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1.发明授权Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor 失效含有脂环结构的不饱和酰亚胺化合物，其制备方法和中间体
公开(公告)号：US5326881A
公开(公告)日：1994-07-05
申请号：US142578
申请日：1993-10-28
申请人： Yasuhiro Hirano , Yasuhiro Endo , Kazuo Takebe , Mitsuhiro Shibata , Shuichi Kanagawa , Yutaka Shiomi , Masatsugu Akiba , Shinichiro Kitayama
发明人： Yasuhiro Hirano , Yasuhiro Endo , Kazuo Takebe , Mitsuhiro Shibata , Shuichi Kanagawa , Yutaka Shiomi , Masatsugu Akiba , Shinichiro Kitayama
IPC分类号： C07C205/38 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/12
摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。
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2.发明授权Epoxy resin stilbenes and process for producing the same by photoisomerization 失效环氧树脂二苯乙烯及其通过光异构化制备其的方法
公开(公告)号：US5854370A
公开(公告)日：1998-12-29
申请号：US863300
申请日：1997-05-27
IPC分类号： C07D303/24 , C08G59/06 , C08G59/24
CPC分类号： C08G59/063 , C07D303/24 , C08G59/245
摘要： The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.
摘要翻译： 本发明提供了一种具有比迄今已知的反茋系环氧树脂更低的熔点和更低的粘度的顺式 - 二苯乙烯型环氧树脂。 二苯乙烯型环氧树脂的顺式异构体含量基本上为100％，或者替代地，至少约10％，其余为反式异构体，并且基于以下通式（1）：
（1）其中R1至R8独立地为非环状或环状烷基，氢原子或卤素原子。 还公开了这些环氧树脂的生产方法。 -
3.发明授权Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor 失效含有脂环结构的不饱和酰亚胺化合物，其制备方法和中间体
公开(公告)号：US5498687A
公开(公告)日：1996-03-12
申请号：US411880
申请日：1995-03-28
申请人： Yasuhiro Hirano , Yasuhiro Endo , Kazuo Takebe , Mitsuhiro Shibata , Shuichi Kanagawa , Yutaka Shiomi , Masatsugu Akiba , Shinichiro Kitayama
发明人： Yasuhiro Hirano , Yasuhiro Endo , Kazuo Takebe , Mitsuhiro Shibata , Shuichi Kanagawa , Yutaka Shiomi , Masatsugu Akiba , Shinichiro Kitayama
IPC分类号： C07C205/38 , C07C217/90 , C07D207/44 , C07D207/452 , C08G73/12 , C08G59/18
CPC分类号： C07D207/452 , C07C205/38 , C07C217/90 , C08G73/12
摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.
摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。
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公开(公告)号：US08076402B2
公开(公告)日：2011-12-13
申请号：US12292797
申请日：2008-11-26
申请人： Ryoji Soma , Toyomochi Tamato , Masatsugu Akiba , Tatsumi Nuno
发明人： Ryoji Soma , Toyomochi Tamato , Masatsugu Akiba , Tatsumi Nuno
IPC分类号： C08K5/105 , C08K5/134 , C08K5/11 , C07C39/21 , C07C69/773 , C07C69/618 , C07C69/73 , C07C69/76
CPC分类号： C08K5/134 , C07C67/14 , C07C69/67 , C07C69/734
摘要： A bisphenol monoester compound represented by the formula (1): (in the formula (1), Rs each represent independently a hydrogen atom or a methyl group, and R′ represents an alkyl group of a carbon number of 1 to 6, or a hydrogen atom).
