摘要:
There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the first and second surfaces via the insulating layer; and a via formed in the through hole and electrically connected to the wiring patterns. The via includes: a conductor ball and a conductor portion. The conductor ball has a conductive surface and an insulating member covering the conductive surface. A portion of the conductive surface is exposed from the insulating member. The conductor portion is electrically connected to the exposed conductive surface and the wiring patterns. At least one of the insulating member and the insulating layer is interposed between the via and the core substrate.
摘要:
Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.
摘要:
Optical apparatuses providing optical interconnections among a plurality N of electronic components. One exemplary apparatus comprises a slab waveguide having a core layer that enables light beams to propagate in a plurality of directions, a plurality of N reception ports, and a plurality of N transmission ports, each reception port and each transmission port serving a respective electronic component, and each being optically coupled to the core layer of the slab waveguide. Each transmission port is configured to receive a plurality of light beams from its assigned electronic component and to transmit each received light beam onto the slab waveguide in a direction toward a reception port. Each reception port is configured to receive from the slab waveguide a plurality of light beams transmitted to it from at least two different transmission ports. Light beams within the slab waveguide are permitted to cross paths. Other exemplary embodiments are disclosed.
摘要:
Optical backplanes providing integrated optical couplers to external optical fibers are disclosed, along with methods for making the same. An exemplary optical backplane has a first cladding layer disposed over the top surface of a substrate, and at least a first core body disposed over the first cladding layer, with the first core body having a first end and a second end. A material layer is disposed above the first cladding layer and the first end of the first core body, with the material layer having a top surface and a bottom surface. A focusing element is formed at the top surface of the material layer, with the focusing element being located above the first end of the first core body.
摘要:
Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要:
A flexible optical connector suitable for use in an optical backplane for interconnecting optical circuit boards, and methods of making the optical connector, are disclosed. The flexible optical connector comprises a plurality of waveguides on two or more levels providing a plurality of light paths that allow light communication between optical circuit boards. The optical connector can be manufactured separately from the backplane and thereafter mounted on the backplane. The backplane of the present invention may also have a mounting structure for removably retaining and positioning optical circuit board and may, optionally, include electrical traces for providing electrical interconnections between the circuit boards.
摘要:
A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
摘要:
The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C. or lower on a substrate, and to said polyamic acid, a polyimide film having excellent film properties, and a pattern forming process using the photosensitive polyimide resin composition.
摘要:
Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.