发明授权
- 专利标题: Photosensitive polyimide resin composition
- 专利标题(中): 感光聚酰亚胺树脂组合物
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申请号: US527057申请日: 1995-09-12
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公开(公告)号: US5777068A公开(公告)日: 1998-07-07
- 发明人: Akira Tanaka , Satoshi Tazaki , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
- 申请人: Akira Tanaka , Satoshi Tazaki , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
- 申请人地址: JPX Tokyo JPX Kanagawa
- 专利权人: Nippon Zeon Co., Ltd.,Fujitsu Limited
- 当前专利权人: Nippon Zeon Co., Ltd.,Fujitsu Limited
- 当前专利权人地址: JPX Tokyo JPX Kanagawa
- 优先权: JPX6-247109 19940913; JPX6-256222 19940926
- 主分类号: G03F7/037
- IPC分类号: G03F7/037 ; C08G73/10 ; C08G69/26
摘要:
Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.
公开/授权文献
- US5025424A Shock wave scoring apparatus employing curved rod sensors 公开/授权日:1991-06-18
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