公开(公告)号：US20240351132A1

公开(公告)日：2024-10-24

申请号：US18636502

申请日：2024-04-16

申请人： Kulicke and Soffa Industries, Inc.

发明人： Devesh Sharma ,  Peter Julius Klaerner ,  Henri Seppaenen

IPC分类号： B23K20/10 ,  B23K20/00

CPC分类号： B23K20/106 ,  B23K20/002

摘要： An ultrasonic welding system is provided. The ultrasonic welding system includes a sonotrode configured to ultrasonically weld a conductive pin to a workpiece. The ultrasonic welding system also includes a pin feeding system configured to feed the conductive pin to the sonotrode, the pin feeding system including a pin supply tube.

公开(公告)号：US20240250063A1

公开(公告)日：2024-07-25

申请号：US18412719

申请日：2024-01-15

申请人： Kulicke and Soffa Industries, Inc.

发明人： Hui Xu ,  Gary S. Gillotti

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/432 ,  H01L2224/437 ,  H01L2224/78824 ,  H01L2224/859

摘要： A method of operating a wire bonding machine is provided. The method includes the steps of: (a) attempting to bond a free air ball to a first bonding location using a wire bonding tool; (b) detecting that the free air ball was not properly bonded to the first bonding location in step (a); (c) bonding the free air ball to a second bonding location; (d) raising the wire bonding tool, with a wire engaged with the wire bonding tool continuous with the bonded free air ball, to a position above the bonded free air ball; (e) weakening a neck portion of a wire above the free air ball after step (d); and (f) separating the bonded free air ball from the wire after step (e) such that a wire tail extends below a tip of a wire bonding tool.

公开(公告)号：US11937979B2

公开(公告)日：2024-03-26

申请号：US17718474

申请日：2022-04-12

申请人： Kulicke and Soffa Industries, Inc.

发明人： Dominick Albert DeAngelis ,  Gary Walter Schulze

IPC分类号： B23K20/00 ,  A61B8/00 ,  B23K20/10

CPC分类号： A61B8/445 ,  A61B8/4433 ,  A61B8/4455 ,  A61B8/4494 ,  B23K20/005 ,  B23K20/10

摘要： An ultrasonic transducer system is provided. The ultrasonic transducer system includes a transducer body, wherein at least a portion of a surface of the transducer body includes a processed area. The processed area has a changed condition at the surface of the transducer body.

公开(公告)号：US11935864B2

公开(公告)日：2024-03-19

申请号：US17971722

申请日：2022-10-24

申请人： Kulicke and Soffa Industries, Inc.

发明人： Hui Xu ,  JeongHo Yang ,  Wei Qin ,  Ziauddin Ahmad

IPC分类号： B23K20/00 ,  H01L23/00

CPC分类号： H01L24/78 ,  B23K20/004 ,  H01L24/85 ,  H01L2224/7892 ,  H01L2224/78984

摘要： A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

公开(公告)号：US20240014169A1

公开(公告)日：2024-01-11

申请号：US18219988

申请日：2023-07-10

申请人： Kulicke and Soffa Industries, Inc.

发明人： ODAL KWON

IPC分类号： H01L23/00 ,  G01R31/28

CPC分类号： H01L24/85 ,  G01R31/2832 ,  H01L2224/859

摘要： A method of testing a bonded wire on a wire bonding machine is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location using a wire bonding tool on a wire bonding machine to form a bonded portion of the wire; (b) moving the wire bonding tool away from the bonded portion of the wire after step (a) with the wire engaged with the wire bonding tool; and (c) moving the wire bonding tool along a motion profile after step (b), with the wire engaged with the wire bonding tool to test the wire.

公开(公告)号：US11850676B2

公开(公告)日：2023-12-26

申请号：US17333875

申请日：2021-05-28

申请人： Kulicke and Soffa Industries, Inc.

发明人： Theodore J. Copperthite ,  Richard J. McCartney, Jr. ,  Omid Niayesh

IPC分类号： B23K20/10 ,  B23K20/00 ,  B23K37/04 ,  H05K3/32 ,  B23K101/40 ,  H01L23/49 ,  B23K101/42

CPC分类号： B23K20/10 ,  B23K20/002 ,  B23K37/04 ,  H05K3/328 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/49 ,  H05K2203/0285

摘要： An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a conductive pin supply configured to provide a plurality of conductive pins for welding using the sonotrode.

