公开(公告)号：US20150276798A1

公开(公告)日：2015-10-01

申请号：US14229808

申请日：2014-03-28

申请人： David Won-jun Song ,  Christopher Roy Schroeder ,  Joseph Walczyk ,  Lothar Kress ,  Todd Michael Young ,  Robert Levi Bennett ,  Arun Krishnamoorthy ,  Paul Jonathan Diglio ,  Charles Clifton Fulton ,  Sruti Chigullapalli

发明人： David Won-jun Song ,  Christopher Roy Schroeder ,  Joseph Walczyk ,  Lothar Kress ,  Todd Michael Young ,  Robert Levi Bennett ,  Arun Krishnamoorthy ,  Paul Jonathan Diglio ,  Charles Clifton Fulton ,  Sruti Chigullapalli

IPC分类号： G01R1/04 ,  G01R31/26

CPC分类号： G01R1/04 ,  G01R1/07307 ,  G01R31/2601 ,  G01R31/2874

摘要： Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.

摘要翻译： 描述了热界面材料处理用于待测电子元件的热控制。 在一个示例中，热控制单元适于在测试期间控制电子部件的至少一部分的温度。 热控制单元和电子部件之间的基座将热量从电子部件传导到热敏头。 导管延伸穿过基座的一部分，以允许液体热界面材料从外部源流到基座和电子部件之间的空间。 液体热界面材料改善了电子部件和基座之间的热传导。 电子设备和基座之间的弹性体密封限制了电子部件和基座之间的空间内的热界面流体。

公开(公告)号：US09377486B2

公开(公告)日：2016-06-28

申请号：US14229808

申请日：2014-03-28

申请人： David Won-jun Song ,  Christopher Roy Schroeder ,  Joseph Walczyk ,  Lothar Kress ,  Todd Michael Young ,  Robert Levi Bennett ,  Arun Krishnamoorthy ,  Paul Jonathan Diglio ,  Charles Clifton Fulton ,  Sruti Chigullapalli

发明人： David Won-jun Song ,  Christopher Roy Schroeder ,  Joseph Walczyk ,  Lothar Kress ,  Todd Michael Young ,  Robert Levi Bennett ,  Arun Krishnamoorthy ,  Paul Jonathan Diglio ,  Charles Clifton Fulton ,  Sruti Chigullapalli

IPC分类号： H01L23/34 ,  H01L23/495 ,  G01R1/04 ,  G01R31/26

CPC分类号： G01R1/04 ,  G01R1/07307 ,  G01R31/2601 ,  G01R31/2874

摘要： Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.

摘要翻译： 描述了热界面材料处理用于待测电子元件的热控制。 在一个示例中，热控制单元适于在测试期间控制电子部件的至少一部分的温度。 热控制单元和电子部件之间的基座将热量从电子部件传导到热敏头。 导管延伸穿过基座的一部分，以允许液体热界面材料从外部源流到基座和电子部件之间的空间。 液体热界面材料改善了电子部件和基座之间的热传导。 电子设备和基座之间的弹性体密封限制了电子部件和基座之间的空间内的热界面流体。