Sintered oxide compact target for sputtering and process for producing the same
    3.
    发明授权
    Sintered oxide compact target for sputtering and process for producing the same 有权
    用于溅射的烧结氧化物致密靶及其制造方法

    公开(公告)号:US09045823B2

    公开(公告)日:2015-06-02

    申请号:US12864553

    申请日:2009-06-05

    摘要: Provided is a sintered oxide compact target for sputtering comprising indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein the composition ratio of the respective elements satisfies the Formula of InxGayZnzOa {wherein 0.2≦x/(x+y)≦0.8, 0.1≦z/(x+y+z)≦0.5, a=(3/2)x+(3/2)y+z}, and the number of ZnGa2O4 spinel phases having a grain size of 3 μm or larger existing in a 90 μm×90 μm area range of the sintered oxide compact target is 10 or less. With this sintered oxide compact target for sputtering comprising In, Ga, Zn, O and unavoidable impurities, the structure of the sintered compact target is improved, the formation of a phase to become the source of nodules is minimized, and the bulk resistance value is reduced. Whereby provided is a high density IGZO target capable of inhibiting abnormal discharge and which can be used in DC sputtering.

    摘要翻译: 本发明提供一种用于溅射的烧结氧化物致密靶,其包含铟(In),镓(Ga),锌(Zn),氧(O)和不可避免的杂质,其中各元素的组成比满足InxGayZnzOa(其中0.2& ; x /(x + y)≦̸ 0.8,0.1≦̸ z /(x + y + z)≦̸ 0.5,a =(3/2)x +(3/2)y + z} 存在于烧结氧化物成形体靶的90μm×90μm面积范围内的粒径为3μm以上的ZnGa 2 O 4尖晶石相为10以下。 利用这种用于溅射的烧结氧化物致密靶,包括In,Ga,Zn,O和不可避免的杂质,烧结体靶的结构得到改善,成为结核源的相的形成最小化,体电阻值为 减少 由此提供能够抑制异常放电并可用于DC溅射的高密度IGZO靶。

    Gallium oxide/zinc oxide sputtering target, method of forming transparent conductive film and transparent conductive film
    5.
    发明授权
    Gallium oxide/zinc oxide sputtering target, method of forming transparent conductive film and transparent conductive film 有权
    氧化镓/氧化锌溅射靶,形成透明导电膜和透明导电膜的方法

    公开(公告)号:US07674404B2

    公开(公告)日:2010-03-09

    申请号:US12094024

    申请日:2006-11-17

    申请人: Kozo Osada

    发明人: Kozo Osada

    IPC分类号: H01B1/06 B05D5/12

    摘要: Provided is a high-density gallium oxide/zinc oxide sintered sputtering target containing 20 massppm or greater of each zirconium oxide and aluminum oxide, wherein the total content thereof is less than 250 ppm. This gallium oxide (Ga2O3)/zinc oxide (ZnO) sputtering target (GZO target) improves the conductivity and bulk density of the target by adding trace amounts of specific elements. In other words, it is possible to obtain a target capable of increasing the sintered density, inhibiting the formation of nodules, and preventing the generation of abnormal electrical discharge and particles by improving the component composition. Further, provided are a method of forming a transparent conductive film with the use of the target, and a transparent conductive film formed thereby.

    摘要翻译: 提供了含有20质量ppm以上的氧化锆和氧化铝的高密度氧化镓/氧化锌烧结溅射靶,其总含量小于250ppm。 该氧化镓(Ga 2 O 3)/氧化锌(ZnO)溅射靶(GZO靶)通过添加痕量的特定元素来提高靶的导电性和体积密度。 换句话说,可以获得能够提高烧结密度,抑制结节的形成,并且通过改善组分组成来防止产生异常放电和颗粒的目标。 此外,提供了使用靶形成透明导电膜的方法和由此形成的透明导电膜。

    Gallium oxide-zinc oxide sputtering target, method for forming transparent conductive film, and transparent conductive film
    7.
    发明授权
    Gallium oxide-zinc oxide sputtering target, method for forming transparent conductive film, and transparent conductive film 有权
    氧化镓 - 氧化锌溅射靶,透明导电膜的形成方法和透明导电膜

    公开(公告)号:US07682529B2

    公开(公告)日:2010-03-23

    申请号:US11993944

    申请日:2006-06-06

    申请人: Kozo Osada

    发明人: Kozo Osada

    IPC分类号: H01B1/08 B05D5/12

    摘要: Provided is a high density gallium oxide-zinc oxide series sintered body sputtering target for forming a transparent conductive film containing 20 to 2000 mass ppm of zirconium oxide. In a gallium oxide (Ga2O3)-zinc oxide (ZnO) series sputtering target (GZO series target) for forming a transparent conductive film, trace amounts of specific elements are added to obtain a target capable of improving the conductivity and the bulk density of the target; in other words, capable of improving the component composition to increase the sintered density, inhibit the formation of nodules, and prevent the generation of an abnormal electrical discharge and particles. Also provided are a method for forming a transparent conductive film using such a target, and a transparent conductive film formed thereby.

    摘要翻译: 提供一种用于形成含有20〜2000质量ppm的氧化锆的透明导电膜的高密度氧化镓 - 氧化锌系列烧结体溅射靶。 在用于形成透明导电膜的氧化镓(Ga 2 O 3) - 氧化锌(ZnO)系列溅射靶(GZO系列靶)中,加入微量的特定元素以获得能够提高导电性和 目标; 换句话说,能够提高组分组成以提高烧结密度,抑制结节的形成,并且防止产生异常放电和颗粒。 还提供了使用这种靶形成透明导电膜的方法和由此形成的透明导电膜。

    Gallium Oxide-Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film, and Transparent Conductive Film
    8.
    发明申请
    Gallium Oxide-Zinc Oxide Sputtering Target, Method of Forming Transparent Conductive Film, and Transparent Conductive Film 有权
    氧化镓 - 氧化锌溅射靶,形成透明导电膜的方法和透明导电膜

    公开(公告)号:US20090120786A1

    公开(公告)日:2009-05-14

    申请号:US11994025

    申请日:2006-05-30

    申请人: Kozo Osada

    发明人: Kozo Osada

    IPC分类号: C23C14/34

    摘要: Provided is a high density gallium oxide-zinc oxide series sintered body sputtering target for forming a transparent conductive film containing 20 to 500 mass ppm of aluminum oxide, In a gallium oxide (Ga2O3)-zinc oxide (ZnO) series sputtering target (GZO series target) for forming a transparent conductive film, trace amounts of specific elements are added to obtain a target capable of improving the conductivity and the bulk density of the target; in other words, capable of improving the component composition to increase the sintered density, inhibit the formation of nodules, and prevent the generation of an abnormal electrical discharge and particles. Also provided are a method for forming a transparent conductive film using such a target, and a transparent conductive film formed thereby.

    摘要翻译: 提供一种高密度氧化镓 - 氧化锌系列烧结体溅射靶,用于形成含有20〜500质量ppm的氧化铝的透明导电膜。在氧化镓(Ga 2 O 3) - 氧化锌(ZnO)系列溅射靶(GZO系列 靶)用于形成透明导电膜,添加微量的特定元素以获得能够改善靶的导电性和堆积密度的靶; 换句话说,能够提高组分组成以提高烧结密度,抑制结节的形成,并且防止产生异常放电和颗粒。 还提供了使用这种靶形成透明导电膜的方法和由此形成的透明导电膜。