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    Transparent capacitor with multi-layer grid structure
    3.
    发明授权
    Transparent capacitor with multi-layer grid structure 有权
    具有多层网格结构的透明电容

    公开(公告)号：US09235298B2

    公开(公告)日：2016-01-12

    申请号：US13305815

    申请日：2011-11-29

    Applicant: Mitchell Stewart Burberry ,  Ronald Steven Cok

    Inventor： Mitchell Stewart Burberry ,  Ronald Steven Cok

    IPC: G06F3/044 ,  H01G4/008 ,  H01G4/005 ,  G02F1/1343 ,  H05K3/02 ,  H05K1/16 ,  H05K3/46

    CPC classification number: G06F3/044 ,  G02F1/13439 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04111 ,  H01G4/005 ,  H01G4/008 ,  H05K1/162 ,  H05K3/027 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2203/107 ,  H05K2203/1194

    Abstract: A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.

    Abstract translation: 透明电容器装置包括：第一透明基板，包括第一图案化导电层，其具有位于第一透明基板上方的第一导电材料; 位于所述第一图案化导电层上方的电介质层; 第二图案化导电层，包括位于所述介电层上的第二导电材料，其中所述第二图案不同于所述第一图案; 以及位于第二图案化导电层上方的第二透明衬底。 第一图案化导电层的第一导电材料的部分重叠第二图案化导电层的第二导电材料的部分。 第一和第二导电材料的重叠部分形成具有空间匹配导电和非导电区域的匹配图案化电导体，第一和第二图案化导电层的非导电区域具有封装的聚结的导电材料结构。

    Making imprinted micro-wire rib structure
    4.
    发明授权
    Making imprinted micro-wire rib structure 有权
    制作印刷微线肋结构

    公开(公告)号：US09161456B1

    公开(公告)日：2015-10-13

    申请号：US14476059

    申请日：2014-09-03

    Applicant: Ronald Steven Cok ,  Mitchell Stewart Burberry

    Inventor： Ronald Steven Cok ,  Mitchell Stewart Burberry

    IPC: H01L21/4763 ,  H05K3/12 ,  H05K3/00

    CPC classification number: H05K3/1258 ,  H05K3/0014 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2203/0108 ,  H05K2203/088

    Abstract: A method of making a micro-wire rib structure includes providing a substrate and locating a curable layer on or over the substrate. The curable layer is imprinted and cured to form a cured layer including a cured-layer surface and a micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A curable conductive material is located in the micro-channel and cured to provide a cured electrical conductor forming a micro-wire in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s), to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

    Abstract translation: 制造微线肋结构的方法包括提供衬底并将可固化层定位在衬底上或衬底上。 可固化层被印迹固化以形成固化层，该固化层包括固化层表面和具有微通道深度的微通道，微通道底部，第一和第二微通道侧，以及一个或多个肋，其具有 相对的肋侧面和肋顶部限定肋高度小于微通道深度。 每个肋条位于第一和第二微通道侧之间，并且从微通道底部向固化层表面延伸。 可固化导电材料位于微通道中并固化以提供在微通道中形成微线的固化电导体。 微线从第一微通道侧，微通道底部，肋侧和肋顶部连续延伸到第二微通道侧，从第一微通道侧形成来自第一微通道侧的连续电导体 通道侧到第二微通道侧。

    VTFT WITH GATE ALIGNED TO VERTICAL STRUCTURE
    5.
    发明申请
    VTFT WITH GATE ALIGNED TO VERTICAL STRUCTURE 有权
    VTFT与门对齐到垂直结构

    公开(公告)号：US20150255626A1

    公开(公告)日：2015-09-10

    申请号：US14198682

    申请日：2014-03-06

    Applicant: Shelby Forrester Nelson ,  Carolyn Rae Ellinger ,  Mitchell Stewart Burberry

    Inventor： Shelby Forrester Nelson ,  Carolyn Rae Ellinger ,  Mitchell Stewart Burberry

    IPC: H01L29/786 ,  H01L29/06 ,  H01L29/49

    CPC classification number: H01L29/78642 ,  H01L29/42384 ,  H01L29/66969 ,  H01L29/7869

    Abstract: A thin film transistor includes a post on a substrate. The post has a height dimension extending away from the substrate to a top portion of the post which extends a distance beyond a bottom portion of the post in a direction parallel to the substrate to define a reentrant profile. A conformal conductive gate layer is located on an edge of the post in the reentrant profile and not over the top portion of the post, and includes a portion that extends along the substrate. A conformal insulating layer is on the gate layer in the reentrant profile. A conformal semiconductor layer is on the insulating layer in the reentrant profile. First and second electrodes are located in contact with first and second portions of the semiconductor layer over the top portion of the post and not over the top portion of the post, respectively.

