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1.发明申请Method of interconnecting terminals and method for mounting semiconductor device 有权端子互连方法及半导体器件的安装方法公开(公告)号：US20070001313A1
公开(公告)日：2007-01-04
申请号：US10544234
申请日：2004-02-04
申请人： Kozo Fujimoto , Kiyokazu Yasuda , Jong-Min Kim
发明人： Kozo Fujimoto , Kiyokazu Yasuda , Jong-Min Kim
CPC分类号： H01L24/29 , H01L24/11 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1329 , H01L2224/133 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29314 , H01L2224/29316 , H01L2224/29318 , H01L2224/29339 , H01L2224/29347 , H01L2224/73204 , H01L2224/818 , H01L2224/83136 , H01L2224/8319 , H01L2224/83886 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H05K3/321 , H05K2201/10674 , H05K2203/0425 , H01L2924/00 , H01L2924/01083 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.
摘要翻译： 提供了一种互连端子的方法，以便在诸如相对电极的端子之间获得优异的电连接以及使用该连接方法的半导体器件的安装方法。 半导体芯片20的电极焊盘21和设置在基板10上以与电极焊盘21对应的焊盘11以彼此之间的导电粘合剂彼此相对地放置。 然后，将导电性粘接剂加热到高于导电性粘接剂中所含的导电性粒子的熔点，树脂未完全固化的温度，导电性粒子彼此接合。 然后，通过使导电粘合剂中的树脂完全固化来固定半导体芯片20和基板10。
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2.发明授权Method of interconnecting terminals and method of mounting semiconductor devices 有权端子互连方法和半导体器件的安装方法公开(公告)号：US07524748B2
公开(公告)日：2009-04-28
申请号：US10544234
申请日：2004-02-04
申请人： Kozo Fujimoto , Kiyokazu Yasuda , Jong-Min Kim
发明人： Kozo Fujimoto , Kiyokazu Yasuda , Jong-Min Kim
IPC分类号： H01L21/44
CPC分类号： H01L24/29 , H01L24/11 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1329 , H01L2224/133 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29314 , H01L2224/29316 , H01L2224/29318 , H01L2224/29339 , H01L2224/29347 , H01L2224/73204 , H01L2224/818 , H01L2224/83136 , H01L2224/8319 , H01L2224/83886 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01064 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H05K3/321 , H05K2201/10674 , H05K2203/0425 , H01L2924/00 , H01L2924/01083 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.
摘要翻译： 提供了一种互连端子的方法，以便在诸如相对电极的端子之间获得优异的电连接以及使用该连接方法的半导体器件的安装方法。 半导体芯片20的电极焊盘21和设置在基板10上以与电极焊盘21对应的焊盘11以彼此之间的导电粘合剂彼此相对地放置。 然后，将导电性粘接剂加热到高于导电性粘接剂中所含的导电性粒子的熔点，树脂未完全固化的温度，导电性粒子彼此接合。 然后，通过使导电粘合剂中的树脂完全固化来固定半导体芯片20和基板10。
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