公开(公告)号：US20230377936A1

公开(公告)日：2023-11-23

申请号：US18228233

申请日：2023-07-31

申请人： Kulicke and Soffa Industries, Inc.

发明人： Val Marinov

IPC分类号： H01L21/683 ,  B32B38/10 ,  H01L21/67 ,  B32B37/00 ,  B32B37/12 ,  B32B38/00 ,  B32B38/18 ,  H01L23/00 ,  B32B38/04 ,  B32B37/26

CPC分类号： H01L21/6836 ,  B32B38/10 ,  H01L21/67144 ,  B32B37/025 ,  B32B37/12 ,  B32B38/0004 ,  B32B38/1858 ,  H01L21/6835 ,  H01L24/83 ,  H01L2224/83203 ,  B32B2457/14 ,  H01L2224/75251 ,  H01L2221/68354 ,  H01L2224/75314 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2221/68318 ,  H01L2224/2919 ,  H01L2224/75317 ,  H01L2221/68368 ,  B32B2038/045 ,  B32B2038/0016 ,  H01L2224/83005 ,  B32B2307/40 ,  B32B2037/268 ,  H01L2221/68381 ,  H01L2221/68327 ,  B32B2310/0831 ,  H01L2224/32225

摘要： Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.

公开(公告)号：US20230347442A1

公开(公告)日：2023-11-02

申请号：US18133447

申请日：2023-04-11

申请人： Kulicke and Soffa Industries, Inc.

发明人： Cristian D. Cionea ,  Christoph B. Luechinger ,  Raymond Chen

IPC分类号： B23K20/02 ,  B23K20/00

CPC分类号： B23K20/025 ,  B23K20/007 ,  B23K2101/32

摘要： A wire bonding tool is provided. The wire bonding tool includes a body portion including a tip portion. The wire bonding tool also includes a first coating applied to the tip portion. The wire bonding tool also includes a second coating applied to the first coating.

公开(公告)号：US11776933B2

公开(公告)日：2023-10-03

申请号：US17090278

申请日：2020-11-05

申请人： Kulicke and Soffa Industries, Inc.

发明人： Adeel Ahmad Bajwa

IPC分类号： B23K20/00 ,  H01L21/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/50

CPC分类号： H01L24/89 ,  H01L21/50 ,  H01L21/67017 ,  H01L21/67103 ,  H01L24/75 ,  H01L2224/81065

摘要： A method of bonding a semiconductor element to a substrate includes: carrying a semiconductor element including a plurality of first electrically conductive structures with a bonding tool; supporting a substrate including a plurality of second electrically conductive structures with a support structure; providing a reducing gas in contact with each of the plurality of first conductive structures and the plurality of second conductive structures; establishing contact between corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures; moving at least one of the semiconductor element and the substrate such that the corresponding ones of the plurality of first conductive structures and the plurality of second conductive structures are separated; re-establishing contact between the plurality of first conductive structures and the plurality of second conductive structures; and bonding the plurality of first conductive structures to the respective ones of the plurality of second conductive structures.

公开(公告)号：US11728201B2

公开(公告)日：2023-08-15

申请号：US17164269

申请日：2021-02-01

申请人： Kulicke and Soffa Industries, Inc.

发明人： Val Marinov

IPC分类号： H01L21/683 ,  B32B37/00 ,  B32B38/00 ,  B32B38/10 ,  B32B38/18 ,  H01L21/67 ,  B32B37/12 ,  H01L23/00 ,  B32B37/26 ,  B32B38/04

CPC分类号： H01L21/6836 ,  B32B37/025 ,  B32B37/12 ,  B32B38/0004 ,  B32B38/10 ,  B32B38/1858 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/83 ,  B32B2037/268 ,  B32B2038/0016 ,  B32B2038/045 ,  B32B2307/40 ,  B32B2310/0831 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/75251 ,  H01L2224/75314 ,  H01L2224/75317 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83874 ,  H01L2224/83203 ,  H01L2924/00014 ,  H01L2224/83874 ,  H01L2924/00014

摘要： Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.