layer being thinner in cross section than the first layer. A system for producing a curved rigid PCB including a housing, a build platform disposed in the housing, a mobile robotic depositor disposed upon the build platform, and a print head disposed in the housing and in printing proximity to the build platform, the head having a plurality of deposition nozzles and a laser.

公开(公告)号：US20220416755A1

公开(公告)日：2022-12-29

申请号：US17361622

申请日：2021-06-29

Applicant: Dinesh Kommireddy ,  Navin Sakthivel ,  Aaron Avagliano

Inventor： Dinesh Kommireddy ,  Navin Sakthivel ,  Aaron Avagliano

IPC: H03H9/00 ,  G01N29/28 ,  G01N29/02 ,  E21B41/00

Abstract: An acoustic matching material for gas measurement including a matrix material having an acoustic impedance and an acoustic impedance reduction material, having an acoustic impedance lower than the acoustic impedance of the matrix material, the acoustic impedance reduction material being dispersed in the matrix material to create an acoustic impedance graduation through a thickness of the matching material.

公开(公告)号：US20220410267A1

公开(公告)日：2022-12-29

申请号：US17356622

申请日：2021-06-24

Applicant: Navin Sakthivel ,  Aaron Avagliano ,  Farhat Shaikh ,  Wei Chen ,  Dan Lu

Inventor： Navin Sakthivel ,  Aaron Avagliano ,  Farhat Shaikh ,  Wei Chen ,  Dan Lu

IPC: B22F10/00 ,  B33Y10/00 ,  B33Y80/00 ,  B22F7/06 ,  G01D11/30 ,  E21B47/017

Abstract: A method of forming a high temperature sensor includes preparing a substrate having a surface from an electrically insulative material having a first coefficient of thermal expansion (CTE), preparing an electrical conductor from a metal material having a second CTE that is different from the first CTE, and creating an interface between the electrical conductor and the substrate with a CTE blending medium that is provided between the substrate and the electrical conductor. The CTE blending medium accommodates differing thermal expansion rates of the substrate and the electrical conductor at temperatures of at least 700° C.