公开(公告)号：US09852965B2

公开(公告)日：2017-12-26

申请号：US15204632

申请日：2016-07-07

申请人： Ho-Jin Lee ,  Byung Lyul Park ,  Kwangjin Moon ,  Jisoon Park ,  Jin Ho An

发明人： Ho-Jin Lee ,  Byung Lyul Park ,  Kwangjin Moon ,  Jisoon Park ,  Jin Ho An

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/76898 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2924/181 ,  H01L2924/00012

摘要： Provided herein are semiconductor devices with through electrodes and methods of fabricating the same. The methods may include providing a semiconductor substrate having top and bottom surfaces facing each other, forming on the top surface of the semiconductor substrate a main via having a hollow cylindrical structure and a metal line connected to the main via, forming an interlayered insulating layer on the top surface of the semiconductor substrate to cover the main via and the metal line, removing a portion of the semiconductor substrate to form a via hole exposing a portion of a bottom surface of the main via, and forming in the via hole a through electrode that is electrically connected to the main via. The bottom surface of the main via is overlapped by a circumference of the via hole, when viewed in a plan view.

公开(公告)号：US09153522B2

公开(公告)日：2015-10-06

申请号：US14028523

申请日：2013-09-16

申请人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

发明人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

IPC分类号： H01L23/48 ,  H01L23/532 ,  H01L25/065 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/481 ,  H01L21/30625 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/05552

摘要： Provided are semiconductor devices and methods of fabricating the same. The device may include a substrate including a first surface and a second surface opposing each other, a through-silicon-via (TSV) electrode provided in a via hole that may be formed to penetrate the substrate, and an integrated circuit provided adjacent to the through electrode on the first surface. The through electrode includes a metal layer filling a portion of the via hole and an alloy layer filling a remaining portion of the via hole. The alloy layer contains at least two metallic elements, one of which may be the same as that contained in the metal layer, and the other of which may be different from that contained in the metal layer.

摘要翻译： 提供半导体器件及其制造方法。 该器件可以包括包括彼此相对的第一表面和第二表面的衬底，设置在可以形成为穿透衬底的通孔中的穿硅通孔（TSV）电极，以及设置在邻近 通过第一表面上的电极。 贯通电极包括填充通孔的一部分的金属层和填充通孔的剩余部分的合金层。 合金层含有至少两种金属元素，其中之一可以与金属层中的金属元素相同，另一种可能与金属层中所含金属元素不同。

公开(公告)号：US20120039564A1

公开(公告)日：2012-02-16

申请号：US13191874

申请日：2011-07-27

申请人： Pil-Kyu Kang ,  GilHeyun Choi ,  Sukchul Bang ,  Daelok Bae ,  Byung-Lyul Park ,  KwangJin Moon ,  Dong-Chan Lim ,  Deok-Young Jung

发明人： Pil-Kyu Kang ,  GilHeyun Choi ,  Sukchul Bang ,  Daelok Bae ,  Byung-Lyul Park ,  KwangJin Moon ,  Dong-Chan Lim ,  Deok-Young Jung

IPC分类号： G02B6/12

CPC分类号： G02B6/131 ,  G02B6/132 ,  G02B6/136 ,  G02B2006/12061

摘要： A photoelectric integrated circuit device may include a substrate including an electronic device region and an on die optical input/output device region, the substrate having a trench in the on die optical input/output device region; a lower clad layer provided in the trench, the lower clad layer having an upper surface lower than a surface of the substrate; a core provided on the lower clad layer; an insulating pattern provided on the core; an optical detection pattern provided on the insulating pattern, the optical detection pattern having at least a portion provided in the trench; and at least one transistor provided on the substrate of the electronic device region.

摘要翻译： 光电集成电路器件可以包括包括电子器件区域和裸片上的光输入/输出器件区域的衬底，所述衬底在管芯光输入/输出器件区域中具有沟槽; 设置在所述沟槽中的下包层，所述下包层具有比所述基板的表面低的上表面; 设置在下包层上的芯; 设置在芯上的绝缘图案; 设置在所述绝缘图案上的光学检测图案，所述光学检测图案具有设置在所述沟槽中的至少一部分; 以及设置在电子器件区域的衬底上的至少一个晶体管。

公开(公告)号：US20150137326A1

公开(公告)日：2015-05-21

申请号：US14463645

申请日：2014-08-19

申请人： Pil-Kyu KANG ,  Byung Lyul PARK ,  SungHee KANG ,  TAESEONG KIM ,  TAEYEONG KIM ,  KWANGJIN MOON ,  Jae-Hwa PARK ,  SUKCHUL BANG ,  Seongmin SON ,  JIN HO AN ,  Ho-Jin LEE ,  JEONGGI JIN

发明人： Pil-Kyu KANG ,  Byung Lyul PARK ,  SungHee KANG ,  TAESEONG KIM ,  TAEYEONG KIM ,  KWANGJIN MOON ,  Jae-Hwa PARK ,  SUKCHUL BANG ,  Seongmin SON ,  JIN HO AN ,  Ho-Jin LEE ,  JEONGGI JIN

