公开(公告)号：US20180065210A1

公开(公告)日：2018-03-08

申请号：US15811180

申请日：2017-11-13

Applicant: Nanoplus Ltd.

Inventor： Hung-Tu LU ,  Vladimir KONDRATENKO ,  Alexander NAUMOV ,  Chih-Peng HSU ,  Wei-Nung HSU

IPC: B23K26/364 ,  C03B33/095 ,  B28D5/00

CPC classification number: B23K26/364 ,  B23K26/0604 ,  B23K26/14 ,  B23K26/38 ,  B23K26/703 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  B28D5/0011 ,  C03B33/0955

Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.