-
公开(公告)号：US08525042B2
公开(公告)日：2013-09-03
申请号：US12690147
申请日：2010-01-20
申请人： Mitsunori Abe , Takashi Fukuda
发明人： Mitsunori Abe , Takashi Fukuda
CPC分类号： H05K1/111 , H01L2224/0401 , H01L2224/16238 , H01L2224/81385 , H05K3/3436 , H05K2201/09136 , H05K2201/09418 , H05K2201/09663 , H05K2201/09809 , H05K2201/10734 , H05K2203/046 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00012
摘要： A printed circuit board on which a surface mount electronic device is mounted. The printed circuit board includes a substrate on which land arrangements are disposed in an array. Each land arrangement includes a core portion and drawing portions. The drawings are disposed along diagonal directions relative to the core portions of the array of the land arrangements.
摘要翻译： 安装有表面安装电子装置的印刷电路板。 印刷电路板包括基板，其上布置有阵列布置。 每个平台布置包括芯部分和绘图部分。 附图相对于陆地排列的阵列的芯部沿对角线方向设置。
-
2.发明授权公开(公告)号：US08338715B2
公开(公告)日：2012-12-25
申请号：US12222178
申请日：2008-08-04
申请人： Yoshikazu Hirano , Mitsunori Abe
发明人： Yoshikazu Hirano , Mitsunori Abe
CPC分类号： H05K1/03 , H01L24/16 , H01L24/81 , H01L2224/16058 , H01L2224/16105 , H01L2224/16238 , H01L2924/3841 , H05K1/111 , H05K3/3442 , H05K3/3484 , H05K2201/09381 , H05K2201/10636 , H05K2201/10727 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T29/4913
摘要： A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the electronic device and a projection projecting out from the board electrode base, narrower in width than the board electrode base, and connected to an interconnect of the printed circuit board.
摘要翻译： 一种设置有板电极的印刷电路板，其中每个板电极设置有电路板电极基座，用于通过将布置在电子设备的底部的底部电极的内部从电子设备的外边缘焊接到内部而布置在外部 电子装置的边缘和从基板电极基底突出的突起，其宽度比板电极基底窄，并连接到印刷电路板的互连。
-
3.发明申请公开(公告)号：US20090056985A1
公开(公告)日：2009-03-05
申请号：US12222178
申请日：2008-08-04
申请人： Yoshikazu Hirano , Mitsunori Abe
发明人： Yoshikazu Hirano , Mitsunori Abe
CPC分类号： H05K1/03 , H01L24/16 , H01L24/81 , H01L2224/16058 , H01L2224/16105 , H01L2224/16238 , H01L2924/3841 , H05K1/111 , H05K3/3442 , H05K3/3484 , H05K2201/09381 , H05K2201/10636 , H05K2201/10727 , H05K2203/0545 , Y02P70/611 , Y02P70/613 , Y10T29/4913
摘要： A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the electronic device and a projection projecting out from the board electrode base, narrower in width than the board electrode base, and connected to an interconnect of the printed circuit board.
摘要翻译： 一种设置有板电极的印刷电路板，其中每个板电极设置有电路板电极基座，用于通过将布置在电子设备的底部的底部电极的内部从电子设备的外边缘焊接到内部而布置在外部 电子装置的边缘和从基板电极基底突出的突起，其宽度比板电极基底窄，并连接到印刷电路板的互连。
-
公开(公告)号：US08656777B2
公开(公告)日：2014-02-25
申请号：US13172159
申请日：2011-06-29
申请人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
发明人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
摘要： An electronic component analyzing apparatus is provided with a fixing part configured to hold a substrate to which an electronic component is soldered; a gripper configured to grip the electronic component; a transmission part coupled to the gripper, and configured to transmit an external force to the gripper as a force acting in a direction away from the substrate; and a support part configured to pivotally support the transmission part.
-
公开(公告)号：US20120017679A1
公开(公告)日：2012-01-26
申请号：US13172159
申请日：2011-06-29
申请人： Yoshikazu HIRANO , Mitsunori ABE , Takashi FUKUDA
发明人： Yoshikazu HIRANO , Mitsunori ABE , Takashi FUKUDA
CPC分类号： G01R31/2867 , G01N3/08 , G01N3/24 , G01N2033/0078 , G01N2203/0062 , G01N2203/0296 , H05K3/22 , H05K3/3436 , H05K2201/10734 , H05K2203/0195 , H05K2203/162 , H05K2203/176
摘要： An electronic component analyzing apparatus is provided with a fixing part configured to hold a substrate to which an electronic component is soldered; a gripper configured to grip the electronic component; a transmission part coupled to the gripper, and configured to transmit an external force to the gripper as a force acting in a direction away from the substrate; and a support part configured to pivotally support the transmission part.
