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公开(公告)号：US20110214807A1
公开(公告)日：2011-09-08
申请号：US13067135
申请日：2011-05-11
申请人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
发明人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
IPC分类号： B32B38/18
CPC分类号： G02F1/1333 , B32B37/0015 , B32B38/18 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
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公开(公告)号：US07963308B2
公开(公告)日：2011-06-21
申请号：US11580908
申请日：2006-10-16
申请人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
发明人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
IPC分类号： B32B37/10
CPC分类号： G02F1/1333 , B32B37/0015 , B32B38/18 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
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公开(公告)号：US20110011541A1
公开(公告)日：2011-01-20
申请号：US12923575
申请日：2010-09-28
申请人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
发明人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
IPC分类号： B32B37/00
CPC分类号： G02F1/1333 , B32B37/0015 , B32B38/18 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
摘要翻译： 一种键合衬底制造装置，其能够减少制造的不良接合衬底。 传送机器人吸收基板的底面的外缘区域，并向基板的底面喷出气体，将基板保持在压机的真空处理室内，同时保持基板水平。 压板通过吸力保持由传送机器人保持的基板。
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公开(公告)号：US07597774B2
公开(公告)日：2009-10-06
申请号：US11254744
申请日：2005-10-21
申请人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
发明人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
IPC分类号： B29C65/00
CPC分类号： G02F1/1333 , B32B37/0015 , B32B38/18 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
摘要翻译： 一种键合衬底制造装置，其能够减少制造的不良接合衬底。 传送机器人吸收基板的底面的外缘区域，并向基板的底面喷出气体，将基板保持在压机的真空处理室内，同时保持基板水平。 压板通过吸力保持由传送机器人保持的基板。
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公开(公告)号：US20060201424A1
公开(公告)日：2006-09-14
申请号：US11418779
申请日：2006-05-05
CPC分类号： G02F1/1339 , B32B37/12 , B32B37/18 , B32B38/1841 , B32B2037/1253 , B32B2038/1891 , B32B2310/0806 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , Y10T29/49776 , Y10T156/1089 , Y10T156/1092 , Y10T156/17 , Y10T156/1798
摘要： The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
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公开(公告)号：US20060037707A1
公开(公告)日：2006-02-23
申请号：US11254741
申请日：2005-10-21
申请人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
发明人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
IPC分类号： B32B37/00
CPC分类号： G02F1/1333 , B32B37/0015 , B32B38/18 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
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公开(公告)号：US20060027318A1
公开(公告)日：2006-02-09
申请号：US11248741
申请日：2005-10-12
CPC分类号： G02F1/1339 , B32B37/12 , B32B37/18 , B32B38/1841 , B32B2037/1253 , B32B2038/1891 , B32B2310/0806 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , Y10T29/49776 , Y10T156/1089 , Y10T156/1092 , Y10T156/17 , Y10T156/1798
摘要： The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
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公开(公告)号：US20110011514A1
公开(公告)日：2011-01-20
申请号：US12883798
申请日：2010-09-16
CPC分类号： G02F1/1339 , B32B37/12 , B32B37/18 , B32B38/1841 , B32B2037/1253 , B32B2038/1891 , B32B2310/0806 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , Y10T29/49776 , Y10T156/1089 , Y10T156/1092 , Y10T156/17 , Y10T156/1798
摘要： The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.
摘要翻译： 本发明提供一种抑制键合衬底的缺陷的接合衬底的制造装置。 当真空室中的压力处于大气压时，上下夹盘单元分别通过真空吸附基板。 当真空室被减压时，每个卡盘单元静电吸引相关联的基底。 在真空室的减压期间，将每个基板吸引到相关卡盘单元的压力被控制为等于真空室中的压力。 这防止每个基板相对于相关联的卡盘单元掉落或移动。 因此，第一和第二基底被精确对准地结合在一起。
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公开(公告)号：US07704348B2
公开(公告)日：2010-04-27
申请号：US11254712
申请日：2005-10-21
申请人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
发明人： Takanori Muramoto , Takuya Ohno , Tsukasa Adachi , Koji Hashizume , Yosimasa Miyajima , Takao Kojima
IPC分类号： B32B37/00
CPC分类号： G02F1/1333 , B32B37/0015 , B32B38/18 , B32B38/1858 , B32B2038/1891 , B32B2309/68 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , H01L21/67092 , Y10T156/10 , Y10T156/1744
摘要： A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
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公开(公告)号：US07681522B2
公开(公告)日：2010-03-23
申请号：US11418779
申请日：2006-05-05
IPC分类号： B05C11/10
CPC分类号： G02F1/1339 , B32B37/12 , B32B37/18 , B32B38/1841 , B32B2037/1253 , B32B2038/1891 , B32B2310/0806 , B32B2457/20 , B32B2457/202 , G02F1/1341 , G02F2001/133354 , G02F2001/13415 , Y10T29/49776 , Y10T156/1089 , Y10T156/1092 , Y10T156/17 , Y10T156/1798
摘要： The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.
摘要翻译： 本发明提供一种抑制键合衬底的缺陷的接合衬底的制造装置。 当真空室中的压力处于大气压时，上下夹盘单元分别通过真空吸附基板。 当真空室被减压时，每个卡盘单元静电吸引相关联的基底。 在真空室的减压期间，将每个基板吸引到相关卡盘单元的压力被控制为等于真空室中的压力。 这防止每个基板相对于相关联的卡盘单元掉落或移动。 因此，第一和第二基底结合在一起并精确对准。
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