公开(公告)号：US5818112A

公开(公告)日：1998-10-06

申请号：US549201

申请日：1995-10-27

申请人： Werner Weber ,  Stefan Kuehn ,  Michael Kleiner ,  Roland Thewes

发明人： Werner Weber ,  Stefan Kuehn ,  Michael Kleiner ,  Roland Thewes

IPC分类号： H01L27/04 ,  H01L21/822 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065 ,  H03K3/356 ,  H03K3/3565 ,  H01L29/00 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L23/48 ,  H01L23/481 ,  H03K3/356017 ,  H03K3/356113 ,  H03K3/3565 ,  H01L2225/06527 ,  H01L2924/0002

摘要： In an arrangement for signal transmission between chip layers of a vertically integrated circuit, a defined, capacitive signal transmission ensues between a part of the vertically integrated circuit in one chip layer and a further part of the vertically integrated circuit in a further chip layer by means of a coupling capacitance. Particularly given high connection densities, a large number of freely placeable and reliable vertical signal connections can be produced directly from the inside of one chip layer to the inside of a neighboring chip layer without extremely high demands being made on the adjustment of the chip layers relative to one another and on the surface planarity of the individual chip layers.

摘要翻译： 在用于垂直集成电路的芯片层之间的信号传输的布置中，在一个芯片层中的垂直集成电路的一部分与垂直集成电路的另一部分之间，通过装置 的耦合电容。 特别是给定的高连接密度，可以从一个芯片层的内部到相邻的芯片层的内部直接产生大量可自由放置和可靠的垂直信号连接，而对芯片层相对的调整没有非常高的要求 并且在各个芯片层的表面平面度上。

公开(公告)号：US5701037A

公开(公告)日：1997-12-23

申请号：US549068

申请日：1995-10-27

申请人： Werner Weber ,  Stefan Kuehn ,  Michael Kleiner ,  Roland Thewes

发明人： Werner Weber ,  Stefan Kuehn ,  Michael Kleiner ,  Roland Thewes

IPC分类号： H01L21/822 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065 ,  H01L27/00 ,  H01L27/04 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/48 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2924/0002

摘要： In an arrangement for signal transmission between chip layers of a vertically integrated circuit, a defined, inductive signal transmission ensues between a part of the vertically integrated circuit in one chip layer and a further part of the vertically integrated circuit in a further chip layer by means of a coupling inductance formed by respective coils in the two layers. Particularly given high connection densities, a large number of freely placeable and reliable vertical signal connections can be produced directly from the inside of one chip layer to the inside of a neighboring chip layer without extremely high demands being made on the adjustment of the chip layers relative to one another and on the surface planarity of the individual chip layers.

摘要翻译： 在用于垂直集成电路的芯片层之间的信号传输的布置中，在一个芯片层中的垂直集成电路的一部分和垂直集成电路的另一部分之间，通过装置进一步确定了感应信号传输 由两层中的各个线圈形成的耦合电感。 特别是给定的高连接密度，可以从一个芯片层的内部到相邻的芯片层的内部直接产生大量可自由放置和可靠的垂直信号连接，而对芯片层相对的调整没有非常高的要求 并且在各个芯片层的表面平面度上。

公开(公告)号：US06798428B1

公开(公告)日：2004-09-28

申请号：US09659002

申请日：2000-09-11

申请人： Michael Kleiner ,  Uwe Röben ,  Adolf Sturm

发明人： Michael Kleiner ,  Uwe Röben ,  Adolf Sturm

IPC分类号： G09G500

CPC分类号： G05B23/0272 ,  Y10S715/965

摘要： Particularly simple selection of data in all of the operating phases for a technical installation is achieved according to the invention, in a method for processing data which are user-specifically stored in different data memories. The functional groups for process control and the functional groups for the installation are each assigned to a selection field of a common selection mask. When one of the selection fields is selected, the respective process data relevant to the process control of the installation or installation data relevant to the installation are selected and displayed in a further display level.

摘要翻译： 根据本发明，在用户专门存储在不同数据存储器中的处理数据的方法中，实现了用于技术设备的所有操作阶段中数据的特别简单的选择。 用于过程控制的功能组和安装的功能组各自分配给公共选择掩模的选择字段。 当选择其中一个选择字段时，选择并显示与安装相关的安装或安装数据的过程控制相关的相应过程数据并进一步显示。