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    Crystalline resin cured product, crystalline resin composite material, and method for producing the same
    4.
    发明授权
    Crystalline resin cured product, crystalline resin composite material, and method for producing the same 失效
    结晶性树脂固化物，结晶性树脂复合材料及其制造方法

    公开(公告)号：US08546510B2

    公开(公告)日：2013-10-01

    申请号：US12312369

    申请日：2007-11-08

    申请人： Masashi Kaji ,  Koichiro Ogami ,  Kazuhiko Nakahara ,  Tomomi Fukunaga

    发明人： Masashi Kaji ,  Koichiro Ogami ,  Kazuhiko Nakahara ,  Tomomi Fukunaga

    IPC分类号： C08G59/00 ,  C08G65/38 ,  C08G59/50 ,  C08L63/00

    CPC分类号： C08G59/245 ,  C08G59/5033 ,  C08G59/621 ,  C08G63/42

    摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

    摘要翻译： 提供一种显示出高导热性，低热膨胀，高耐热性，低吸湿性和良好阻气性的结晶树脂固化产物和由其制备的结晶树脂复合材料。 另外提供了结晶性树脂固化物和结晶性树脂复合材料的制造方法。 结晶性树脂固化物通过芳香族二缩水甘油基化合物或二缩水甘油基树脂与芳香族二羟基化合物或二羟基树脂的反应而得到，并且在差热分析中显示出10J / g以上的熔融热，同时吸热 对应于熔化的峰出现在120〜320℃的范围内。结晶性树脂复合材料通过将结晶性树脂固化物与填料或基材结合而得到。 结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-表示的单元，其中A和B是二价芳族基团。

    Indole resins epoxy resins and resin compositions containing the same
    5.
    发明申请
    Indole resins epoxy resins and resin compositions containing the same 有权
    吲哚树脂环氧树脂和含有它们的树脂组合物

    公开(公告)号：US20050131167A1

    公开(公告)日：2005-06-16

    申请号：US10504272

    申请日：2003-02-10

    申请人： Masashi Kaji ,  Hisashi Yamada

    发明人： Masashi Kaji ,  Hisashi Yamada

    IPC分类号： C07D209/08 ,  C08G59/50 ,  C08G61/12 ,  C08G73/06 ,  C08L61/04 ,  C08L63/00 ,  C08L65/00 ,  H05K1/03

    CPC分类号： C08G73/0672 ,  C07D209/08 ,  C08G59/506 ,  C08G61/122 ,  C08G61/124 ,  C08L61/04 ,  C08L63/00 ,  C08L65/00 ,  H05K1/0326

    摘要： This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

    摘要翻译： 本发明涉及含有吲哚作为结构单元的环氧树脂，吲哚树脂和含有所述环氧树脂和吲哚树脂的树脂组合物，由于其优异的阻燃性，粘合性，耐湿性和热性，它们可用于层压，模塑，铸造和粘合等应用 抵抗性。 本发明的吲哚树脂和由其获得的环氧树脂由以下通式I和II表示，其中R 1是H，烷基等，X是由-C（ R 2 R 3） - 或C（R 4 R 5） - Ar-C（R a SUB >其中R 2〜R 5是H，烷基等，Ar是苯 或联苯环），G为缩水甘油基，n为1-20的整数。

    Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles
    6.
    发明授权
    Epoxy resins, process for preparation thereof, epoxy resin compositions and cured articles 失效
    环氧树脂，其制备方法，环氧树脂组合物和固化制品

    公开(公告)号：US06903180B2

    公开(公告)日：2005-06-07

    申请号：US10433365

    申请日：2001-12-10

    申请人： Masashi Kaji ,  Koichiro Ogami

    发明人： Masashi Kaji ,  Koichiro Ogami

    IPC分类号： C07D405/14 ,  C08G59/32 ,  C08G59/00 ,  C08G73/00 ,  C08L63/00

    CPC分类号： C07D405/14 ,  C08G59/3245

    摘要： This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3) wherein Y1 denotes a glycidyloxyarylmethyl group represented by —CH2—Ar—OG, Y2 and Y3 denote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.

