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    Thermoelectric device
    3.
    发明申请
    Thermoelectric device 审中-公开
    热电装置

    公开(公告)号：US20070204898A1

    公开(公告)日：2007-09-06

    申请号：US11526418

    申请日：2006-09-25

    Applicant: Mark Logan ,  Frederick Flitsch ,  Lloyd Wright ,  Lloyd Young

    Inventor： Mark Logan ,  Frederick Flitsch ,  Lloyd Wright ,  Lloyd Young

    IPC: H01L35/02 ,  H01L35/34

    CPC classification number: H01L35/34 ,  H01L35/32

    Abstract: A thermoelectric device and a method for manufacturing a thermoelectric device is presented that provides greater efficiency of operation and highly accurate temperature control. According to the present invention, a thermal gap is created between N-type material and P-type materials on a monolayer basis to create a highly efficient thermoelectric device. In some embodiments, two or more gold sphere monolayers are spincast on a conductive platform with insulator layers also laid down. Endpoints can also be etched into the gold spheres.

    Abstract translation: 提出了一种提供更高效率的操作和高精度温度控制的热电装置和制造热电装置的方法。 根据本发明，在单层的基础上在N型材料和P型材料之间产生热间隙，以产生高效的热电装置。 在一些实施方案中，两个或更多个金球单分子在导电平台上旋转，绝缘体层也被放置。 端点也可以蚀刻到金球体中。

    Apparatus and method for providing enhanced heat transfer from a body
    4.
    发明申请
    Apparatus and method for providing enhanced heat transfer from a body 有权
    用于提供来自身体的增强的热传递的装置和方法

    公开(公告)号：US20060293734A1

    公开(公告)日：2006-12-28

    申请号：US11413564

    申请日：2006-04-27

    Applicant: David Scott ,  Ben Brian ,  Lloyd Wright ,  Leo Chin ,  Edward Hollmen ,  Daniel Seegars ,  Mark Logan

    Inventor： David Scott ,  Ben Brian ,  Lloyd Wright ,  Leo Chin ,  Edward Hollmen ,  Daniel Seegars ,  Mark Logan

    IPC: A61F7/00 ,  A61F7/12

    CPC classification number: A61F7/12 ,  A61F2007/0054 ,  A61F2007/0093 ,  A61F2007/0095 ,  A61F2007/126 ,  A61M1/369 ,  A61M2205/3372 ,  F28D2021/005 ,  F28F2280/02

    Abstract: Methods and apparatuses for temperature modification of a patient, or selected regions thereof, including an induced state of hypothermia. The temperature modification is accomplished using an in-dwelling heat exchange catheter within which a fluid heat exchange medium circulates. A heat exchange cassette is attached to the circulatory conduits of the catheter, the heat exchange cassette being sized to engage a cavity within a control unit. The control unit includes a heater/cooler device for providing heated or cooled fluid to a heat exchanger in thermal communication with the fluid heat exchange medium circulating to the heat exchange catheter, a user input device, and a processor connected to receive input from various sensors around the body and the system. A temperature control scheme for ramping the body temperature up or down without overshoot is provided.

    Abstract translation: 包括诱导低温的状态的患者的温度改变方法和装置，或其选定区域。 使用在其中流体热交换介质循环的内部热交换导管来实现温度改变。 热交换盒附接到导管的循环导管，热交换盒的尺寸设计成与控制单元内的空腔接合。 控制单元包括加热器/冷却器装置，用于将热或冷却的流体提供给与循环到热交换导管的流体热交换介质热连通的热交换器，用户输入装置和连接以从各种传感器接收输入的处理器 围绕身体和系统。 提供了一种用于使体温上升或下降而没有过冲的温度控制方案。

    Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same
    8.
    发明授权
    Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same 失效
    具有热电和热循环特性的器件及其制造方法

    公开(公告)号：US07514013B2

    公开(公告)日：2009-04-07

    申请号：US11519180

    申请日：2006-09-11

    Applicant: Mark Logan ,  Frederick A. Flitsch ,  Lloyd Wright ,  Lloyd Young

    Inventor： Mark Logan ,  Frederick A. Flitsch ,  Lloyd Wright ,  Lloyd Young

    IPC: B44C1/22 ,  H01L21/302

    CPC classification number: H01L35/34 ,  H01L35/32

    Abstract: The present invention relates to methods for forming thermoelectric and thermodiodic devices including a monolayer of multiple conductive material units with a first surface including a composite of multiple conductive units in electrical contact with a conductive substrate; a second surface with a composite of multiple conductive units; an ioni conductor; and a second surface. A resulting device can include a semiconductor device.

    Abstract translation: 本发明涉及用于形成热电和热碘周期器件的方法，其包括多层导电材料单元的单层，第一表面包括与导电基底电接触的多个导电单元的复合物; 具有多个导电单元的复合材料的第二表面; 离子导体; 和第二表面。 所得到的器件可以包括半导体器件。

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