摘要翻译： 由式（1）表示的双酚单酯化合物：（式（1）中，R 5各自独立地表示氢原子或甲基，R'表示碳数为1〜6的烷基，或 氢原子）。
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5.发明授权Bisphenol monoester-based stabilizer composition, thermoplastic polymer composition and method of manufacturing the same, thermoplastic polymer molded product, and method of stabilizing thermoplastic polymer 有权双酚单酯类稳定剂组合物，热塑性聚合物组合物及其制造方法，热塑性聚合物成型体及热塑性聚合物稳定化方法公开(公告)号：US07977418B2
公开(公告)日：2011-07-12
申请号：US12219384
申请日：2008-07-21
申请人： Kenji Kimura , Ryoji Soma , Masatsugu Akiba , Toyomochi Tamato
发明人： Kenji Kimura , Ryoji Soma , Masatsugu Akiba , Toyomochi Tamato
摘要： The present invention provides a bisphenol monoester-based stabilizer composition that can improve resistance to discoloration at high temperature of a thermoplastic polymer compared with a conventional one using a bisphenol monoester-based stabilizer composition including a bisphenol monoester-based compound mainly, wherein a compound represented by the following formula: is contained in an area percentage by liquid chromatography analysis of 0.1 to 3%, a thermoplastic polymer composition and a method of manufacturing the thermoplastic polymer composition, a thermoplastic polymer molded product, and a method of stabilizing a thermoplastic polymer, as well as a thermoplastic polymer composition in which resistance to discoloration at high temperature is improved by using the stabilizer composition and a method of manufacturing the thermoplastic polymer composition, a thermoplastic polymer molded product, and a method of stabilizing a thermoplastic polymer.
摘要翻译： 本发明提供了一种双酚单酯类稳定剂组合物，其与常规使用双酚单酯系稳定剂组合物的双酚单酯系稳定剂组合物主要相比，可以提高耐热变性在热塑性聚合物的耐高温性能， 通过以下公式计算：通过液相色谱分析的面积百分比为0.1〜3％，热塑性聚合物组合物和热塑性聚合物组合物的制造方法，热塑性聚合物成型体和热塑性聚合物的稳定化方法， 以及通过使用稳定剂组合物和制造热塑性聚合物组合物的方法，热塑性聚合物模制产品和稳定热塑性聚合物的方法来改善耐高温变色性的热塑性聚合物组合物。
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公开(公告)号：US6011130A
公开(公告)日：2000-01-04
申请号：US929269
申请日：1997-09-12
申请人： Noriyuki Arai , Masatsugu Akiba
发明人： Noriyuki Arai , Masatsugu Akiba
CPC分类号： C08G59/18
摘要： Provided is an epoxy resin composition comprising a crystalline epoxy resin and an amorphous epoxy curing agent, wherein the crystalline epoxy resin is dispersing uniformly in the amorphous epoxy curing agent as crystallites. The epoxy resin composition is excellent in preservation stability.
摘要翻译： 提供一种环氧树脂组合物，其包含结晶环氧树脂和无定形环氧固化剂，其中结晶环氧树脂均匀分散在无定形环氧固化剂中作为微晶。 环氧树脂组合物的保存稳定性优异。
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7.发明授权Epoxy resin, resin composition, and resin-encapsulated semiconductor device 失效环氧树脂，树脂组合物和树脂封装的半导体器件
公开(公告)号：US5939509A
公开(公告)日：1999-08-17
申请号：US879600
申请日：1997-06-20
IPC分类号： C07C39/21 , C07C39/215 , C07D301/28 , C07D303/23 , C07D303/24 , C08G59/24 , H01L23/29 , H05K1/03 , C08G59/16
CPC分类号： C07D303/24 , C07C39/21 , C07C39/215 , C08G59/245 , H01L23/293 , H01L2924/0002 , H05K1/0326
摘要： The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.