    摘要翻译： 本发明涉及包含所述环氧树脂或其固化制品的新型环氧树脂和环氧树脂组合物。 固化物在阻燃性，粘合性，耐湿性和耐热性方面具有优异的性能，可用于层压，模塑，铸造和粘合等应用。 本发明的环氧树脂由下式（3）表示，其中Y 1表示由-CH 2 O -Ar-OG表示的缩水甘油氧基芳基甲基，Y 2和Y 3独立地表示缩水甘油基或上述缩水甘油氧基芳基甲基，Ar表示可被至多两个烃基取代的亚苯基，G表示缩水甘油基。

    Flame-retardant adhesive resin composition and adhesive film using the same
    8.
    发明授权
    Flame-retardant adhesive resin composition and adhesive film using the same 有权
    阻燃粘合剂树脂组合物和使用其的粘合膜

    公开(公告)号：US08268940B2

    公开(公告)日：2012-09-18

    申请号：US12530152

    申请日：2008-03-06

    申请人： Akira Mori ,  Kiwamu Tokuhisa ,  Kazuhiko Nakahara ,  Masashi Kaji

    发明人： Akira Mori ,  Kiwamu Tokuhisa ,  Kazuhiko Nakahara ,  Masashi Kaji

    IPC分类号： C08L63/00 ,  C08L79/08 ,  C08L83/10 ,  B32B27/28 ,  B32B27/38

    CPC分类号： C08G59/4284 ,  C08G59/04 ,  C08G59/245 ,  C08G73/106 ,  C08L63/00 ,  C08L2666/14 ,  C08L2666/22 ,  C09J163/00 ,  C09J179/08 ,  C09J183/10 ,  H05K3/386 ,  H05K2201/0162

    摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

    摘要翻译： 公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。 还公开了由所述组合物制备的粘合膜。 阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。 由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

    CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME
    9.
    发明申请
    CRYSTALLINE RESIN CURED PRODUCT, CRYSTALLINE RESIN COMPOSITE MATERIAL, AND METHOD FOR PRODUCING THE SAME 失效
    结晶树脂固化产品，结晶树脂复合材料及其制造方法

    公开(公告)号：US20100016473A1

    公开(公告)日：2010-01-21

    申请号：US12312369

    申请日：2007-11-08

    申请人： Masashi Kaji ,  Koichiro Ogami ,  Kazuhiko Nakahara ,  Tomomi Fukunaga

    发明人： Masashi Kaji ,  Koichiro Ogami ,  Kazuhiko Nakahara ,  Tomomi Fukunaga

    IPC分类号： C08L63/00 ,  C08G59/06

    CPC分类号： C08G59/245 ,  C08G59/5033 ,  C08G59/621 ,  C08G63/42

    摘要： Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

    摘要翻译： 提供一种显示出高导热性，低热膨胀，高耐热性，低吸湿性和良好阻气性的结晶树脂固化产物和由其制备的结晶树脂复合材料。 另外提供了结晶性树脂固化物和结晶性树脂复合材料的制造方法。 结晶性树脂固化物通过芳香族二缩水甘油基化合物或二缩水甘油基树脂与芳香族二羟基化合物或二羟基树脂的反应而得到，并且在差热分析中显示出10J / g以上的熔融热，同时吸热 对应于熔化的峰出现在120〜320℃的范围内。结晶性树脂复合材料通过将结晶性树脂固化物与填料或基材结合而得到。 结晶性树脂固化物具有由-A-O-CH 2 -CH（OH）-CH 2 -O-B-表示的单元，其中A和B是二价芳族基团。

    Aromatic ether polymer, method for producing the same, and polymer composition
    10.
    发明授权
    Aromatic ether polymer, method for producing the same, and polymer composition 有权
    芳族醚聚合物，其制备方法和聚合物组合物

    公开(公告)号：US08816038B2

    公开(公告)日：2014-08-26

    申请号：US12087602

    申请日：2007-01-10

    申请人： Masashi Kaji ,  Koichiro Ogami

    发明人： Masashi Kaji ,  Koichiro Ogami

    IPC分类号： C08G59/00 ,  C08G8/02 ,  C08G65/38

    CPC分类号： C08G59/06 ,  C08G65/38 ,  C08G2650/56 ,  H05K3/4676

    摘要： Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.

    摘要翻译： 公开了一种聚合物，其可用于制备环氧树脂组合物或其固化产物，其具有高耐热性，高导热性，低热膨胀性，高阻气性和高韧性的薄膜或片材。 聚合物是热塑性芳族醚聚合物，其包含由下列通式（1）表示的单元，其比例为10至100摩尔％，重均分子量为3,000或更大; 在式（1）中，X为氧原子或硫原子，R 1和R 2各自为氢原子，碳原子数1〜8的烷基，芳基，烷氧基，芳烷基或卤素 原子，n为1〜3的数。