摘要翻译： 一种电子部件分析装置，具备：固定部，其被构造成保持焊接有电子部件的基板; 构造成夹持电子部件的夹持器; 传动部分，其联接到所述夹持器，并且构造成作为沿远离所述基底的方向作用的力将外力传递到所述夹持器; 以及构造成枢转地支撑所述变速部的支撑部。
-
6.发明授权
公开(公告)号：US5910755A
公开(公告)日：1999-06-08
申请号：US959711
申请日：1997-10-28
申请人： Hidehiro Mishiro , Kenichiro Tsubone , Mitsunori Abe , Rie Takada
发明人： Hidehiro Mishiro , Kenichiro Tsubone , Mitsunori Abe , Rie Takada
CPC分类号： H05K1/162 , H03H7/0115 , H03H7/175 , H05K1/0287 , H05K1/029 , H03H2001/0085 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/165 , H05K2201/09309 , H05K2201/09945
摘要： A laminate capacitor circuit board which permits constants of various kinds of circuit elements to be set by selectively effected connections between wiring layers, and a laminate capacitor circuit board which permits distributed circuit constants in a high-frequency wiring layer sandwiched between two shielding wiring layers to be set as desired. These circuits are formed with at least a pattern of a conductive foil on each dielectric layer, and include a plurality of wiring layers laminated one upon another, a wiring layer for connections laminated to a surface of the plurality of wiring layers laminated one upon another, a plurality of terminal patterns formed on the wiring layer for connections in a state insulated from each other, a plurality of vias for electrically connecting at least two of the plurality of terminal patterns to corresponding ones of the plurality of wiring layers, and connecting means for selectively connecting the plurality of terminal patterns to each other.
摘要翻译： 通过选择性地实现布线层之间的连接来设置允许各种电路元件的常数的叠层电容器电路板，以及层叠电容器电路板，其允许夹在两个屏蔽布线层之间的高频布线层中的分布电路常数 根据需要设定。 这些电路在每个电介质层上至少形成有导电箔的图案，并且包括彼此层叠的多个布线层，层叠到彼此层叠的多个布线层的表面的用于连接的布线层， 形成在布线层上的多个端子图案，用于在彼此绝缘的状态下连接;多个通孔，用于将多个端子图案中的至少两个电连接到多个布线层中的相应端子;以及连接装置， 选择性地将多个端子图案彼此连接。
-
公开(公告)号：US08701488B2
公开(公告)日：2014-04-22
申请号：US13172159
申请日：2011-06-29
申请人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
发明人： Yoshikazu Hirano , Mitsunori Abe , Takashi Fukuda
CPC分类号： G01R31/2867 , G01N3/08 , G01N3/24 , G01N2033/0078 , G01N2203/0062 , G01N2203/0296 , H05K3/22 , H05K3/3436 , H05K2201/10734 , H05K2203/0195 , H05K2203/162 , H05K2203/176
摘要： An electronic component analyzing apparatus is provided with a fixing part configured to hold a substrate to which an electronic component is soldered; a gripper configured to grip the electronic component; a transmission part coupled to the gripper, and configured to transmit an external force to the gripper as a force acting in a direction away from the substrate; and a support part configured to pivotally support the transmission part.
摘要翻译： 一种电子部件分析装置，具备：固定部，其被构造成保持焊接有电子部件的基板; 构造成夹持电子部件的夹持器; 传动部分，其联接到所述夹持器，并且构造成作为沿远离所述基底的方向作用的力将外力传递到所述夹持器; 以及构造成枢转地支撑所述变速部的支撑部。
-
公开(公告)号：US20100181102A1
公开(公告)日：2010-07-22
申请号：US12690147
申请日：2010-01-20
申请人： Mitsunori ABE , Takashi FUKUDA
发明人： Mitsunori ABE , Takashi FUKUDA
IPC分类号： H05K1/18
CPC分类号： H05K1/111 , H01L2224/0401 , H01L2224/16238 , H01L2224/81385 , H05K3/3436 , H05K2201/09136 , H05K2201/09418 , H05K2201/09663 , H05K2201/09809 , H05K2201/10734 , H05K2203/046 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00012
摘要： A printed circuit board on which a surface mount electronic device is mounted. The printed circuit board includes a substrate on which land arrangements are disposed in an array. Each land arrangement includes a core portion and drawing portions. The drawings are disposed along diagonal directions relative to the core portions of the array of the land arrangements.
摘要翻译： 安装有表面安装电子装置的印刷电路板。 印刷电路板包括基板，其上布置有阵列布置。 每个平台布置包括芯部分和绘图部分。 附图相对于陆地排列的阵列的芯部沿对角线方向设置。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.011 秒)