摘要翻译： 具有两个不同芳基的二苯乙烯环氧树脂和包含该二苯乙烯环氧树脂的环氧树脂混合物具有比具有两个相同芳基的二苯乙烯环氧树脂和后者二苯乙烯环氧树脂的环氧树脂混合物的熔点低的熔点。 与常规树脂相比，本发明的树脂或树脂混合物具有改进的加工和成型性能。 缩短了成型和加工过程所需的时间，从而带来经济优势和对生产率的优选影响。 本发明的环氧树脂或树脂混合物优选用作粘合剂，涂料，绝缘材料，层压片材的电气或电子材料等。 它特别适用于封装电子部件的材料。
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公开(公告)号：US5719225A
公开(公告)日：1998-02-17
申请号：US487628
申请日：1995-06-07
申请人： Yasuhiro Hirano , Masatsugu Akiba , Yutaka Shiomi , Noriaki Saito
发明人： Yasuhiro Hirano , Masatsugu Akiba , Yutaka Shiomi , Noriaki Saito
CPC分类号： C08K7/18 , Y10S428/901 , Y10T428/25 , Y10T428/259 , Y10T428/31511 , Y10T428/31721
摘要： A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.
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公开(公告)号：US20090143517A1
公开(公告)日：2009-06-04
申请号：US12292797
申请日：2008-11-26
申请人： Ryoji Soma , Toyomochi Tamato , Masatsugu Akiba , Tatsumi Nuno
发明人： Ryoji Soma , Toyomochi Tamato , Masatsugu Akiba , Tatsumi Nuno
CPC分类号： C08K5/134 , C07C67/14 , C07C69/67 , C07C69/734
摘要： A bisphenol monoester compound represented by the formula (1): (in the formula (1), Rs each represent independently a hydrogen atom or a methyl group, and R′ represents an alkyl group of a carbon number of 1 to 6, or a hydrogen atom).
摘要翻译： 由式（1）表示的双酚单酯化合物：（式（1）中，R 5各自独立地表示氢原子或甲基，R'表示碳数为1〜6的烷基，或 氢原子）。
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10.发明申请Bisphenol monoester-based stabilizer composition, thermoplastic polymer composition and method of manufacturing the same, thermoplastic polymer molded product, and method of stabilizing thermoplastic polymer 有权双酚单酯类稳定剂组合物，热塑性聚合物组合物及其制造方法，热塑性聚合物成型体及热塑性聚合物稳定化方法公开(公告)号：US20090043027A1
公开(公告)日：2009-02-12
申请号：US12219384
申请日：2008-07-21
申请人： Kenji Kimura , Ryoji Soma , Masatsugu Akiba , Toyomochi Tamato
发明人： Kenji Kimura , Ryoji Soma , Masatsugu Akiba , Toyomochi Tamato
摘要： The present invention provides a bisphenol monoester-based stabilizer composition that can improve resistance to discoloration at high temperature of a thermoplastic polymer compared with a conventional one using a bisphenol monoester-based stabilizer composition including a bisphenol monoester-based compound mainly, wherein a compound represented by the following formula: is contained in an area percentage by liquid chromatography analysis of 0.1 to 3%, a thermoplastic polymer composition and a method of manufacturing the thermoplastic polymer composition, a thermoplastic polymer molded product, and a method of stabilizing a thermoplastic polymer, as well as a thermoplastic polymer composition in which resistance to discoloration at high temperature is improved by using the stabilizer composition and a method of manufacturing the thermoplastic polymer composition, a thermoplastic polymer molded product, and a method of stabilizing a thermoplastic polymer.
摘要翻译： 本发明提供了一种双酚单酯类稳定剂组合物，其与常规使用双酚单酯系稳定剂组合物的双酚单酯系稳定剂组合物主要相比，可以提高耐热变性在热塑性聚合物的耐高温性能， 通过以下公式计算：通过液相色谱分析的面积百分比为0.1〜3％，热塑性聚合物组合物和热塑性聚合物组合物的制造方法，热塑性聚合物成型体和热塑性聚合物的稳定化方法， 以及通过使用稳定剂组合物和制造热塑性聚合物组合物的方法，热塑性聚合物模制产品和稳定热塑性聚合物的方法来改善耐高温变色性的热塑性聚合物组合物。
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