IPC分类号： H01L23/48 ,  H01L21/311 ,  H01L21/02 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/7682 ,  H01L21/76831 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor substrate having a top surface and a bottom surface facing each other, an interlayer dielectric layer provided on the top surface of the semiconductor substrate and including an integrated circuit, an inter-metal dielectric layer provided on the interlayer dielectric layer and including at least one metal interconnection electrically connected to the integrated circuit, an upper dielectric layer disposed on the inter-metal dielectric layer, a through-electrode penetrating the inter-metal dielectric layer, the interlayer dielectric layer, and the semiconductor substrate, a via-dielectric layer surrounding the through-electrode and electrically insulating the through-electrode from the semiconductor substrate. The via-dielectric layer includes one or more air-gaps between the upper dielectric layer and the interlayer dielectric layer.

摘要翻译： 半导体器件包括具有彼此相对的顶表面和底表面的半导体衬底，设置在半导体衬底的顶表面上并且包括集成电路的层间介质层，设置在层间介电层上的金属间介电层 并且包括电连接到集成电路的至少一个金属互连，设置在金属间电介质层上的上部电介质层，贯穿金属间介电层的贯通电极，层间绝缘层和半导体基板， 所述通孔电介质层包围所述贯通电极，并且使所述通孔与所述半导体基板电绝缘。 通孔电介质层包括上电介质层和层间电介质层之间的一个或多个气隙。

公开(公告)号：US20140084473A1

公开(公告)日：2014-03-27

申请号：US14028523

申请日：2013-09-16

申请人： KWANGJIN MOON ,  SungHee KANG ,  TAESEONG KIM ,  Byung Lyul PARK ,  Yeun-Sang PARK ,  SUKCHUL BANG

发明人： KWANGJIN MOON ,  SungHee KANG ,  TAESEONG KIM ,  Byung Lyul PARK ,  Yeun-Sang PARK ,  SUKCHUL BANG

IPC分类号： H01L23/48 ,  H01L23/532

CPC分类号： H01L23/481 ,  H01L21/30625 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/05552

摘要： Provided are semiconductor devices and methods of fabricating the same. The device may include a substrate including a first surface and a second surface opposing each other, a through-silicon-via (TSV) electrode provided in a via hole that may be formed to penetrate the substrate, and an integrated circuit provided adjacent to the through electrode on the first surface. The through electrode includes a metal layer filling a portion of the via hole and an alloy layer filling a remaining portion of the via hole. The alloy layer contains at least two metallic elements, one of which may be the same as that contained in the metal layer, and the other of which may be different from that contained in the metal layer.

摘要翻译： 提供半导体器件及其制造方法。 该器件可以包括包括彼此相对的第一表面和第二表面的衬底，设置在可以形成为穿透衬底的通孔中的穿硅通孔（TSV）电极，以及设置在邻近 通过第一表面上的电极。 贯通电极包括填充通孔的一部分的金属层和填充通孔的剩余部分的合金层。 合金层含有至少两种金属元素，其中之一可以与金属层中的金属元素相同，另一种可能与金属层中所含金属元素不同。

公开(公告)号：US09847276B2

公开(公告)日：2017-12-19

申请号：US14463645

申请日：2014-08-19

申请人： Pil-Kyu Kang ,  Byung Lyul Park ,  SungHee Kang ,  Taeseong Kim ,  Taeyeong Kim ,  Kwangjin Moon ,  Jae-Hwa Park ,  Sukchul Bang ,  Seongmin Son ,  Jin Ho An ,  Ho-Jin Lee ,  Jeonggi Jin

发明人： Pil-Kyu Kang ,  Byung Lyul Park ,  SungHee Kang ,  Taeseong Kim ,  Taeyeong Kim ,  Kwangjin Moon ,  Jae-Hwa Park ,  Sukchul Bang ,  Seongmin Son ,  Jin Ho An ,  Ho-Jin Lee ,  Jeonggi Jin

IPC分类号： H01L29/40 ,  H01L23/48 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L21/7682 ,  H01L21/76831 ,  H01L21/76898 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor substrate having a top surface and a bottom surface facing each other, an interlayer dielectric layer provided on the top surface of the semiconductor substrate and including an integrated circuit, an inter-metal dielectric layer provided on the interlayer dielectric layer and including at least one metal interconnection electrically connected to the integrated circuit, an upper dielectric layer disposed on the inter-metal dielectric layer, a through-electrode penetrating the inter-metal dielectric layer, the interlayer dielectric layer, and the semiconductor substrate, a via-dielectric layer surrounding the through-electrode and electrically insulating the through-electrode from the semiconductor substrate. The via-dielectric layer includes one or more air-gaps between the upper dielectric layer and the interlayer dielectric layer.

