摘要:
Methods and apparatus to provide accurate alignment for semiconductor sockets are described. In one embodiment, a carrier is utilized to align a device under test with a test socket. In some embodiments, alignment features on a carrier, a device under test, and/or a test socket are used to align the devices relative to each other.
摘要:
Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.
摘要:
Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.
摘要:
Improved variable-pitch pick and place devices may include one or more improvements such as a mechanical linkage such as pantograph linkage, the linkage itself linked to a plurality of device-gripping mechanisms arranged in a row so as to keep uniform, though variable, spacing between the device-gripping mechanisms, with the number of such mechanisms being increased relative to the number of parts in the linkage for reduced tolerance stack-up and improved positioning accuracy. The horizontal position of the linkage may be fixed at a position not at an end thereof, and desirably within the middle third or at the middle thereof. The linkage may be controlled at three points. These points may include a vertically flexible but horizontally fixed link to a supporting structure at the middle of the pantograph, a link at one end of the pantograph to one side of an endless loop of timing belt, and a link at the other end of the pantograph to the other side of the endless loop of timing belt. The links to the timing belt at the ends of the pantograph may be made via two end-most device-gripping mechanisms. The position of the timing belt may be controlled by a servomotor with a position encoder, the servomotor controlled by a controller such as a computer. The device-gripping mechanisms may include a vacuum tip grounded and supplied with vacuum by an electrically-conductive vacuum tube.