公开(公告)号：US20180065210A1

公开(公告)日：2018-03-08

申请号：US15811180

申请日：2017-11-13

Applicant: Nanoplus Ltd.

Inventor： Hung-Tu LU ,  Vladimir KONDRATENKO ,  Alexander NAUMOV ,  Chih-Peng HSU ,  Wei-Nung HSU

IPC: B23K26/364 ,  C03B33/095 ,  B28D5/00

CPC classification number: B23K26/364 ,  B23K26/0604 ,  B23K26/14 ,  B23K26/38 ,  B23K26/703 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  B28D5/0011 ,  C03B33/0955

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

公开(公告)号：US20200061741A1

公开(公告)日：2020-02-27

申请号：US16544734

申请日：2019-08-19

Applicant: Nanoplus Ltd.

Inventor： Alexander NAUMOV ,  Ilya VELIKOVSKIY

IPC: B23K26/0622 ,  B23K26/03 ,  B23K26/14

Abstract: The present invention discloses an immersion laser fabrication method and system, the method comprises providing a substrate with a first shape; disposing the substrate in a carrier, and a liquid is injected into the carrier; providing a laser source to generate a laser beam; cutting the substrate along a second shape by the laser beam based on an application program in order to separate the substrate into a main substrate and a sub-substrate, the sub-substrate is detached from the substrate and sinks to the bottom of the carrier, or the substrate is drilled by the laser beam based on the application program in order to form a hole and a derivative in the substrate, the derivative is detached from the substrate and sinks to the bottom of the carrier; and obtaining the main substrate, the substrate with the hole, or the main substrate with the hole.

公开(公告)号：US20180057369A1

公开(公告)日：2018-03-01

申请号：US15478719

申请日：2017-04-04

Applicant: Nanoplus Ltd.

Inventor： HUNG-TU LU ,  CHENG-WEN LO ,  TAK-NGAI SAMUEL SI ,  MING-YAN TAI

IPC: C02F1/461

CPC classification number: C02F1/4618 ,  C02F1/46109 ,  C02F1/46114 ,  C02F2001/46123 ,  C02F2001/4619 ,  C02F2201/46115 ,  C02F2201/4612 ,  C02F2201/4614 ,  C02F2201/4617 ,  C02F2201/4618 ,  C02F2209/06 ,  C02F2209/40 ,  C25B9/08 ,  C25B9/12 ,  C25B15/02 ,  C25B15/04

Abstract: An electrolysis nano ion water generator includes a cathode electrolytic tank, an anode electrolytic tank, an ion exchange membrane, and two electrolytic plates. During the electrolysis process, gases are generated and stay between the cathode electrolytic plate and the anode electrolytic plate. By adjusting the distance between the cathode electrolytic plate and the anode electrolytic plate, the gases can be removed from the area.

公开(公告)号：US11420894B2

公开(公告)日：2022-08-23

申请号：US15811180

申请日：2017-11-13

Applicant: Nanoplus Ltd.

Inventor： Hung-Tu Lu ,  Vladimir Kondratenko ,  Alexander Naumov ,  Chih-Peng Hsu ,  Wei-Nung Hsu

IPC: C03B33/095 ,  B23K26/364 ,  B28D5/00 ,  B23K26/06 ,  B23K26/14 ,  B23K26/38 ,  B23K26/70 ,  B23K103/00 ,  B23K101/40

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

公开(公告)号：US20160311060A1

公开(公告)日：2016-10-27

申请号：US14695556

申请日：2015-04-24

Applicant: NANOPLUS LTD.

Inventor： HUNG-TU LU ,  VLADIMIR KONDRATENKO ,  ALEXANDER NAUMOV ,  CHIH-PENG HSU ,  WEI-NUNG HSU

IPC: B23K26/364 ,  B26F3/06 ,  B23K26/402

CPC classification number: B23K26/364 ,  B23K26/0604 ,  B23K26/14 ,  B23K26/38 ,  B23K26/402 ,  B23K26/703 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.

Abstract translation: 公开了一种脆性物品切割装置及其方法。 其中，脆性物体切割装置包括第一加热激光单元，第二加热激光单元，划线激光单元，两个冷却单元和处理模块。 来自分别位于划线激光单元的划线激光器的相对侧上的加热激光单元的加热激光器以及跟随在加热激光器之后的冷却单元的冷却剂。 在脆性物体的移动过程中，处理模块控制用于划线操作的划线激光器，并且将加热激光器和冷却剂中的一个控制成冷却单元之一，以加热和冷却脆性物体。 结果，可以有效地减少切削脆性物体的加工时间。