公开(公告)号：US09679829B2

公开(公告)日：2017-06-13

申请号：US14809159

申请日：2015-07-24

申请人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

发明人： Kwangjin Moon ,  SungHee Kang ,  Taeseong Kim ,  Byung Lyul Park ,  Yeun-Sang Park ,  Sukchul Bang

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L23/532 ,  H01L21/306 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/481 ,  H01L21/30625 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/53238 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/05552

摘要： Provided are semiconductor devices and methods of fabricating the same. The device may include a substrate including a first surface and a second surface opposing each other, a through-silicon-via (TSV) electrode provided in a via hole that may be formed to penetrate the substrate, and an integrated circuit provided adjacent to the through electrode on the first surface. The through electrode includes a metal layer filling a portion of the via hole and an alloy layer filling a remaining portion of the via hole. The alloy layer contains at least two metallic elements, one of which may be the same as that contained in the metal layer, and the other of which may be different from that contained in the metal layer.

公开(公告)号：US09673133B2

公开(公告)日：2017-06-06

申请号：US14939394

申请日：2015-11-12

申请人： Jae-Hwa Park ,  Kwangjin Moon ,  Byung Lyul Park ,  Sukchul Bang

发明人： Jae-Hwa Park ,  Kwangjin Moon ,  Byung Lyul Park ,  Sukchul Bang

IPC分类号： H01L23/48 ,  H01L23/50 ,  H01L23/528

CPC分类号： H01L23/481 ,  H01L23/50 ,  H01L23/528 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices having through-electrodes are provided. The semiconductor devices may include a substrate, a through-electrode penetrating vertically through the substrate, a circuit layer on the substrate and metal lines in the circuit layer. The metal lines may include two first metals on opposing edges of a top surface of the through-electrode and second metals above the top surface of the through-electrode. At least some of the second metals may not vertically overlap the two first metals.

公开(公告)号：US20160133545A1

公开(公告)日：2016-05-12

申请号：US14939394

申请日：2015-11-12

申请人： Jae-Hwa PARK ,  Kwangjin MOON ,  Byung Lyul PARK ,  Sukchul BANG

发明人： Jae-Hwa PARK ,  Kwangjin MOON ,  Byung Lyul PARK ,  Sukchul BANG

IPC分类号： H01L23/48 ,  H01L23/50

CPC分类号： H01L23/481 ,  H01L23/50 ,  H01L23/528 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices having through-electrodes are provided. The semiconductor devices may include a substrate, a through-electrode penetrating vertically through the substrate, a circuit layer on the substrate and metal lines in the circuit layer. The metal lines may include two first metals on opposing edges of a top surface of the through-electrode and second metals above the top surface of the through-electrode. At least some of the second metals may not vertically overlap the two first metals.

摘要翻译： 提供具有通孔的半导体器件。 半导体器件可以包括衬底，垂直穿过衬底的贯通电极，衬底上的电路层和电路层中的金属线。 金属线可以包括在通孔的顶表面的相对边缘上的两个第一金属和在通孔的顶表面上方的第二金属。 至少一些第二金属可能不垂直地重叠两个第一金属。

公开(公告)号：US20130052794A1

公开(公告)日：2013-02-28

申请号：US13597352

申请日：2012-08-29

申请人： Sukchul Bang ,  Kwangjin Moon ,  Byung Lyul Park ,  Dosun Lee ,  Deok-Young Jung ,  Gilheyun Choi

发明人： Sukchul Bang ,  Kwangjin Moon ,  Byung Lyul Park ,  Dosun Lee ,  Deok-Young Jung ,  Gilheyun Choi

IPC分类号： H01L21/762

CPC分类号： H01L23/5226 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L25/0657 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/06181 ,  H01L2224/11002 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06544 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： Provided are semiconductor devices having through electrodes and methods of fabricating the same. The method includes providing a substrate including top and bottom surfaces facing each other, forming a hole and a gap extending from the top surface of the substrate toward the bottom surface of the substrate, the gap surrounding the hole and being shallower than the hole, filling the hole with an insulating material, forming a metal interconnection line on the top surface of the substrate on the insulating material, recessing the bottom surface of the substrate to expose the insulating material, removing the insulating material to expose the metal interconnection line via the hole, filling the hole with a conductive material to form a through electrode connected to the metal interconnection line, recessing the bottom surface of the substrate again to expose the gap, and forming a lower insulating layer on the bottom surface of the substrate.

摘要翻译： 提供了具有通过电极的半导体器件及其制造方法。 所述方法包括提供包括彼此面对的顶表面和底表面的基板，形成从基板的顶表面延伸到基板的底表面的孔和间隙，围绕孔的间隙并且比孔更浅，填充 所述孔具有绝缘材料，在所述绝缘材料的所述基板的顶表面上形成金属互连线，凹陷所述基板的底表面以暴露所述绝缘材料，去除所述绝缘材料以经由所述孔暴露所述金属互连线 用导电材料填充孔以形成连接到金属互连线的通孔，再次使基板的底表面露出以露出间隙，并在基底的底表面上形成下绝缘层。