    Abstract translation: 薄膜晶体管包括在基板上的柱。 该柱具有从衬底延伸到柱的顶部的高度尺寸，其在平行于衬底的方向上延伸超过柱的底部的距离以限定折返轮廓。 共形导电栅极层位于柱的边缘中的折入轮廓中，而不是位于柱的顶部之上，并且包括沿着衬底延伸的部分。 保形绝缘层位于折返轮廓中的栅极层上。 保形半导体层位于凹凸轮廓中的绝缘层上。 第一和第二电极分别与半导体层的第一和第二部分接触，位于柱的顶部上，而不分别位于柱的顶部。

    Hybrid single-side touch screen
    6.
    发明授权
    Hybrid single-side touch screen 有权
    混合单面触摸屏

    公开(公告)号：US09058084B2

    公开(公告)日：2015-06-16

    申请号：US13862586

    申请日：2013-04-15

    Applicant: Mitchell Stewart Burberry ,  Ronald Steven Cok

    Inventor： Mitchell Stewart Burberry ,  Ronald Steven Cok

    IPC: G06F3/041 ,  G06F3/044

    CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  G06F2203/04112

    Abstract: A single-side touch-screen device includes a substrate having a cured layer with a patterned arrangement of micro-channels embossed therein and a cured electrically conductive micro-wire formed in each micro-channel. A patterned dielectric insulator is located over one or more middle portions of at least some of the micro-wires forming insulated micro-wire portions and exposed micro-wire portions. A plurality of patterned transparent conductors are conformally coated in an array over at least a part of the patterned dielectric insulator, at least a part of the insulated micro-wire portions, and at least a part of the exposed micro-wire portions, the at least a part of the exposed micro-wire portions electrically connected to at least a portion of the patterned transparent conductors. The transparent conductors and the micro-wires form an array of electrically connected horizontal electrodes and an array of electrically connected vertical electrodes electrically isolated from the horizontal electrodes.

    Abstract translation: 单面触摸屏装置包括具有固化层的基板，其具有压印在其中的微通道的图案化布置，以及形成在每个微通道中的固化的导电微线。 图案化的电介质绝缘体位于形成绝缘微线部分和暴露的微线部分的至少一些微线的一个或多个中间部分上。 多个图案化的透明导体以阵列方式共形地涂覆在图案化电介质绝缘体的至少一部分上，绝缘的微线部分的至少一部分和暴露的微线部分的至少一部分， 暴露的微线部分的至少一部分电连接到图案化的透明导体的至少一部分。 透明导体和微线形成电连接的水平电极的阵列和与水平电极电隔离的电连接的垂直电极的阵列。

    TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID STRUCTURE
    8.
    发明申请
    TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID STRUCTURE 有权
    具有多层网格结构的透明电容器

    公开(公告)号：US20130135548A1

    公开(公告)日：2013-05-30

    申请号：US13305815

    申请日：2011-11-29

    Applicant: Mitchell Stewart Burberry ,  Ronald Steven Cok

    Inventor： Mitchell Stewart Burberry ,  Ronald Steven Cok

    IPC: G02F1/1343 ,  H01G4/008 ,  H01G4/005

    CPC classification number: G06F3/044 ,  G02F1/13439 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04111 ,  H01G4/005 ,  H01G4/008 ,  H05K1/162 ,  H05K3/027 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2203/107 ,  H05K2203/1194

    Abstract: A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.

    Abstract translation: 透明电容器装置包括：第一透明基板，包括第一图案化导电层，其具有位于第一透明基板上方的第一导电材料; 位于所述第一图案化导电层上方的电介质层; 第二图案化导电层，包括位于所述介电层上的第二导电材料，其中所述第二图案不同于所述第一图案; 以及位于第二图案化导电层上方的第二透明衬底。 第一图案化导电层的第一导电材料的部分重叠第二图案化导电层的第二导电材料的部分。 第一和第二导电材料的重叠部分形成具有空间匹配导电和非导电区域的匹配图案化电导体，第一和第二图案化导电层的非导电区域具有封装的聚结的导电材料结构。

    Laser dye or pigment removal imaging process
    9.
    发明授权
    Laser dye or pigment removal imaging process 失效
    激光染料或颜料去除成像工艺

    公开(公告)号：US5672458A

    公开(公告)日：1997-09-30

    申请号：US681582

    申请日：1996-07-29

    Applicant: Lee William Tutt ,  Mitchell Stewart Burberry ,  Vito A. DePalma ,  William Keith Goebel ,  Scott Eric Tunney

    Inventor： Lee William Tutt ,  Mitchell Stewart Burberry ,  Vito A. DePalma ,  William Keith Goebel ,  Scott Eric Tunney

    IPC: B41M5/26 ,  B41M5/24 ,  B41M7/00 ,  G03G17/00 ,  H05K3/06 ,  G03G13/20 ,  B32B9/04

    CPC classification number: G03G17/00 ,  B41M5/24 ,  B41M7/0027 ,  H05K3/065 ,  Y10S430/146

    Abstract: A process of forming a single color, ablation image having improved abrasion resistance comprising: a) imagewise-heating by means of a laser an ablative recording element comprising a support having thereon an image layer comprising an image dye or pigment dispersed in a polymeric binder, which causes the image layer to ablate imagewise, the image layer having a near infrared-absorbing material associated therewith to absorb at a given wavelength of the laser used to expose the element, the image dye or pigment absorbing in the region of from about 300 to about 700 nm; b) removing the ablated material to obtain an image in the ablative recording element; c) either charging the imaged, ablative recording element to a given polarity or applying a voltage across the surface of the element which is attracted to a conductive surface behind the element; d) applying colorless, charged particles to the element which causes them to be electrostatically attracted to the surface of the image layer; and e) heat-fusing the particles to obtain a protective overcoat over the entire surface of the image layer.

    Abstract translation: 一种形成具有改善的耐磨性的单色消融图像的方法，包括：a）通过激光对烧蚀记录元件进行成像加热，所述烧蚀记录元件包括其上具有分散在聚合物粘合剂中的图像层的图像层， 这导致图像层以图像方式烧蚀，图像层具有与其相关联的近红外吸收材料，以在用于暴露元件的激光的给定波长处吸收，图像染料或颜料在约300至 约700nm; b）去除烧蚀的材料以获得烧蚀记录元件中的图像; c）将成像的烧蚀记录元件充电到给定的极性，或者在被吸引到元件后面的导电表面的元件的表面上施加电压; d）将无色带电粒子施加到元件上，使其静电吸引到图像层的表面; 以及e）热熔融所述颗粒以在所述图像层的整个表面上获得保护性外涂层。

    IMPRINTED MULTI-LAYER BIOCIDAL PARTICLE STRUCTURE
    10.
    发明申请
    IMPRINTED MULTI-LAYER BIOCIDAL PARTICLE STRUCTURE 有权
    改进的多层生物颗粒结构

    公开(公告)号：US20160212988A1

    公开(公告)日：2016-07-28

    申请号：US14607100

    申请日：2015-01-28

    Applicant: Mitchell Stewart Burberry ,  Ronald Steven Cok

    Inventor： Mitchell Stewart Burberry ,  Ronald Steven Cok

    IPC: A01N25/34

    CPC classification number: A01N25/34 ,  A01N25/10 ,  A01N59/16 ,  A01N25/04 ,  A01N25/08 ,  A01N59/20

    Abstract: A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the first cured layer.

    Abstract translation: 多层杀生物结构包括载体。 结构化双层位于支撑上或上方。 所述双层包括位于所述载体上或上方的第一固化层，以及在所述第一固化层的与所述载体相对的一侧上的第一固化层上或上的第二层。 结构化双层具有比第二层的厚度大至少一个深度。 多个杀生物颗粒仅位于第一固化层中。

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